XCV300-4BG352C

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 65536 6912 352-LBGA Exposed Pad, Metal

Quantity 1,074 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-4BG352C – Virtex Field Programmable Gate Array (FPGA) IC

The XCV300-4BG352C is an SRAM-based Virtex FPGA offering a balance of high logic capacity and flexible I/O for reprogrammable system designs. It combines a regular configurable-logic architecture with on-chip memory and dedicated clock-management resources to address systems that require programmable logic, multi-standard I/O, and in-system reconfiguration.

Targeted at commercial applications, this device provides 6,912 logic elements, approximately 65 Kbits of embedded RAM, and up to 260 I/O pins in a 352-LBGA exposed-pad package, enabling compact, high-density board implementations operating on a 2.375 V–2.625 V supply and a 0 °C–85 °C operating range.

Key Features

  • Core Logic – 6,912 logic elements (1536 CLBs) and approximately 322,970 system gates provide substantial programmable logic capacity for custom digital functions.
  • Embedded Memory – Approximately 65,536 bits of on-chip RAM for LUT-configured RAM and block RAM usage, supporting local storage and buffering needs.
  • I/O and Interfaces – Up to 260 user I/O pins and multi-standard SelectIO support for a broad set of interface standards and direct connections to external memory devices.
  • Clock Management – Four dedicated delay-locked loops (DLLs) with four primary low-skew global clock distribution nets and 24 secondary local clock nets for advanced clock control and low-skew routing.
  • Configuration and Re-programmability – SRAM-based device with in-system configuration and unlimited re-programmability across four programming modes.
  • Performance Characteristics – Series-level capability for system performance up to 200 MHz and 66-MHz PCI compliance, suitable for many mid- to high-speed digital applications.
  • Process and Test – Manufactured on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested to ensure production consistency.
  • Package and Mounting – 352-LBGA exposed pad, metal package (supplier device package: 352-MBGA, 35×35) designed for surface-mount assembly.
  • Power and Environmental – Operates from 2.375 V to 2.625 V supply and rated for commercial temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • PCI and PCI-based systems – Suitable for designs requiring 66-MHz PCI compliance and programmable logic for bus interfacing and protocol handling.
  • Compact PCI and hot-swappable modules – Supports hot-swappable Compact PCI applications where in-system reconfiguration and reliable I/O are needed.
  • Memory-interfaced systems – Useful for designs that need fast interfaces to external high-performance RAMs and on-chip RAM buffering.

Unique Advantages

  • Reprogrammable Architecture: SRAM-based configuration enables unlimited re-programmability for iterative development and in-field updates.
  • Balanced Logic and Memory: 6,912 logic elements paired with approximately 65 Kbits of embedded RAM supports a wide range of mid-density designs without external FPGA fabrics.
  • Advanced Clock Control: Four DLLs and a hierarchical clock-distribution network simplify multi-clock designs and reduce clock skew impacts.
  • Rich I/O Capability: Up to 260 I/O pins with multi-standard SelectIO support allow flexible interfacing to diverse peripherals and memories.
  • Proven Manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing provide consistent device quality for production programs.
  • Commercial-Grade Operating Range: Designed for 0 °C to 85 °C operation with a defined supply range of 2.375 V–2.625 V for predictable system behavior.

Why Choose XCV300-4BG352C?

The XCV300-4BG352C positions itself as a practical choice for commercial designs that require substantial programmable logic, flexible I/O, and reprogrammability. Its combination of 6,912 logic elements, embedded memory, robust clock management, and multi-standard I/O support makes it well suited to PCI-based boards, Compact PCI modules, and systems that interface to external high-performance RAM.

Backed by a mature 0.22 μm, 5‑layer-metal manufacturing process and full factory testing, this device offers designers predictable behavior and a platform that supports iterative development and in-system updates.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XCV300-4BG352C. Our team can assist with technical and procurement details to help integrate this FPGA into your design.

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