EP20K60ETC144-3

IC FPGA 92 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 32768 2560 144-LQFP

Quantity 325 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O92Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells2560
Number of Gates162000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32768

Overview of EP20K60ETC144-3 – APEX-20KE Field Programmable Gate Array (FPGA) 144-LQFP

The EP20K60ETC144-3 is an APEX-20KE series field programmable gate array (FPGA) optimized for mid-density system integration. It uses a MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) to implement register-intensive logic, memory functions, and combinatorial logic.

With 2,560 logic elements, approximately 32.8 kbits of embedded memory, flexible MultiVolt I/O and advanced clock management, this device targets embedded control, high-speed I/O buffering and system-on-programmable-chip integration where compact packaging and commercial-grade operation are required.

Key Features

  • Core & Architecture MultiCore architecture integrating LUT-based logic, product-term logic and embedded system blocks for a mix of register-intensive and memory functions.
  • Logic Density 2,560 logic elements providing programmable logic resources and up to 162,000 system gates reported for this device family.
  • Embedded Memory 32,768 total RAM bits (approximately 32.8 kbits) for FIFOs, dual-port RAM and small buffering tasks implemented in ESBs.
  • I/O Flexibility 92 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling as described for the APEX 20K family.
  • Clock & Timing Flexible clock management including multiple PLLs, built-in low-skew clock tree and features for clock phase, delay shifting and multiplication/division.
  • Power & Supply Internal supply voltage in the range 1.71 V to 1.89 V and family-level low-power design options such as programmable ESB power-saving modes.
  • Package & Mounting Surface-mount 144-LQFP (144-TQFP 20×20) package for compact board-level integration.
  • Commercial Temperature & Compliance Rated for commercial operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded Control & System Integration Implement custom logic, protocol bridging and embedded peripherals using the MultiCore architecture and ESBs for integrated functions.
  • Memory Interfacing & Buffering Use the device's ESBs and on-chip RAM for FIFO buffers, dual-port RAM and small scratchpad memory in memory interface designs.
  • High-Speed I/O & Communications Deploy in applications requiring flexible I/O voltages and advanced clock management for synchronous data paths and high-speed signalling.
  • Prototyping & Custom Logic Leverage 2,560 logic elements and the APEX 20K feature set to prototype and validate mid-density programmable logic designs.

Unique Advantages

  • Integrated MultiCore Architecture: Combines LUT logic, product-term logic and ESBs to implement both logic- and memory-intensive functions on a single device.
  • Balanced Logic and Memory Resources: 2,560 logic elements alongside approximately 32.8 kbits of embedded RAM enable compact implementation of control and buffering tasks without external memory for small designs.
  • MultiVolt I/O Support: Interfaces with multiple I/O voltage domains (1.8 V, 2.5 V, 3.3 V, 5.0 V) to simplify integration with mixed-voltage systems.
  • Flexible Clocking: Multiple PLLs and low-skew clock distribution support complex clocking schemes, phase/delay adjustment and clock multiplication/division.
  • Compact Surface-Mount Package: 144-LQFP package provides a space-efficient solution for board-level integration while preserving ample I/O and routing.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial application environments.

Why Choose EP20K60ETC144-3?

The EP20K60ETC144-3 delivers a practical balance of programmable logic capacity and embedded memory within a compact 144-LQFP footprint. Its MultiCore architecture and ESBs give designers the ability to consolidate logic-intensive and memory-oriented functions on a single FPGA, while MultiVolt I/O and advanced clock management simplify integration into mixed-voltage, synchronized systems.

This device is well suited to engineers and procurement teams building mid-density embedded systems, interface logic, and prototype designs that require a verified family-level feature set, commercial-temperature operation and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the EP20K60ETC144-3.

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