EP1K50FC256-2

The EP1K50FC256-2 is an ACEX-1K family FPGA designed for compact, cost-sensitive system integration. It pairs a logic array with embedded memory resources to implement control, glue-logic, and on-chip memory functions within a single surface-mount device.

Key use cases include communications and general-purpose embedded logic where a balance of gate density, on-chip RAM, and flexible I/O is required. The device delivers 2,880 logic elements, approximately 40.96 Kbits of embedded RAM, and 186 user I/O in a 256-ball fine-pitch BGA package.

Key Features

• Core Logic — 2,880 logic elements providing a programmable logic fabric for combinational and sequential functions; supports up to 199,000 system gates as specified for this device level.
• Embedded Memory — Approximately 40,960 total RAM bits for on-chip data storage and dual-port memory implementations using the family’s embedded array blocks.
• I/O Flexibility — 186 user I/O pins in a 256-FBGA (17×17) package, enabling a wide range of peripheral interfacing and board-level routing options.
• Package and Mounting — 256-ball FineLine BGA (surface mount) in a 17×17 mm footprint suitable for dense PCB layouts.
• Power and Supply — Device specified for a supply range of 2.375 V to 2.625 V and operates with a 2.5-V internal supply per ACEX-1K family design.
• Operating Range and Compliance — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS-compliant status.
• Built-in Test and Reconfiguration — Family-level features include JTAG boundary-scan support for in-system test and in-circuit reconfigurability (ICR) via external configuration devices or JTAG.

Typical Applications

• Communications Interfaces — Implement protocol glue logic, data buffering, and control functions using embedded memory and flexible I/O to support edge and mid-range communications equipment.
• SOPC and System Integration — Combine combinatorial logic and embedded RAM to consolidate multiple discrete components into a single programmable device for space- and cost-constrained systems.
• Control and Glue Logic — Replace CPLDs or small microcontroller-based glue logic with a reprogrammable FPGA fabric for board-level control, timing, and signal routing.

Unique Advantages

• Balanced Integration: Combines substantial on-chip RAM (≈40.96 Kbits) with 2,880 logic elements to reduce external memory and component count.
• High I/O Count in a Compact Package: 186 user I/O in a 256-FBGA (17×17) enables dense board routing while preserving flexible peripheral connectivity.
• Surface-Mount BGA Form Factor: FineLine BGA package supports automated assembly and compact PCB designs for volume manufacturing.
• Design for Cost-Sensitive Applications: Commercial-grade temperature range and RoHS compliance make the device suitable for mainstream embedded and communications products.
• Testability and Reconfiguration: JTAG boundary-scan and in-circuit reconfigurability simplify production test and field updates without additional logic overhead.

Why Choose EP1K50FC256-2?

The EP1K50FC256-2 brings a balanced set of resources—2,880 logic elements, approximately 40.96 Kbits of embedded RAM, and 186 user I/O—into a compact 256-FBGA package. It is positioned for designers who need a programmable, integrated solution to reduce board-level complexity and parts count while maintaining flexible I/O and on-chip memory.

This device is well suited for teams developing mid-density FPGA designs in communications, embedded control, and system-in-package applications that prioritize integration, testability, and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to get pricing and availability for EP1K50FC256-2 and to discuss how this ACEX-1K device can fit into your next design cycle.