EP2A15F672I8

The EP2A15F672I8 is an APEX II family FPGA offering a mid-range logic density and a broad I/O complement in a compact BGA package. It integrates a substantial number of logic elements, on-chip RAM and I/O to support custom digital logic, interface bridging and embedded control in industrial applications.

Designed for surface-mount assembly and industrial-grade operation, this device delivers a balance of integration and robustness with a voltage supply range suitable for modern FPGA power rails and an extended operating temperature range for demanding environments.

Key Features

• Logic Capacity  Contains 16,640 logic elements, providing significant resources for custom combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.426 Mbits of on-chip RAM (425,984 bits) for buffering, FIFOs, and small embedded data structures.
• Gate-Equivalent Complexity  About 1.9 million gates to support complex state machines and datapath logic.
• I/O Density  492 I/O pins for flexible interfacing to peripherals, sensors, and external devices.
• Package & Mounting  Delivered in a 672-ball BGA package (672-BBGA, FCBGA / supplier package 672-FBGA 27×27) optimized for compact, high-density board designs; surface-mount mounting type.
• Power  Supports core voltage supply between 1.425 V and 1.575 V to match target FPGA power rails.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in harsh environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control & Automation  Use the FPGA’s logic density and wide temperature range to implement motor control, sensor aggregation, and real-time signal processing in industrial systems.
• Communications & Networking  Leverage abundant I/O and gate capacity to implement interface bridging, packet handling, or custom protocol logic in networking equipment.
• Embedded System Integration  Deploy as a central custom-logic element for system orchestration, combining I/O routing, protocol conversion, and local processing.

Unique Advantages

• High logic integration: 16,640 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level BOM.
• Generous I/O count: 492 I/O pins provide the flexibility to connect numerous peripherals and interfaces without external multiplexing.
• Compact BGA footprint: The 672-ball FCBGA (27×27) package supports high-density PCB layouts while maintaining robust signal routing.
• Industrial thermal range: Rated from −40 °C to 100 °C, supporting deployments in temperature-challenging environments.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production flows.

Why Choose EP2A15F672I8?

The EP2A15F672I8 positions itself as a practical solution for engineers needing mid-range FPGA resources with strong I/O and reliable industrial operation. Its combination of 16,640 logic elements, approximately 0.426 Mbits of embedded RAM and nearly 1.9 million gates supports a wide range of custom digital tasks while the 492 I/O pins enable direct connectivity to a broad set of peripherals and sensors.

Packaged in a compact 672-ball BGA and specified for industrial temperatures with RoHS compliance, this device offers a balance of integration and environmental robustness suitable for embedded systems and industrial designs that require long-term, stable operation.

Request a quote or submit a sales inquiry to obtain pricing, lead times, and availability for the EP2A15F672I8 FPGA.