EP2A25F672C8

The EP2A25F672C8 is an Altera APEX II field programmable gate array (FPGA) supplied in a 672-BBGA FCBGA package. It delivers a combination of programmable logic resources, embedded memory, and high I/O density for designs that require compact, board-mounted reconfigurable logic.

With 24,320 logic elements, approximately 0.62 Mbits of embedded memory, and 492 user I/Os in a 672-FBGA (27×27) form factor, the device targets designs that need significant on-chip logic and interfacing capability within a commercial temperature range.

Key Features

• Core Logic  24,320 logic elements provide the programmable resources for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.62 Mbits of on-chip RAM supports data buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity  492 user I/Os enable dense external interfacing for peripherals, buses, and high-pin-count I/O requirements.
• Gate Density  Approximately 2,750,000 gates for integrating complex logic and glue functions on a single device.
• Package & Mounting  672-BBGA (672-FBGA, 27×27) package in a surface-mount form factor optimizes PCB area for compact systems.
• Power  Specified core supply range of 1.425 V to 1.575 V for stable operation within defined power conditions.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer applications.
• Environmental Compliance  RoHS-compliant construction supports regulatory requirements for lead-free assemblies.

Typical Applications

• Custom digital logic  Implement application-specific processing, control logic, and state machines using the device’s 24,320 logic elements.
• High-density I/O interfacing  Use the 492 I/Os to connect multiple peripherals, buses, or sensors directly to the FPGA without external glue logic.
• On-chip buffering and small memory functions  Leverage approximately 0.62 Mbits of embedded RAM for FIFOs, temporary data storage, and small lookup tables.
• Compact system integration  The 672-FBGA (27×27) surface-mount package enables integration into space-constrained PCBs while maintaining substantial logic and I/O capability.

Unique Advantages

• Significant programmable resources: 24,320 logic elements and ~2.75M gates let you consolidate multiple discrete functions into a single device.
• On-chip memory for local storage: Approximately 0.62 Mbits of embedded RAM reduces dependency on external memory for buffering and small data tasks.
• High I/O count: 492 user I/Os simplify board-level routing and reduce the need for additional interface components.
• Compact FCBGA footprint: 672-BBGA / 672-FBGA (27×27) package offers a space-efficient solution for densely populated PCBs.
• Defined power and thermal envelope: Narrow core supply range (1.425 V–1.575 V) and commercial temperature rating (0 °C–85 °C) support predictable design margins.
• RoHS compliant: Meets lead-free assembly requirements for environmentally conscious designs.

Why Choose EP2A25F672C8?

The EP2A25F672C8 combines a substantial complement of logic elements, embedded memory, and a high number of I/Os in a compact 672-BBGA FCBGA package. Its defined supply voltage range and commercial temperature rating make it suitable for designers who need reliable programmable logic and I/O density within standard embedded and consumer operating conditions.

Choose this device when your design requires consolidation of multiple digital functions, local on-chip memory, and numerous external interfaces while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit a parts inquiry to obtain pricing and availability for the EP2A25F672C8.