XCV200E-8BG352C

The XCV200E-8BG352C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 352-LBGA exposed pad metal package, offering reprogrammable logic and flexible I/O for embedded and interface-centric designs. This 1.8 V FPGA provides a balance of on-chip logic, embedded memory, and I/O density suitable for high-performance system interfaces and in-system configuration.

Designed for commercial-grade applications, the device combines the Virtex‑E architecture’s SelectI/O and SelectRAM family capabilities with a compact package and industry-oriented voltage and temperature ranges, making it appropriate for designs that require configurable logic, memory interfaces and diverse I/O standards.

Key Features

• Logic Capacity — 5,292 logic elements (cells) and 1,176 CLB-like structures provide programmable combinational and sequential resources for custom logic and control functions.
• Embedded Memory — Approximately 0.11 Mbits (114,688 bits) of on-chip RAM to implement buffers, FIFOs and embedded data paths.
• I/O Density — 260 I/O pins supporting a broad set of interface needs and high aggregate bandwidth for system-level connectivity.
• Family-Level Interface Support — Virtex‑E family SelectI/O+ technology supports multiple high-performance I/O standards and differential signalling options (LVDS, BLVDS, LVPECL) and family documentation references PCI-compliant 3.3 V, 32/64-bit operation.
• Clock Management — Virtex‑E family clock features include multiple digital DLLs and synthesized duty-cycle control to support high-speed and DDR clocking schemes.
• Power and Supply — Core supply voltage range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V core operating requirements.
• Package — 352-LBGA exposed pad, metal; supplier device package listed as 352-MBGA (35×35) for compact system integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial environment deployments.
• RoHS Compliant — Device meets RoHS requirements.

Typical Applications

• High-performance interface controllers — Implement protocol bridging and custom interface logic using the device’s dense I/O and Virtex‑E SelectI/O capabilities.
• Memory interface and buffering — On-chip RAM and family-supported external memory interfaces make the device suitable for memory controller logic, buffering and data-path functions.
• Differential and high-speed signalling systems — Support for LVDS, BLVDS and LVPECL (family-level capability) enables implementation of high-speed differential data channels and clocking.
• Embedded system prototyping — Reconfigurable logic and in-system programmability support iterative development of embedded controllers, custom accelerators, and interface subsystems.

Unique Advantages

• Balanced integration: Combines 5,292 logic elements with on-chip RAM and plentiful I/O to consolidate functions and reduce external components.
• Flexible I/O and signalling: Virtex‑E family SelectI/O+ and differential signalling support enable designers to implement a wide range of interface standards without additional conversion hardware.
• Deterministic clock control: Family clock-management features including multiple DLLs and duty-cycle synthesis support reliable timing for DDR and high-speed interfaces.
• Compact, manufacturable package: 352-LBGA exposed pad metal package and 35×35 supplier package footprint facilitate PCB-level thermal and mechanical integration.
• Commercial-grade readiness: Rated for 0 °C to 85 °C and RoHS compliant, aligning with common commercial product and procurement requirements.

Why Choose XCV200E-8BG352C?

The XCV200E-8BG352C offers a pragmatic mix of programmable logic, embedded memory and dense I/O in a compact 352-LBGA package. It is well suited for engineers who need a reconfigurable solution for high-speed interfaces, memory-aware designs and systems that benefit from in-system programmability within commercial temperature constraints.

Backed by the Virtex‑E family architecture, this FPGA provides access to family-level clocking, differential signalling and memory hierarchy features while delivering a verifiable feature set — including core supply voltage range, I/O count and package details — that supports efficient board-level integration and predictable BOM planning.

Request a quote or submit an inquiry for pricing and availability of the XCV200E-8BG352C to move your design into evaluation or production planning.