EP20K60ETC144-3N

IC FPGA 92 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 32768 2560 144-LQFP

Quantity 168 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O92Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60ETC144-3N – APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 32768 2560 144-LQFP

The EP20K60ETC144-3N is an APEX-20KE family FPGA designed for system-on-programmable-chip integration. It combines LUT-based logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive functions and on-chip memory structures such as FIFOs and dual-port RAM.

With 2,560 logic elements, approximately 32.8 Kbits of embedded memory, up to 162,000 system gates and 92 user I/Os in a 144-LQFP surface-mount package, this device targets embedded control, communications and I/O-intensive designs requiring moderate logic density and flexible clocking.

Key Features

  • Core architecture – MultiCore integration LUT logic, product-term logic and embedded system blocks (ESBs) combine to support both register-intensive and combinatorial-intensive functions.
  • Logic capacity 2,560 logic elements and approximately 162,000 system gates provide moderate-density programmable logic for control, protocol bridging and glue-logic tasks.
  • Embedded memory Approximately 32,768 bits of on-chip RAM implemented in ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations.
  • I/O flexibility 92 user I/Os with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V and 5.0 V per APEX 20K family documentation) and programmable slew-rate and output enable control for interface tuning.
  • Clocking and timing Flexible clock management including up to four PLLs, a low-skew clock tree, up to eight global clock signals and programmable clock-shift, clock multiplication and clock-lock features.
  • Power and supply Designed for low-power operation with an internal supply operating in the 1.71 V to 1.89 V range and power-saving modes available in ESBs.
  • Package and mounting 144-LQFP (supplier package listed as 144-TQFP, 20×20) surface-mount device, commercial grade with operating temperature range from 0 °C to 85 °C.
  • Standards and advanced I/O Series-level support for high-speed I/O standards and features including LVDS, PCI 3.3 V operation, and direct I/O-to-local interconnect for fast timing paths (as documented for APEX-20K devices).
  • RoHS compliant Device conforms to RoHS regulatory requirements.

Typical Applications

  • Embedded control and protocol bridging Use the device’s LUTs and product-term logic for glue logic, protocol conversion and control sequencing in embedded systems.
  • Buffered memory and data path buffering ESB-based RAM and FIFO implementations make this FPGA suitable for on-chip buffering and data alignment between interfaces.
  • Interface aggregation MultiVolt I/O and programmable slew-rate control allow interfacing between diverse voltage domains and peripherals in communication and instrumentation equipment.
  • Clocked systems and timing-sensitive logic Multiple PLLs and global clock resources support systems that require flexible clock distribution and phase/delay tuning.

Unique Advantages

  • Integrated memory and logic: ESBs provide embedded RAM and product-term logic, reducing the need for external memory in many buffer and FIFO applications.
  • Moderate-density, predictable routing: 2,560 logic elements with the APEX FastTrack interconnect structure deliver consistent timing for mid-range designs.
  • Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing with multiple peripheral voltage standards without extensive level-shifting circuitry.
  • Advanced clock management: Up to four PLLs, ClockBoost, ClockLock and ClockShift features simplify clock domain generation and skew/phase control.
  • Compact SMT package: 144-LQFP surface-mount packaging provides a small-footprint option compatible with standard PCB assembly flows.
  • Commercial-grade and RoHS compliant: A commercial temperature range (0 °C to 85 °C) and RoHS compliance support mainstream electronics production requirements.

Why Choose EP20K60ETC144-3N?

The EP20K60ETC144-3N positions itself as a balanced mid-density FPGA for designs that need embedded memory, flexible I/O interfacing and robust clock management in a compact surface-mount package. Its combination of 2,560 logic elements, ESB-based memory and up to 92 I/Os delivers a practical integration point for control, buffering and protocol tasks where on-chip RAM and programmable logic reduce board-level complexity.

This device is well suited to customers designing commercial-temperature electronics who require a programmable, RoHS-compliant FPGA with clear power-supply and packaging characteristics and a family-level ecosystem of clocking and I/O features documented for APEX-20K devices.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the EP20K60ETC144-3N.

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