EP2A25B724C8

The EP2A25B724C8 is an APEX II field programmable gate array (FPGA) IC by Altera, delivered in a 724-ball BGA (FCBGA) package. It provides a balance of programmable logic, on-chip memory, and a high I/O count for designs that require substantial interfacing and configurable logic capacity.

With 24,320 logic elements, approximately 0.62 Mbits of embedded memory, and up to 540 I/O pins, this device targets applications that need moderate embedded logic density and broad I/O connectivity within a commercial temperature range.

Key Features

• Core Logic – 24,320 logic elements enabling medium-density programmable logic implementations.
• Embedded Memory – Total on-chip RAM of 622,592 bits, approximately 0.62 Mbits of embedded memory for data buffering and local storage.
• I/O Capacity – Up to 540 I/O pins to support extensive external interfacing and parallel connectivity.
• Gate Count – Approximately 2,750,000 gates for representing combinational and sequential logic resources.
• Power Supply – Operates from a core voltage supply range of 1.425 V to 1.575 V, suitable for the device’s specified core requirements.
• Package & Mounting – 724-ball BGA (FCBGA) package, supplier device package listed as 724-BGA (35×35), surface-mount mounting type for compact board integration.
• Operating Range – Commercial-grade operation from 0 °C to 85 °C.
• RoHS Compliant – Conforms to RoHS environmental requirements.

Typical Applications

• High-density I/O Systems – Use the 540 I/O pins to interface with multiple peripherals, sensors, or buses where extensive external connectivity is required.
• Embedded Logic and Control – Implement mid-range programmable logic functions and custom control logic leveraging 24,320 logic elements and on-chip RAM.
• Prototyping and Evaluation – Suitable for development boards and evaluation platforms that need a commercial-grade FPGA with significant logic and I/O capability.

Unique Advantages

• Substantial Logic Capacity: 24,320 logic elements provide the resources needed to implement complex state machines, glue logic, and custom datapaths without external ASICs.
• Generous I/O Count: 540 I/Os simplify board-level integration by reducing the need for external I/O expanders or serializers in high-pin-count designs.
• On-chip Memory: Approximately 0.62 Mbits of embedded RAM supports local buffering, FIFOs, and small lookup tables, improving data handling efficiency.
• Compact Surface-mount Package: 724-BGA (35×35) format enables a high density of connection points while maintaining a compact board footprint.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial electronics deployment.
• RoHS Compliance: Environmentally compliant manufacturing for designs that require lead-free components.

Why Choose EP2A25B724C8?

The EP2A25B724C8 positions itself as a commercially graded, mid-density FPGA option combining 24,320 logic elements, substantial I/O density, and embedded RAM in a compact 724-BGA package. It is suited for designers who need a programmable logic component with significant interfacing capability and on-chip resources for control, data buffering, and custom logic implementation.

Its voltage supply window and package details simplify hardware integration, while RoHS compliance supports environmentally conscious designs. The device is appropriate for teams building scalable prototypes or production systems that require a balance of logic, memory, and I/O without moving into higher-density device families.

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