EP20K160ETC144-3

IC FPGA 88 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 88 81920 6400 144-LQFP

Quantity 440 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O88Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of EP20K160ETC144-3 – APEX-20KE FPGA, 6,400 logic elements, 144-LQFP

The EP20K160ETC144-3 is an APEX-20KE family field programmable gate array (FPGA) offered by Intel. It combines a MultiCore architecture that integrates look-up table (LUT) logic and embedded system blocks (ESBs) to support register-heavy and memory-intensive functions.

Designed for commercial embedded applications, this device targets SOPC-style integration, memory interface controllers, and high-performance I/O tasks where on-chip memory, flexible clocking and a compact 144-LQFP package are important.

Key Features

  • Core Logic  6,400 logic elements and approximately 404,000 system gates provide mid-range programmable logic capacity for control, glue logic and datapath functions.
  • Embedded Memory  Approximately 81,920 bits of on-chip RAM implemented in ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) use.
  • I/O Capacity and Flexibility  88 user I/O pins with MultiVolt I/O interface support (family-level) enabling interoperable signaling with 1.8 V, 2.5 V, 3.3 V and 5.0 V domains.
  • Advanced Clock Management  Family-level support for up to four phase-locked loops (PLLs), up to eight global clocks, and ClockLock/ClockBoost/ClockShift features for programmable clock multiplication, division and phase shifting.
  • High-speed I/O Options (family capability)  Support for DDR SDRAM and ZBT SRAM interfaces and LVDS signaling capability (family-level LVDS performance up to 840 Mbits per channel).
  • Power and Supply  Internal supply requirement specified at 1.71 V to 1.89 V for this device; family-level low-power design and programmable ESB power-saving modes.
  • Package and Mounting  144-LQFP (144-TQFP, 20 × 20) surface-mount package for compact PCB integration.
  • Operating Range and Compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant status.

Typical Applications

  • PCI and Peripheral Interface Logic  Implements bus bridging and custom peripheral interfaces leveraging family-level PCI compliance for 3.3-V operation and high-speed I/O.
  • Memory Interface Controllers  Acts as a controller or glue logic for DDR SDRAM and ZBT SRAM systems using embedded memory and high-speed I/O support.
  • Embedded System Integration (SOPC)  Uses ESBs for on-chip FIFOs, dual-port RAM and CAMs to build system-on-a-programmable-chip elements and custom processing blocks.
  • Clock- and Timing-Sensitive Designs  Employs on-chip PLLs and clock management features for applications requiring phase control, clock multiplication/division and reduced skew.

Unique Advantages

  • Balanced Logic Density: 6,400 logic elements provide a mid-range capacity that supports complex control and datapath designs without excessive PCB footprint.
  • On-Chip Memory Integration: Approximately 81,920 bits of embedded memory in ESBs enable efficient implementation of FIFOs, buffers and dual-port RAM without external components.
  • Flexible I/O: 88 user I/O pins with MultiVolt family-level support allow direct interfacing to multiple voltage domains and external memory devices.
  • Robust Clocking: Family-level PLLs, global clock resources and ClockLock/ClockBoost features permit precise clock management for timing-critical systems.
  • Compact, Surface-Mount Package: 144-LQFP (20 × 20) surface-mount package facilitates space-constrained board designs while maintaining accessible I/O.
  • Commercial-Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and conformant with RoHS requirements for standard commercial applications.

Why Choose EP20K160ETC144-3?

The EP20K160ETC144-3 combines the APEX-20KE family architecture with a practical mix of logic capacity, embedded memory and I/O flexibility in a compact 144-LQFP package. Its Commercial grade and RoHS compliance make it suitable for a wide range of embedded designs that require integrated memory blocks, configurable clocking and MultiVolt I/O interoperability.

This device is appropriate for engineers building SOPC elements, memory interface controllers, PCI/board-level interfaces and other mid-range FPGA applications where a balance of logic elements, on-chip RAM and advanced clocking features is required.

Request a quote or submit a purchase inquiry to evaluate EP20K160ETC144-3 for your next commercial embedded design project.

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