EP1K50FI256-2N

The EP1K50FI256-2N is an ACEX-1K family FPGA delivering a balance of programmable logic, embedded memory and I/O capacity in a 256‑FBGA package. It combines a logic array with embedded array blocks (EABs) to support system-on-a-programmable-chip (SOPC) integration for communications, industrial control and general-purpose digital designs.

With 2,880 logic elements, approximately 40,960 bits of on-chip RAM and 186 user I/O pins, this device targets applications that require mid-density logic, flexible I/O, and industrial operating range with surface-mount packaging.

Key Features

• Core Logic 2,880 logic elements (LEs) and architecture-level support for dedicated carry and cascade chains to accelerate arithmetic and high‑fan‑in functions.
• Embedded Memory Approximately 40,960 bits of total RAM provided by embedded array blocks (EABs) for dual‑port and memory‑intensive megafunctions; the EP1K50 device includes 10 EABs according to the ACEX‑1K family data.
• I/O and Interfaces 186 user I/O pins with individual tri‑state enable, open‑drain option, programmable slew-rate control, and clamp‑to‑VCCIO options to support mixed‑voltage interfacing.
• Package & Mounting 256‑FBGA (17×17) package, surface mount, optimized for compact board designs.
• Power Operates with a 2.5 V internal supply; specified core voltage supply range of 2.375 V to 2.625 V.
• Temperature & Reliability Industrial operating temperature range from −40 °C to 85 °C and RoHS compliant construction.
• System-Level and Architecture Features In-circuit reconfigurability, JTAG boundary-scan support (IEEE 1149.1), FastTrack interconnect, low-skew clock distribution, and options such as ClockLock and ClockBoost for clock management.

Typical Applications

• Communications & Networking Implement protocol bridging, data formatting and mid‑density packet processing where on‑chip RAM and flexible I/O help integrate multiple functions on a single device.
• Industrial Control Use for motor control logic, sensor aggregation and deterministic I/O handling within the specified industrial temperature range.
• Embedded System Integration (SOPC) Combine logic, embedded memory and peripheral interfaces to consolidate functions typically handled by multiple discrete components.
• Prototyping and Low‑to‑Mid Volume Production Reconfigurable logic and JTAG programmability make the device suitable for iterative development and deployment of custom digital functions.

Unique Advantages

• Balanced Logic and Memory: 2,880 logic elements paired with ~40,960 bits of embedded RAM enable efficient implementation of control logic plus local buffering without external memory.
• Flexible I/O Support: 186 I/O pins with per‑pin options (tri‑state, open‑drain, slew control) simplify mixed‑voltage interfacing and board-level signal conditioning.
• Industrial Temperature Range: Rated for −40 °C to 85 °C, supporting deployment in industrial environments.
• Compact, Surface‑Mount Package: 256‑FBGA (17×17) reduces PCB footprint while providing a high pin count for connectivity.
• Design and Testability: Built‑in JTAG boundary scan and in‑circuit reconfigurability streamline development, programming and board test.

Why Choose EP1K50FI256-2N?

The EP1K50FI256-2N positions itself as a mid-density, industrial‑grade FPGA that consolidates logic, embedded memory and flexible I/O in a compact 256‑FBGA package. It is suited to designers who need a programmable device with on‑chip RAM, robust I/O options and industrial temperature capability for communications, control and embedded SOPC applications.

Choosing this device offers a straightforward path to reduce BOM count, simplify board routing with a fine‑pitch BGA, and leverage architecture features such as dedicated carry/cascade chains and low‑skew clocking for predictable design behavior.

Request a quote or submit an inquiry for pricing and availability for the EP1K50FI256-2N to evaluate fit for your next design.