XCV300-4BG432C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,103 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-4BG432C – Virtex® FPGA, 432-LBGA
The XCV300-4BG432C is a Virtex® SRAM-based field programmable gate array supplied in a 432-LBGA exposed-pad metal package. It delivers mid-range programmable logic capacity with a combination of on-chip memory, abundant I/O, and built-in clock-management features suitable for performance-focused commercial applications.
Designed for designers requiring reprogrammable logic with robust development support, the device provides dedicated arithmetic resources, flexible I/O, and on-chip memory, packaged for surface-mount assembly and operation over a commercial temperature range.
Key Features
- Programmable Logic Approximately 6,912 logic elements and 322,970 system gates provide a balanced mix of speed and density for mid-range FPGA designs.
- Embedded Memory Approximately 65,536 bits of on-chip RAM support local buffering, state storage, and SelectRAM configurations.
- I/O Capacity and Interface Support 316 user I/O pins enable complex external interfacing; the Virtex series includes multi-standard SelectIO interface support for high-performance connectivity.
- Clock Management Built-in clock-management circuitry includes four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced timing control.
- Arithmetic and Logic Resources Dedicated carry logic, multiplier support, and cascade chaining facilitate high-speed arithmetic and wide-input functions.
- Configuration and Re-programmability SRAM-based in-system configuration with unlimited re-programmability and four programming modes allows iterative development and field updates.
- Package and Electrical 432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40), surface-mount mounting, and a core supply range of 2.375 V to 2.625 V.
- Operating Range and Compliance Commercial-grade operation from 0 °C to 85 °C and RoHS compliance; device is 100% factory tested per product specification.
- System and Test Features Includes IEEE 1149.1 boundary-scan logic and a die-temperature sensor diode to aid board-level test and monitoring.
Typical Applications
- High-performance digital processing Leverages on-chip multipliers, dedicated carry logic, and abundant logic elements for DSP and compute-intensive functions.
- PCI and CompactPCI systems Series-level support for 66-MHz PCI and hot-swappable CompactPCI operation makes the device a fit for modular system cards and backplane designs.
- Custom I/O and protocol bridging Large I/O count and multi-standard SelectIO interfaces enable protocol conversion, interface aggregation, and custom peripheral integration.
- In-system prototyping and iterative designs SRAM-based configuration and unlimited re-programmability support rapid prototyping, feature iteration, and field updates.
Unique Advantages
- Highly integrated logic and memory: Combines thousands of logic elements with substantial on-chip RAM to reduce external component count and simplify system architecture.
- Flexible clocking and timing control: Four DLLs and multiple clock distribution nets provide designers with advanced options for low-skew, multi-clock designs.
- Robust interfacing: Large I/O count and SelectIO capability support diverse external memory and peripheral connections without extensive glue logic.
- Field reprogrammability: SRAM-based configuration enables unlimited re-programmability and multiple programming modes for lifecycle flexibility.
- Compact surface-mount package: 432-LBGA exposed-pad metal package offers a compact footprint suitable for space-constrained board layouts while supporting thermal performance.
- Validated manufacturing and tool support: 100% factory tested device backed by Virtex development system support to streamline design and verification.
Why Choose XCV300-4BG432C?
The XCV300-4BG432C positions itself as a commercially graded Virtex FPGA that balances programmable logic density, embedded memory, and flexible I/O in a compact 432-LBGA package. Its combination of dedicated arithmetic resources, comprehensive clock management, and in-system reprogrammability makes it well suited for designers implementing mid-range, performance-oriented digital systems.
With series-level development support and factory-tested delivery, the device offers an approachable platform for prototyping, interface bridging, and modular system designs where reconfigurability and reliable production testing are priorities.
Request a quote or submit an RFQ for XCV300-4BG432C to initiate procurement and get pricing and availability information.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








