XCV2600E-6FG1156C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 804 753664 57132 1156-BBGA |
|---|---|
| Quantity | 1,259 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 804 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12696 | Number of Logic Elements/Cells | 57132 | ||
| Number of Gates | 3263755 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 753664 |
Overview of XCV2600E-6FG1156C – Virtex®-E Field Programmable Gate Array (FPGA) IC 804 753664 57132 1156-BBGA
The XCV2600E-6FG1156C is a Virtex®-E family 1.8 V Field Programmable Gate Array (FPGA) offered in a 1156-ball BGA package. It delivers a high-density, reprogrammable logic fabric with 57,132 logic elements and on-chip embedded memory suitable for complex digital designs.
Designed for systems requiring large I/O counts and flexible interfacing, this commercial-grade FPGA supports up to 804 single-ended I/Os and a broad range of differential signalling standards, making it appropriate for high-performance interfaces, memory controllers and PCI-based systems.
Key Features
- Logic Capacity — 57,132 logic elements and an overall gate count of 3,263,755 provide substantial logic resources for medium to large designs.
- Embedded Memory — Approximately 0.75 Mbits of on-chip RAM (total RAM bits: 753,664) with a SelectRAM+ memory hierarchy and support for true dual-port block RAM.
- I/O and Interface Flexibility — Up to 804 single-ended I/Os (or differential pair support per device capabilities) and SelectI/O+ technology supporting numerous interface standards including LVDS, BLVDS and LVPECL.
- Clock and Timing — Built-in clock management with eight fully digital Delay-Locked Loops (DLLs) and support for high-speed LVPECL/LVDS clock inputs.
- Performance Characteristics — Family-level internal performance references include multi-level LUT operation and source-synchronous architectures; suitable for PCI-compliant 3.3 V 32/64-bit 33/66-MHz interfaces per family specification.
- Power and Supply — Core supply range of 1.71 V to 1.89 V optimized for low-power 1.8 V operation.
- Package and Mounting — Available in a 1156-BBGA package (supplier device package: 1156-FBGA (35x35)), surface-mount component.
- Commercial Grade and Environmental — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- High-Performance Memory Interfaces — Use for designs that require tight coupling to external memories such as DDR SDRAM and ZBT SRAM, leveraging the device's SelectRAM+ memory hierarchy and high memory bandwidth capabilities.
- PCI-Based Systems — Implement PCI-compliant interface logic for 3.3 V, 32/64-bit, 33/66-MHz systems as supported by the Virtex‑E family.
- High-Speed Data I/O and Conversion — Ideal for applications requiring many I/O channels or differential signalling (LVDS, BLVDS, LVPECL) for source-synchronous data paths and clocking.
- Custom Logic and Signal Processing — Suitable for embedded processing, custom datapath implementations, and wide arithmetic functions using dedicated carry logic and multiplier support.
Unique Advantages
- Substantial On-Chip Resources: 57,132 logic elements and approximately 0.75 Mbits of embedded RAM reduce external resource needs and simplify board design.
- Extensive I/O Bandwidth: Up to 804 single-ended I/Os and multi-standard differential support enable high aggregate I/O bandwidth for complex interfaces.
- Integrated Clock Management: Eight digital DLLs and support for high-speed clock inputs facilitate robust timing architectures and DDR-friendly operation.
- Flexible Packaging: 1156-ball BGA packaging (1156-FBGA (35x35)) provides a high-pin-count surface-mount solution for dense system designs.
- Commercial Temperature and RoHS Compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support mainstream electronic product requirements.
Why Choose XCV2600E-6FG1156C?
The XCV2600E-6FG1156C positions itself as a high-density, versatile FPGA for designs that demand extensive logic, significant embedded memory, and high I/O flexibility. Its combination of logic capacity, memory resources, and multi-standard I/O support suits developers building complex interface controllers, memory subsystems, and PCI-based applications.
Engineers benefit from the Virtex‑E family’s clock management and differential signalling capabilities while leveraging a surface-mount 1156-ball package for compact, high-density board implementations. The device’s RoHS compliance and commercial temperature rating make it a practical selection for a wide range of mainstream electronic products.
Request a quote or submit your project requirements to receive pricing and availability information for the XCV2600E-6FG1156C. Our team will respond with a tailored quotation and lead-time details.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








