EP1K50FC256-3N
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 40960 2880 256-BGA |
|---|---|
| Quantity | 1,852 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 186 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 360 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 199000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of EP1K50FC256-3N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 40960 2880 256-BGA
The EP1K50FC256-3N is an ACEX-1K family programmable logic device providing a compact, reconfigurable FPGA targeted for commercial designs. It combines a logic array with embedded memory resources and flexible I/O to support system-on-programmable-chip integration and a variety of FPGA-based functions.
With 2,880 logic elements and approximately 40,960 bits of embedded memory, this device is suited for applications that need moderate logic density, on-chip RAM, and a high-pin-count BGA package for compact board layouts.
Key Features
- Logic Capacity — 2,880 logic elements and up to 199,000 maximum system gates provide room for mid-range combinational and sequential logic implementations.
- Embedded Memory — Approximately 40,960 bits of on-chip RAM (EABs available in the ACEX‑1K family) to support data buffering, small LUT tables, and dual-port memory functions.
- I/O Density and Flexibility — 186 user I/Os with MultiVolt I/O family capability for interfacing to a range of voltage domains; individual pin options for output enable and slew-rate control are supported by the ACEX‑1K family.
- Package and Mounting — 256-ball Fine-pitch BGA (256-FBGA, 17×17) in a 256-BGA package case, designed for surface-mount PCB assembly with a compact footprint.
- Power — Operates with a core supply in the range of 2.375 V to 2.625 V; device I/O options support multiple voltage domains as provided by the ACEX‑1K architecture.
- Commercial Temperature Grade — Rated for 0 °C to 70 °C operation, suitable for commercial electronics environments.
- Test and Configuration Support — Family-level features include JTAG boundary-scan for in-circuit testability and support for in-circuit reconfigurability mechanisms.
- RoHS Compliant — The device is RoHS compliant.
Typical Applications
- Communications Equipment — Use for protocol handling, data buffering, and glue logic in mid-range communications systems where on-chip RAM and reconfigurable logic simplify implementation.
- Embedded System Integration — Implement SOPC-style integration of custom logic and memory functions for commercial embedded products.
- Consumer and Commercial Electronics — Mid-density FPGA functions such as peripheral control, interface bridging, and custom logic in compact BGA packages for space-constrained boards.
- Prototyping and Development — Reconfigurable logic and JTAG support make the device useful for iterative hardware development and validation in commercial designs.
Unique Advantages
- Balanced Logic and Memory — 2,880 logic elements paired with approximately 40,960 bits of embedded RAM allow integration of control logic and local data storage on a single device, reducing external component count.
- High I/O Count in a Compact Package — 186 user I/Os in a 256-FBGA (17×17) package enable dense signal routing while keeping board footprint small.
- Flexible Power and I/O Options — Core supply range of 2.375–2.625 V and family-level MultiVolt I/O support make the device adaptable to mixed-voltage systems.
- Commercial Temperature Rating — Designed for 0 °C to 70 °C environments commonly encountered in commercial electronics applications.
- Design-for-Test and Reconfiguration — JTAG boundary-scan and in-circuit reconfigurability facilitate testing, programming, and iterative design changes without additional hardware.
- Regulatory Compliance — RoHS compliance supports environmental and manufacturing requirements for lead-free designs.
Why Choose EP1K50FC256-3N?
The EP1K50FC256-3N delivers a practical balance of logic resources, embedded memory, and high I/O count in a compact 256-FBGA package targeted at commercial applications. It is well suited to designers who need a reconfigurable device that integrates moderate logic and RAM capacity while supporting flexible I/O voltages and standard board assembly methods.
For projects requiring mid-range FPGA capability with family-provided features like JTAG testability and in-circuit reconfiguration, the EP1K50FC256-3N offers a verified, RoHS-compliant option that fits compact PCB designs and commercial product environments.
Request a quote or submit a procurement inquiry to check availability, pricing, and lead times for the EP1K50FC256-3N for your next design.

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