EP2A25F672C7

The EP2A25F672C7 is an APEX II Field Programmable Gate Array (FPGA) offered in a 672-ball FCBGA package. It provides a commercial-grade programmable logic platform with a high I/O count, substantial on-chip memory, and a large array of logic elements for implementing custom digital designs.

Designed for commercial embedded and digital applications, this surface-mount FPGA delivers flexibility for designs that require moderate logic density, extensive I/O, and built-in RAM while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity 24,320 logic elements to implement complex combinational and sequential logic functions within a mid-range FPGA footprint.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM (622,592 total bits) to support buffering, lookup tables, and small memory structures without external components.
• I/O Resources 492 user I/O pins providing extensive external connectivity for parallel interfaces, control signals, and peripherals.
• Package and Mounting 672-ball BGA (672-BBGA, FCBGA) supplier package 672-FBGA (27×27) in a surface-mount form factor for compact PCB integration.
• Power Core supply range of 1.425 V to 1.575 V, enabling predictable power planning and integration with common power rails.
• Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Integration Scale Approximately 2,750,000 logic gates for mapping medium-complexity systems on a single device.
• Compliance RoHS-compliant construction to meet common environmental and regulatory requirements for commercial electronics.

Typical Applications

• Commercial Embedded Systems Use as the programmable logic core for control, timing, and interface functions in commercial embedded products where moderate logic density and dedicated I/O are required.
• Interface Bridging Implement protocol conversion, parallel-to-serial bridging, and custom glue logic leveraging the device’s 492 I/O pins and embedded RAM.
• Prototyping and Development Rapidly prototype digital designs that require reprogrammable logic, internal RAM, and a compact BGA package for board-level validation.
• DSP and Data Handling Deploy for moderate digital signal processing tasks and data buffering that fit within the provided on-chip RAM and logic resources.

Unique Advantages

• Balanced Logic and Memory: The combination of 24,320 logic elements and approximately 0.59 Mbits of embedded RAM supports a wide range of mid-complexity designs without immediate reliance on external memory.
• High Pin Count in a Compact Package: 492 I/O in a 672-ball FCBGA package allows dense external connectivity while keeping PCB area compact.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance, aligning with standard commercial product requirements.
• Predictable Power Envelope: A defined core voltage range (1.425 V to 1.575 V) simplifies power-supply design and thermal planning.
• Surface-Mount Convenience: BGA surface-mount package supports automated assembly and industry-standard PCB processes.

Why Choose EP2A25F672C7?

The EP2A25F672C7 positions itself as a mid-range, commercial-grade FPGA that balances logic capacity, embedded memory, and a high I/O count in a compact 672-ball FCBGA package. Its specifications make it suitable for engineers who need on-chip RAM, substantial programmable logic (24,320 logic elements), and nearly 500 I/O pins for interfacing and control tasks in commercial applications.

This device is appropriate for teams building scalable prototypes, interface-rich embedded systems, or moderate DSP and data-handling functions that benefit from a reprogrammable hardware platform and RoHS-compliant manufacturing.

Request a quote or submit your requirements to receive pricing and availability information for the EP2A25F672C7.