EP20K160ETC144-3N
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 88 81920 6400 144-LQFP |
|---|---|
| Quantity | 1,144 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 88 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 640 | Number of Logic Elements/Cells | 6400 | ||
| Number of Gates | 404000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of EP20K160ETC144-3N – APEX-20KE FPGA, 6,400 logic elements, 144-LQFP
The EP20K160ETC144-3N is an APEX-20KE field programmable gate array (FPGA) in a 144-LQFP package. Built on the APEX 20K family architecture, it combines lookup-table (LUT) logic with embedded system blocks (ESBs) to support register‑intensive and memory‑centric functions.
With 6,400 logic elements, approximately 81,920 bits of on‑chip RAM and 88 user I/O pins, this device targets applications that require moderate logic density, embedded memory, and flexible I/O in a commercial‑grade, surface‑mount package.
Key Features
- Core Architecture MultiCore architecture using LUT logic and product‑term logic for register‑intensive and combinatorial functions.
- Logic Capacity 6,400 logic elements and approximately 404,000 system gates provide moderate-density programmable logic for complex control and interfacing tasks.
- Embedded Memory Approximately 81,920 total RAM bits implemented via ESBs, suitable for FIFOs, dual‑port RAM and CAM functions.
- I/O and Interface Support 88 user I/O pins with MultiVolt I/O interface capability and programmable output features to accommodate mixed‑voltage systems.
- Clocking and Timing Flexible clock management including multiple PLLs and global clock resources for deterministic clock distribution (family feature).
- Power and Voltage Narrow internal voltage supply range specified at 1.71 V to 1.89 V and family support for low‑power operation modes.
- Package and Mounting 144‑LQFP (supplier package: 144‑TQFP 20×20) surface‑mount package for standard PCB assembly flows.
- Commercial Temperature Grade Operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Embedded Systems Implement SOPC-style integration where combined logic and embedded memory enable compact, programmable system functions.
- Interface and Protocol Bridging Use configurable I/O and MultiVolt support to bridge between different voltage domains and implement custom interface logic.
- Buffered Data Paths Leverage ESB memory for FIFOs and dual‑port RAM in buffering, queuing, and packet‑handling roles.
- Prototyping and Design Integration Moderate logic density and accessible package make this device suitable for prototyping and integrating custom peripherals.
Unique Advantages
- Balanced Logic and Memory: 6,400 logic elements combined with approximately 81,920 bits of embedded RAM deliver a strong mix of logic and storage without external RAM dependency.
- Embedded System Blocks (ESBs): ESBs support FIFOs, dual‑port RAM and CAM implementations, reducing the need for discrete memory components.
- Flexible I/O: 88 user I/O pins with MultiVolt capability and programmable output controls simplify integration with mixed‑voltage peripherals.
- Deterministic Clocking: Integrated clock management features (PLLs and global clocks) enable precise timing control for synchronous designs.
- Compact Surface‑Mount Package: 144‑LQFP footprint supports standard PCB assembly while providing a high pin count for I/O‑rich applications.
- Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.
Why Choose EP20K160ETC144-3N?
The EP20K160ETC144-3N offers a pragmatic combination of programmable logic, embedded memory, and flexible I/O in a compact 144‑LQFP package. Its APEX‑20KE family architecture and ESBs make it well suited to designs that require integrated memory functions, deterministic clocking and mixed‑voltage interfacing within a commercial temperature range.
This device is a fit for engineering teams building medium‑complexity programmable systems, embedded controllers, and interface logic where on‑chip RAM and configurable I/O reduce board-level component count and simplify system design.
Request a quote or submit a quote through your preferred procurement channel to check availability and pricing for the EP20K160ETC144-3N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018