XCV200E-8FG456C

IC FPGA 284 I/O 456FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 284 114688 5292 456-BBGA

Quantity 1,233 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O284Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates306393ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV200E-8FG456C – Virtex®-E 1.8 V FPGA, 456-BBGA, 284 I/Os

The XCV200E-8FG456C is an SRAM-based Virtex®-E field programmable gate array (FPGA) supplied in a 456-ball BGA package. It combines a high count of configurable logic resources with abundant I/O and embedded memory to address demanding interface, control and system-integration tasks.

Designed for commercial-grade applications, the device provides flexible in-system reprogramming and a family-proven architecture that emphasizes high I/O bandwidth, on-chip memory and clock management for complex digital designs.

Key Features

  • Core and Logic  1.8 V internal core with a supply range of 1.71 V to 1.89 V; contains 1,176 CLBs and 5,292 logic elements for complex logic implementation and system integration.
  • Gate Density  Device-level equivalence of approximately 306,393 system gates to support mid-density FPGA designs.
  • Embedded Memory  Approximately 0.115 Mbits (114,688 bits) of on-chip RAM for local data buffering and control state storage.
  • I/O Resources  284 user I/O pins to support dense external interfacing; Virtex‑E family SelectI/O+ capabilities support a broad set of interface standards and high-performance differential signalling (LVDS, BLVDS, LVPECL) as documented for the Virtex‑E family.
  • Clocking and Timing  Family-level clock management features include multiple digitally controlled Delay-Locked Loops (DLLs) for clock multiplication, division and duty-cycle control to support synchronized, high-speed designs.
  • Package and Mounting  456-ball BGA (supplier package: 456-FBGA, 23×23) in a surface-mount format to support compact, high-density PCB layouts.
  • Operating Conditions & Compliance  Commercial grade operation with a specified temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High-Speed Interface Logic  Implement protocol bridging, interface adaptation and SERDES-less differential signaling using the device’s high I/O count and Virtex‑E family differential signaling support.
  • Memory Interface and Controllers  Use embedded RAM and the family’s SelectRAM+ architecture to create controllers and buffers for external SRAM/DRAM interfaces and high-bandwidth memory subsystems.
  • PCI-Based Systems and Bus Glue Logic  Support 3.3 V PCI-compliant interface logic and system glue for board-level integration and legacy/high-performance bus handling (family-level PCI support noted in the Virtex‑E specification).
  • Prototyping and In-System Reconfiguration  Leverage SRAM-based, in-system reprogrammability for iterative development, firmware upgrades and adaptive system functions.

Unique Advantages

  • Balanced Logic and I/O Density: 1,176 CLBs and 284 I/Os provide a practical mix of on-chip compute and external interfacing for mid-range FPGA designs.
  • On-Chip RAM for Local Processing: Approximately 0.115 Mbits of embedded memory reduces reliance on external buffers and improves throughput for packet and data-stream handling.
  • Family-Proven Interface Capabilities: Virtex‑E family SelectI/O+ and differential signaling support enable integration with a wide range of high-speed signaling standards.
  • Compact, Surface-Mount Packaging: 456-ball BGA (23×23) minimizes PCB footprint while supporting high pin count and thermal performance for compact systems.
  • Commercial-Grade Qualification and RoHS Compliance: Rated for 0 °C to 85 °C with RoHS compliance, enabling deployment in temperature-controlled commercial environments.

Why Choose XCV200E-8FG456C?

The XCV200E-8FG456C targets designers who need a balanced, mid-density FPGA with strong I/O capability and on-chip memory in a compact BGA package. Its Virtex‑E family architecture provides the clocking, I/O standard support and reprogrammability required for interface-heavy and system-control applications.

Choose this device when you need an SRAM-based FPGA that combines measurable logic capacity, substantial I/O, and embedded RAM for prototyping, system glue logic, and high-bandwidth interface tasks, while maintaining commercial-grade operating conditions and RoHS compliance.

Request a quote or submit an RFQ for the XCV200E-8FG456C to receive pricing and availability information tailored to your project needs.

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