EP2A15B724C8
| Part Description |
APEX II Field Programmable Gate Array (FPGA) IC 492 425984 16640 724-BBGA, FCBGA |
|---|---|
| Quantity | 365 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 724-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 724-BBGA, FCBGA | Number of I/O | 492 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1900000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 425984 |
Overview of EP2A15B724C8 – APEX II Field Programmable Gate Array (FPGA) IC 492 425984 16640 724-BBGA, FCBGA
The EP2A15B724C8 is an Altera APEX II field programmable gate array (FPGA) device designed for commercial-grade programmable logic applications. It delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a 724-ball BGA package intended for surface-mount assembly.
With 16,640 logic elements, approximately 0.426 Mbits of embedded RAM and 492 user I/O pins, this device is suited for designs that require significant on-chip logic, memory and I/O integration while operating within standard commercial temperature and supply ranges.
Key Features
- Core Logic 16,640 logic elements and approximately 1,900,000 gates provide the programmable fabric for custom digital designs.
- Embedded Memory Approximately 0.426 Mbits (425,984 bits) of on-chip RAM for data buffering, state storage and intermediate processing.
- I/O Capacity 492 user I/O pins to support wide external connectivity and parallel interfaces.
- Device Resources 1,664 CLB-equivalent blocks (listed as 1,664 LABs/CLBs in source data) as part of the device’s internal resource partitioning.
- Power and Supply Supported core voltage range from 1.425 V to 1.575 V for integration into standard power domains.
- Package and Mounting 724-ball BGA package (724-BBGA, FCBGA) with supplier package dimension 724-BGA (35 × 35 mm); surface-mount package suitable for PCB assembly.
- Operating Range and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Custom digital logic and prototyping Implement and iterate application-specific logic functions using the device’s programmable fabric and embedded RAM.
- I/O-intensive control systems Leverage 492 user I/Os to interface with multiple peripherals, sensors and parallel bus systems.
- Memory-buffered processing Use the on-chip RAM for buffering, temporary storage and small lookup tables in mid-complexity designs.
Unique Advantages
- Substantial logic capacity: 16,640 logic elements enables implementation of sizable custom logic blocks without external CPLDs.
- Integrated on-chip memory: Approximately 0.426 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
- Large I/O complement: 492 I/O pins allow extensive external interfacing, simplifying board-level connectivity for multi-peripheral systems.
- Compact surface-mount BGA: 724-ball BGA (35 × 35 mm) package provides high pin density in a compact footprint for space-constrained PCBs.
- Commercial-temperature suitability: Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
- RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing environments.
Why Choose EP2A15B724C8?
The EP2A15B724C8 positions itself as a capable commercial-grade FPGA option for designs that require a mix of logic density, embedded RAM and extensive I/O in a BGA surface-mount package. Its specification set—16,640 logic elements, approximately 0.426 Mbits of on-chip RAM, 492 I/Os and a 724-ball BGA footprint—makes it suitable for mid-complexity programmable logic tasks where integration and board-level I/O count are important.
Choose this device for projects that demand a balance of on-chip resources, compact package integration and standard commercial operating parameters. Its RoHS compliance and defined voltage and temperature ranges support predictable integration into production hardware targeted at commercial applications.
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