EP2A25F672C9

The EP2A25F672C9 is an Altera APEX II field programmable gate array (FPGA) in a 672-ball BGA package. It provides programmable logic, embedded memory, and a high I/O count for applications that require reconfigurable digital logic.

Key on-chip resources include 24,320 logic elements, approximately 0.623 Mbits of embedded memory (622,592 total RAM bits), and 492 I/O pins. The device is supplied in a 672-ball FBGA (27×27) package and operates from a 1.425 V to 1.575 V supply within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 24,320 logic elements supporting complex programmable logic implementations and combinational/sequential designs.
• Embedded Memory Approximately 0.623 Mbits of on-chip RAM (622,592 bits) for buffering, lookup tables, and state storage.
• I/O Density 492 I/O pins to support multiple parallel interfaces and external device connectivity.
• Gate Count Approximately 2,750,000 gates providing significant combinational and sequential capacity.
• Power Operates from a core supply range of 1.425 V to 1.575 V for predictable power planning.
• Package 672-ball BBGA/FCBGA package (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor to support compact PCB designs.
• Temperature & Grade Commercial temperature range of 0 °C to 85 °C; device is specified for commercial-grade applications.
• Mounting & Compliance Surface-mount package and RoHS-compliant construction for modern manufacturing processes.

Unique Advantages

• High logic capacity: 24,320 logic elements enable implementation of substantial custom digital functions without external ASICs.
• Significant embedded memory: Approximately 0.623 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 492 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and board-level integration.
• Compact BGA footprint: 672-ball FBGA (27×27) package delivers high integration density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for a wide range of general-purpose electronic applications.
• RoHS-compliant: Conforms to RoHS for environmentally responsible manufacturing and assembly.

Why Choose EP2A25F672C9?

The EP2A25F672C9 balances substantial programmable logic, embedded memory, and a high I/O count in a compact 672-ball FBGA package, making it appropriate for commercial designs that need reconfigurable digital logic and moderate on-chip memory. Its defined supply voltage range and commercial temperature rating simplify system-level power and thermal planning for production designs.

This device suits engineering teams seeking a field-programmable solution with measurable resource counts—logic elements, RAM bits, gate count, and I/O—backed by Altera's APEX II device family for predictable integration into existing workflows and BOMs.

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