EP2A25F672I8

The EP2A25F672I8 is an APEX II field‑programmable gate array (FPGA) device offering 24,320 logic elements and approximately 0.62 Mbits of on‑chip RAM. Built for designs that require high‑density programmable logic with broad I/O capability, this device targets communications, networking, industrial control, and high‑performance interface applications.

Featuring support for high‑speed serial and parallel I/O standards, a compact 672‑ball BGA package, and industrial temperature grading, the EP2A25F672I8 delivers a balance of integration, configurable I/O, and robustness for embedded system designs.

Key Features

• Core Logic 24,320 logic elements and approximately 2,750,000 system gates provide substantial programmable logic density for complex state machines, protocol handling, and custom datapaths.
• Embedded Memory Approximately 0.62 Mbits of total on‑chip RAM (622,592 bits) and enhanced 4,096‑bit embedded system blocks (ESBs) for FIFO, Dual‑Port+ RAM and CAM implementations.
• High‑Performance I/O 492 user I/O pins with support for high‑speed interfaces including True‑LVDS, LVPECL, PCML and HyperTransport, enabling common networking and communications bus I/O standards and flexible signaling options.
• I/O Bandwidth & Interfaces Family‑level features include up to 1 Gbps True‑LVDS on dedicated channels, Flexible‑LVDS up to 400 Mbps on additional channels, and support for external memory interfaces such as ZBT/QDR and SDR/DDR SDRAM.
• Power and Voltage Core supply range specified at 1.425 V to 1.575 V to match low‑voltage system designs and minimize power dissipation in the core.
• Package & Mounting Surface‑mount 672‑BBGA package (supplier device package listed as 672‑FBGA, 27 × 27) for compact board integration and high I/O density.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial and extended‑temperature applications.
• Programmable I/O Controls Per‑I/O element registers and programmable features such as output drive selection, slew‑rate control, and programmable pull‑ups to tailor signal integrity and interface behavior.

Typical Applications

• High‑speed communications and networking — Implement packet processing, front‑end protocol adapters, and custom interface logic where multi‑standard I/O and True‑LVDS support are required.
• Memory interface controllers — Bridge and manage high‑speed external memories (ZBT, QDR, SDR/DDR SDRAM) using the device’s embedded RAM blocks and I/O resources.
• Industrial control and automation — Implement deterministic control logic, signal conditioning, and multi‑I/O aggregation within an industrial temperature‑rated FPGA.
• Custom I/O and protocol bridging — Create protocol converters, serializer/deserializer stages, and glue logic for legacy and modern interfaces leveraging flexible I/O standards.

Unique Advantages

• High integration density: 24,320 logic elements and ~2.75M gates reduce external glue logic and simplify board-level design.
• Significant on‑chip memory: Approximately 0.62 Mbits of embedded RAM and ESBs enable local buffering, FIFOs, and dual‑port memory functions without external SRAM.
• Flexible high‑speed I/O: 492 I/O pins with family features for True‑LVDS and Flexible‑LVDS support multi‑standard interface designs and high aggregate I/O throughput.
• Industrial robustness: Surface‑mount 672‑BBGA packaging and −40 °C to 100 °C operating range meet the durability needs of industrial deployments.
• Configurable signal integrity: Programmable output drive and slew‑rate control help optimize signal quality and EMI for diverse board layouts.

Why Choose EP2A25F672I8?

The EP2A25F672I8 positions itself as a high‑density, industrial‑rated FPGA option within the APEX II family, combining substantial logic resources, embedded memory, and extensive I/O capability in a compact BGA package. Its feature set is well suited to engineers building communications interfaces, memory controllers, and industrial control systems that require both programmable logic capacity and flexible high‑speed signaling.

With a defined core voltage range and extended temperature rating, the EP2A25F672I8 offers predictable electrical and thermal behavior for production systems, providing scalable integration and long‑term design stability for embedded and industrial projects.

Request a quote or submit an inquiry to get pricing, availability, and delivery options for the EP2A25F672I8. Our team can provide technical and procurement support to help you evaluate this device for your next design.