EP2A15F672C8

IC FPGA 492 I/O 672FBGA
Part Description

APEX II Field Programmable Gate Array (FPGA) IC 492 425984 16640 672-BBGA

Quantity 594 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O492Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1900000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits425984

Overview of EP2A15F672C8 – APEX II FPGA, 16,640 logic elements, 672-BBGA

The EP2A15F672C8 is an APEX II field programmable gate array (FPGA) manufactured by Intel. It integrates 16,640 logic elements and approximately 0.426 Mbits of embedded RAM to implement complex custom logic, protocol processing, and high‑speed I/O functions for commercial applications.

Designed for systems requiring high I/O density and on-chip memory, this device delivers substantial gate capacity and flexible interface support while operating within a 1.425 V to 1.575 V core supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Logic Capacity — 16,640 logic elements and approximately 1,900,000 maximum system gates provide substantial on-chip programmable logic for medium-density designs.
  • Embedded Memory — Approximately 0.426 Mbits of total on-chip RAM bits for FIFOs, buffers, and other memory-intensive functions.
  • I/O Density and High-Speed Interfaces — Up to 492 user I/O pins with support in the APEX II family for True-LVDS, LVPECL, PCML and HyperTransport interfaces and common networking bus standards as documented for the family.
  • Memory Interface Support — Documented family-level support for high-speed external memory interfaces, including ZBT, QDR, and DDR SRAM, and SDR and DDR SDRAM.
  • Power and Voltage — Core supply voltage range of 1.425 V to 1.575 V; device architecture and copper interconnects documented in the family support lower-power operation.
  • Package and Mounting — Surface-mount package case 672-BBGA; supplier device package listed as 672-FBGA (27x27), suitable for dense board layouts.
  • Commercial Grade — Rated for commercial operating temperatures from 0 °C to 85 °C.
  • Standards and I/O Control — Family documentation describes programmable I/O features including drive strength control, slew-rate control, and programmable pull-ups during configuration.
  • RoHS Compliant — Device meets RoHS environmental compliance requirements.

Typical Applications

  • High‑speed Networking and Communications — Implement protocol engines and interface bridging leveraging the APEX II family’s support for True-LVDS, RapidIO, and other communications standards.
  • Memory Interface Controllers — Implement controllers and buffering for high‑speed external memories such as ZBT, QDR, DDR SRAM, and SDR/DDR SDRAM.
  • Embedded Logic for Commercial Systems — Deploy custom control, signal processing, and glue-logic in commercial electronics that require substantial gate count and on-chip RAM.
  • Prototyping and Custom FPGA Designs — Use the device’s logic and I/O resources for proof-of-concept, custom accelerators, and medium-density FPGA implementations.

Unique Advantages

  • High Logic Integration: 16,640 logic elements and ~1.9M gates enable integration of complex functions on a single device, reducing BOM and board complexity.
  • Significant On‑Chip Memory: Approximately 0.426 Mbits of embedded RAM supports FIFOs, buffers, and dual-port memory functions without consuming external resources.
  • Robust I/O Capability: 492 user I/O pins provide the pin count needed for dense interfaces and multi-channel connectivity.
  • Commercially Rated: Operates across a 0 °C to 85 °C range and is designated commercial grade for mainstream electronics projects.
  • Compact Surface-Mount Package: 672-BBGA / 672-FBGA (27x27) packaging accommodates high-density PCB designs while supporting surface-mount assembly.
  • Environmental Compliance: RoHS compliance simplifies integration into products targeting regulatory markets.

Why Choose EP2A15F672C8?

The EP2A15F672C8 offers a balanced combination of logic capacity, embedded memory, and high I/O density within the APEX II FPGA family. Its documented support for high‑speed interfaces and memory controllers, along with programmable I/O control and a compact 672-BBGA package, makes it well suited for commercial systems that require medium-density programmable logic and substantial I/O connectivity.

For design teams seeking a commercially rated FPGA with significant on-chip resources and documented family-level interface capabilities, the EP2A15F672C8 presents a practical, scalable option backed by APEX II family documentation and Intel manufacturing.

Request a quote or submit a parts inquiry to receive pricing and availability for EP2A15F672C8. Our team can provide ordering details and assist with technical clarification.

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