EP1K50FC256-3N

IC FPGA 186 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 40960 2880 256-BGA

Quantity 1,852 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O186Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50FC256-3N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 40960 2880 256-BGA

The EP1K50FC256-3N is an ACEX-1K family programmable logic device providing a compact, reconfigurable FPGA targeted for commercial designs. It combines a logic array with embedded memory resources and flexible I/O to support system-on-programmable-chip integration and a variety of FPGA-based functions.

With 2,880 logic elements and approximately 40,960 bits of embedded memory, this device is suited for applications that need moderate logic density, on-chip RAM, and a high-pin-count BGA package for compact board layouts.

Key Features

  • Logic Capacity — 2,880 logic elements and up to 199,000 maximum system gates provide room for mid-range combinational and sequential logic implementations.
  • Embedded Memory — Approximately 40,960 bits of on-chip RAM (EABs available in the ACEX‑1K family) to support data buffering, small LUT tables, and dual-port memory functions.
  • I/O Density and Flexibility — 186 user I/Os with MultiVolt I/O family capability for interfacing to a range of voltage domains; individual pin options for output enable and slew-rate control are supported by the ACEX‑1K family.
  • Package and Mounting — 256-ball Fine-pitch BGA (256-FBGA, 17×17) in a 256-BGA package case, designed for surface-mount PCB assembly with a compact footprint.
  • Power — Operates with a core supply in the range of 2.375 V to 2.625 V; device I/O options support multiple voltage domains as provided by the ACEX‑1K architecture.
  • Commercial Temperature Grade — Rated for 0 °C to 70 °C operation, suitable for commercial electronics environments.
  • Test and Configuration Support — Family-level features include JTAG boundary-scan for in-circuit testability and support for in-circuit reconfigurability mechanisms.
  • RoHS Compliant — The device is RoHS compliant.

Typical Applications

  • Communications Equipment — Use for protocol handling, data buffering, and glue logic in mid-range communications systems where on-chip RAM and reconfigurable logic simplify implementation.
  • Embedded System Integration — Implement SOPC-style integration of custom logic and memory functions for commercial embedded products.
  • Consumer and Commercial Electronics — Mid-density FPGA functions such as peripheral control, interface bridging, and custom logic in compact BGA packages for space-constrained boards.
  • Prototyping and Development — Reconfigurable logic and JTAG support make the device useful for iterative hardware development and validation in commercial designs.

Unique Advantages

  • Balanced Logic and Memory — 2,880 logic elements paired with approximately 40,960 bits of embedded RAM allow integration of control logic and local data storage on a single device, reducing external component count.
  • High I/O Count in a Compact Package — 186 user I/Os in a 256-FBGA (17×17) package enable dense signal routing while keeping board footprint small.
  • Flexible Power and I/O Options — Core supply range of 2.375–2.625 V and family-level MultiVolt I/O support make the device adaptable to mixed-voltage systems.
  • Commercial Temperature Rating — Designed for 0 °C to 70 °C environments commonly encountered in commercial electronics applications.
  • Design-for-Test and Reconfiguration — JTAG boundary-scan and in-circuit reconfigurability facilitate testing, programming, and iterative design changes without additional hardware.
  • Regulatory Compliance — RoHS compliance supports environmental and manufacturing requirements for lead-free designs.

Why Choose EP1K50FC256-3N?

The EP1K50FC256-3N delivers a practical balance of logic resources, embedded memory, and high I/O count in a compact 256-FBGA package targeted at commercial applications. It is well suited to designers who need a reconfigurable device that integrates moderate logic and RAM capacity while supporting flexible I/O voltages and standard board assembly methods.

For projects requiring mid-range FPGA capability with family-provided features like JTAG testability and in-circuit reconfiguration, the EP1K50FC256-3N offers a verified, RoHS-compliant option that fits compact PCB designs and commercial product environments.

Request a quote or submit a procurement inquiry to check availability, pricing, and lead times for the EP1K50FC256-3N for your next design.

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