EP2A25B724C7

The EP2A25B724C7 is an APEX II field programmable gate array (FPGA) provided in a 724-ball BGA (FCBGA) package. It delivers a balance of programmable logic capacity, embedded memory, and high I/O density intended for commercial electronic designs.

With 24,320 logic elements, approximately 0.62 Mbits of embedded memory, and up to 540 user I/O, this device targets commercial applications requiring substantial on-chip resources in a compact surface-mount BGA package.

Key Features

• Programmable Logic — 24,320 logic elements supporting complex logic integration and system-level customization.
• On-chip Memory — Approximately 0.62 Mbits of embedded RAM (622,592 bits) for local data buffering and state storage.
• I/O Capacity — 540 device I/Os to support wide peripheral connectivity and dense board-level interfacing.
• Logic Scale — Approximately 2,750,000 gates of logic capacity for mid-range FPGA implementations.
• Power — Core supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting — 724-BBGA (FCBGA) surface-mount package with supplier device package 724-BGA (35 × 35), enabling compact board footprints.
• Operating Range — Commercial grade operation from 0 °C to 85 °C, suitable for commercial-environment electronics.
• Regulatory — RoHS compliant for lead-free manufacturing and regulatory compatibility.

Typical Applications

• Commercial Embedded Systems — Programmable logic and onboard memory support control, glue-logic, and integration tasks in commercial products.
• I/O-Intensive Designs — The 540 I/O pins accommodate systems that require broad peripheral and bus connectivity on a single FPGA.
• Mid-Range Logic Integration — With 24,320 logic elements and ~2.75M gates, the device fits mid-range implementations that consolidate multiple discrete functions.

Unique Advantages

• High Logic Density: 24,320 logic elements enable consolidation of complex logic functions onto one device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 0.62 Mbits of on-chip RAM supports local buffering and state machines without external memory.
• Extensive I/O: 540 user I/O signals allow direct interfacing to a wide variety of peripherals and high-pin-count buses.
• Compact BGA Package: 724-ball FCBGA (35 × 35) provides a small footprint for space-constrained commercial designs while supporting surface-mount assembly.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match typical commercial product environment requirements.
• RoHS Compliant: Supports lead-free manufacturing processes and regulatory compliance for commercial electronics.

Why Choose EP2A25B724C7?

The EP2A25B724C7 combines substantial programmable logic, embedded memory, and a high I/O count in a compact 724-BBGA FCBGA package, making it suitable for commercial designs that require integrated, mid-range FPGA capability. Its combination of logic capacity and I/O density helps simplify system architectures by reducing the need for multiple discrete components.

This device is ideal for developers and procurement teams building commercial embedded products that need reliable, RoHS-compliant programmable logic with a defined operating temperature range and a compact surface-mount package.

Request a quote or submit a sales inquiry to obtain pricing, availability, and lead-time information for the EP2A25B724C7.