XCV200E-8FG256C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 114688 5292 256-BGA |
|---|---|
| Quantity | 560 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 306393 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV200E-8FG256C – Virtex®-E Field Programmable Gate Array, 176 I/O, 256-BGA
The XCV200E-8FG256C is a Virtex®-E series Field Programmable Gate Array (FPGA) in a 256-ball FBGA (17×17) package. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count for applications requiring flexible, reprogrammable digital logic and high-performance interfaces.
Targeted at commercial-grade designs, this device provides approximately 5,292 logic elements, roughly 0.115 Mbits of embedded memory (114,688 bits), and 176 user I/Os, while operating from a 1.71 V to 1.89 V core supply and across a 0 °C to 85 °C temperature range.
Key Features
- Core Logic — Approximately 5,292 logic elements (specified as 5,292 logic element cells) and about 306,393 equivalent gates for implementing custom digital logic functions.
- Embedded Memory — Approximately 114,688 bits (≈0.115 Mbits) of on-chip RAM for buffering, FIFOs, and small data stores.
- I/O Capacity & Flexibility — 176 user I/O pins; series-level SelectI/O+™ technology supports multiple high-performance interface standards and differential signaling options such as LVDS, BLVDS, and LVPECL.
- High-performance Clock & Timing — Family features include up to eight fully digital Delay-Locked Loops (DLLs) for clock management and support for DDR clocking schemes.
- Memory Interface Support — Series-level SelectRAM+™ architecture and support for high-speed external memories, enabling designs that interface to ZBT SRAMs and DDR SDRAMs (as described for the Virtex-E family).
- Packaging & Mounting — Supplied in a 256-FBGA (17×17) surface-mount package for compact board-level integration.
- Power & Temperature — Core supply specified at 1.71 V to 1.89 V; commercial operating temperature range 0 °C to 85 °C.
- Compliance & Quality — RoHS-compliant; 100% factory tested per Virtex-E family specification.
Typical Applications
- High-Speed Interface Logic — Implement PCI-compliant logic blocks and other bus interfaces leveraging the family’s PCI 3.3 V support and high I/O flexibility.
- Data Acquisition & Processing — Use on-chip RAM and logic resources for buffering, preprocessing, and protocol handling in data acquisition systems.
- Memory Controller & Bridge Functions — Employ SelectRAM+™ and block RAM capabilities (as available in the Virtex-E family) for custom memory controllers and external memory interfaces.
- Communication & Differential Signaling — Design LVDS/BLVDS/LVPECL-based links and receive/transmit logic using the device’s differential signalling support.
Unique Advantages
- Balanced Logic Density and I/O Count: Approximately 5,292 logic elements combined with 176 I/Os enable mid-density, I/O-rich designs without excessive board-level routing complexity.
- Embedded RAM for On-Chip Buffering: Nearly 115 Kbits of on-chip RAM reduces external memory reliance for many control and buffering tasks.
- Advanced Clock Management: Family-level DLLs and DDR-friendly timing features simplify implementation of high-speed, phase-aligned clocking schemes.
- Flexible Interface Standards: SelectI/O+™ and differential signaling support provide adaptability to a wide range of signaling requirements and system interfaces.
- Compact, Surface-Mount Package: The 256-FBGA (17×17) package delivers a small footprint for space-constrained boards while providing high I/O density.
- Commercial-Grade Reliability: Commercial operating range (0 °C to 85 °C), RoHS compliance, and factory testing support predictable supplier quality for commercial applications.
Why Choose XCV200E-8FG256C?
The XCV200E-8FG256C positions itself as a flexible, mid-density FPGA option for commercial designs that need a blend of logic resources, embedded RAM, and a large number of configurable I/Os in a compact FBGA package. It is suitable for engineers implementing custom interfaces, memory logic, or data-processing pipelines that benefit from on-chip reprogrammability and series-level clocking and I/O features.
Supported by the Virtex-E family development ecosystem and delivered RoHS-compliant and factory tested, this device offers a pragmatic solution for projects requiring a reprogrammable platform with proven architecture and integration options.
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Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








