EP1K50FC256-3

The EP1K50FC256-3 is an ACEX-1K family FPGA IC designed for low-cost system-on-a-programmable-chip (SOPC) integration and medium-density logic implementation. This device combines 2,880 logic elements, approximately 40.96 kbits of embedded RAM, and a rich I/O complement to address communications, control, and embedded memory-centric functions.

Built on the ACEX‑1K architecture, the device provides dedicated embedded array blocks, flexible interconnect and clock resources, and in-circuit reconfigurability to support rapid development and deployment in commercial-temperature applications.

Key Features

• Logic Capacity  2,880 logic elements and approximately 199,000 maximum system gates provide capacity for medium-complexity designs.
• Embedded Memory (EABs)  Ten embedded array blocks (EABs) delivering approximately 40,960 bits of RAM; EABs support dual-port operation and up to 16-bit width per block for efficient on-chip data buffering and megafunction implementation.
• I/O and Voltage  186 user I/O pins with MultiVolt support that can interface with 2.5‑V, 3.3‑V, or 5.0‑V devices; device requires a supply in the 2.375–2.625 V range and operates with a 2.5‑V internal supply.
• Package and Mounting  256‑pin FineLine BGA (256‑FBGA, 17×17) package, surface-mount mounting for compact board layouts.
• Clocking and Performance Options  Built-in low-skew clock distribution trees, options such as ClockLock™ and ClockBoost™ for reduced clock delay or clock multiplication, and up to six global clock signals plus four global clear signals.
• Dedicated Arithmetic and Logic Paths  Dedicated carry and cascade chains accelerate adders, counters and high-fan-in logic functions, improving performance for arithmetic-intensive paths.
• Flexible Interconnect  FastTrack® continuous routing structure for predictable interconnect delays and predictable timing behavior across designs.
• In-System Configurability and Test  In-circuit reconfigurability (ICR) via external configuration devices or the JTAG port, with JTAG boundary-scan test (IEEE 1149.1) available without consuming device logic.
• I/O Controls  Per-pin tri-state output enable, open-drain option, programmable slew-rate control, and clamp-to-VCCIO selection for signal integrity and interfacing flexibility.
• Commercial Temperature Grade & RoHS  Rated for 0 °C to 70 °C operating temperature and RoHS compliant.

Typical Applications

• Communications and Networking  On-chip memory blocks and dedicated arithmetic chains make this device suitable for protocol processing, buffering, and moderate-speed packet handling.
• Embedded Control and SOPC Integration  Use the ACEX-1K device to implement integrated control logic, glue logic, and megafunctions where embedded RAM and reconfigurability simplify board-level BOM.
• Interface Bridging and Glue Logic  MultiVolt I/O and comprehensive per-pin controls enable interfacing between mixed-voltage domains and custom peripheral logic.
• Prototyping and Medium-Complexity Designs  The combination of 2,880 logic elements and ten EABs supports rapid prototyping and development of medium-complexity FPGA-based systems.

Unique Advantages

• Balanced Logic and Memory  Approximately 2,880 logic elements paired with ~40.96 kbits of embedded RAM provides a practical balance for designs that need both logic density and on-chip storage.
• Flexible Voltage Interfacing  MultiVolt I/O capability and per-pin I/O controls reduce the need for external level translators and simplify mixed-voltage board designs.
• Compact Package  256‑FBGA (17×17) footprint supports dense board layouts while providing a wide I/O count for complex interconnect requirements.
• Design and Test Support  JTAG boundary-scan and in-circuit reconfigurability streamline manufacturing test and field updates without consuming user logic.
• Deterministic Routing and Arithmetic Acceleration  FastTrack interconnect and dedicated carry/cascade chains help achieve predictable timing and efficient arithmetic implementations.

Why Choose EP1K50FC256-3?

The EP1K50FC256-3 positions itself as a medium-density ACEX‑1K FPGA that combines a practical mix of logic elements, embedded RAM, flexible I/O and compact packaging for commercial-temperature applications. It is well suited to designers who need SOPC integration, on-chip memory for megafunctions, and in-system configurability within a cost-conscious FPGA solution.

With family-level features such as dual-port EABs, FastTrack interconnect, dedicated arithmetic chains, and JTAG-based testability, this device offers a reliable platform for prototyping, embedded control, communications glue logic, and other moderate-complexity FPGA applications.

Request a quote or submit a sales inquiry to receive pricing and availability for EP1K50FC256-3 and to discuss volume, lead time, and support options specific to your project needs.