XCV200E-8FG456C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 284 114688 5292 456-BBGA |
|---|---|
| Quantity | 1,233 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 284 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 306393 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV200E-8FG456C – Virtex®-E 1.8 V FPGA, 456-BBGA, 284 I/Os
The XCV200E-8FG456C is an SRAM-based Virtex®-E field programmable gate array (FPGA) supplied in a 456-ball BGA package. It combines a high count of configurable logic resources with abundant I/O and embedded memory to address demanding interface, control and system-integration tasks.
Designed for commercial-grade applications, the device provides flexible in-system reprogramming and a family-proven architecture that emphasizes high I/O bandwidth, on-chip memory and clock management for complex digital designs.
Key Features
- Core and Logic 1.8 V internal core with a supply range of 1.71 V to 1.89 V; contains 1,176 CLBs and 5,292 logic elements for complex logic implementation and system integration.
- Gate Density Device-level equivalence of approximately 306,393 system gates to support mid-density FPGA designs.
- Embedded Memory Approximately 0.115 Mbits (114,688 bits) of on-chip RAM for local data buffering and control state storage.
- I/O Resources 284 user I/O pins to support dense external interfacing; Virtex‑E family SelectI/O+ capabilities support a broad set of interface standards and high-performance differential signalling (LVDS, BLVDS, LVPECL) as documented for the Virtex‑E family.
- Clocking and Timing Family-level clock management features include multiple digitally controlled Delay-Locked Loops (DLLs) for clock multiplication, division and duty-cycle control to support synchronized, high-speed designs.
- Package and Mounting 456-ball BGA (supplier package: 456-FBGA, 23×23) in a surface-mount format to support compact, high-density PCB layouts.
- Operating Conditions & Compliance Commercial grade operation with a specified temperature range of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-Speed Interface Logic Implement protocol bridging, interface adaptation and SERDES-less differential signaling using the device’s high I/O count and Virtex‑E family differential signaling support.
- Memory Interface and Controllers Use embedded RAM and the family’s SelectRAM+ architecture to create controllers and buffers for external SRAM/DRAM interfaces and high-bandwidth memory subsystems.
- PCI-Based Systems and Bus Glue Logic Support 3.3 V PCI-compliant interface logic and system glue for board-level integration and legacy/high-performance bus handling (family-level PCI support noted in the Virtex‑E specification).
- Prototyping and In-System Reconfiguration Leverage SRAM-based, in-system reprogrammability for iterative development, firmware upgrades and adaptive system functions.
Unique Advantages
- Balanced Logic and I/O Density: 1,176 CLBs and 284 I/Os provide a practical mix of on-chip compute and external interfacing for mid-range FPGA designs.
- On-Chip RAM for Local Processing: Approximately 0.115 Mbits of embedded memory reduces reliance on external buffers and improves throughput for packet and data-stream handling.
- Family-Proven Interface Capabilities: Virtex‑E family SelectI/O+ and differential signaling support enable integration with a wide range of high-speed signaling standards.
- Compact, Surface-Mount Packaging: 456-ball BGA (23×23) minimizes PCB footprint while supporting high pin count and thermal performance for compact systems.
- Commercial-Grade Qualification and RoHS Compliance: Rated for 0 °C to 85 °C with RoHS compliance, enabling deployment in temperature-controlled commercial environments.
Why Choose XCV200E-8FG456C?
The XCV200E-8FG456C targets designers who need a balanced, mid-density FPGA with strong I/O capability and on-chip memory in a compact BGA package. Its Virtex‑E family architecture provides the clocking, I/O standard support and reprogrammability required for interface-heavy and system-control applications.
Choose this device when you need an SRAM-based FPGA that combines measurable logic capacity, substantial I/O, and embedded RAM for prototyping, system glue logic, and high-bandwidth interface tasks, while maintaining commercial-grade operating conditions and RoHS compliance.
Request a quote or submit an RFQ for the XCV200E-8FG456C to receive pricing and availability information tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








