XCV200E-8FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 114688 5292 256-BGA

Quantity 560 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates306393ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV200E-8FG256C – Virtex®-E Field Programmable Gate Array, 176 I/O, 256-BGA

The XCV200E-8FG256C is a Virtex®-E series Field Programmable Gate Array (FPGA) in a 256-ball FBGA (17×17) package. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count for applications requiring flexible, reprogrammable digital logic and high-performance interfaces.

Targeted at commercial-grade designs, this device provides approximately 5,292 logic elements, roughly 0.115 Mbits of embedded memory (114,688 bits), and 176 user I/Os, while operating from a 1.71 V to 1.89 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic — Approximately 5,292 logic elements (specified as 5,292 logic element cells) and about 306,393 equivalent gates for implementing custom digital logic functions.
  • Embedded Memory — Approximately 114,688 bits (≈0.115 Mbits) of on-chip RAM for buffering, FIFOs, and small data stores.
  • I/O Capacity & Flexibility — 176 user I/O pins; series-level SelectI/O+™ technology supports multiple high-performance interface standards and differential signaling options such as LVDS, BLVDS, and LVPECL.
  • High-performance Clock & Timing — Family features include up to eight fully digital Delay-Locked Loops (DLLs) for clock management and support for DDR clocking schemes.
  • Memory Interface Support — Series-level SelectRAM+™ architecture and support for high-speed external memories, enabling designs that interface to ZBT SRAMs and DDR SDRAMs (as described for the Virtex-E family).
  • Packaging & Mounting — Supplied in a 256-FBGA (17×17) surface-mount package for compact board-level integration.
  • Power & Temperature — Core supply specified at 1.71 V to 1.89 V; commercial operating temperature range 0 °C to 85 °C.
  • Compliance & Quality — RoHS-compliant; 100% factory tested per Virtex-E family specification.

Typical Applications

  • High-Speed Interface Logic — Implement PCI-compliant logic blocks and other bus interfaces leveraging the family’s PCI 3.3 V support and high I/O flexibility.
  • Data Acquisition & Processing — Use on-chip RAM and logic resources for buffering, preprocessing, and protocol handling in data acquisition systems.
  • Memory Controller & Bridge Functions — Employ SelectRAM+™ and block RAM capabilities (as available in the Virtex-E family) for custom memory controllers and external memory interfaces.
  • Communication & Differential Signaling — Design LVDS/BLVDS/LVPECL-based links and receive/transmit logic using the device’s differential signalling support.

Unique Advantages

  • Balanced Logic Density and I/O Count: Approximately 5,292 logic elements combined with 176 I/Os enable mid-density, I/O-rich designs without excessive board-level routing complexity.
  • Embedded RAM for On-Chip Buffering: Nearly 115 Kbits of on-chip RAM reduces external memory reliance for many control and buffering tasks.
  • Advanced Clock Management: Family-level DLLs and DDR-friendly timing features simplify implementation of high-speed, phase-aligned clocking schemes.
  • Flexible Interface Standards: SelectI/O+™ and differential signaling support provide adaptability to a wide range of signaling requirements and system interfaces.
  • Compact, Surface-Mount Package: The 256-FBGA (17×17) package delivers a small footprint for space-constrained boards while providing high I/O density.
  • Commercial-Grade Reliability: Commercial operating range (0 °C to 85 °C), RoHS compliance, and factory testing support predictable supplier quality for commercial applications.

Why Choose XCV200E-8FG256C?

The XCV200E-8FG256C positions itself as a flexible, mid-density FPGA option for commercial designs that need a blend of logic resources, embedded RAM, and a large number of configurable I/Os in a compact FBGA package. It is suitable for engineers implementing custom interfaces, memory logic, or data-processing pipelines that benefit from on-chip reprogrammability and series-level clocking and I/O features.

Supported by the Virtex-E family development ecosystem and delivered RoHS-compliant and factory tested, this device offers a pragmatic solution for projects requiring a reprogrammable platform with proven architecture and integration options.

Request a quote or submit a sales inquiry to receive pricing, availability, and lead-time information for the XCV200E-8FG256C.

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