XCV300-4BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal

Quantity 1,103 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-4BG432C – Virtex® FPGA, 432-LBGA

The XCV300-4BG432C is a Virtex® SRAM-based field programmable gate array supplied in a 432-LBGA exposed-pad metal package. It delivers mid-range programmable logic capacity with a combination of on-chip memory, abundant I/O, and built-in clock-management features suitable for performance-focused commercial applications.

Designed for designers requiring reprogrammable logic with robust development support, the device provides dedicated arithmetic resources, flexible I/O, and on-chip memory, packaged for surface-mount assembly and operation over a commercial temperature range.

Key Features

  • Programmable Logic  Approximately 6,912 logic elements and 322,970 system gates provide a balanced mix of speed and density for mid-range FPGA designs.
  • Embedded Memory  Approximately 65,536 bits of on-chip RAM support local buffering, state storage, and SelectRAM configurations.
  • I/O Capacity and Interface Support  316 user I/O pins enable complex external interfacing; the Virtex series includes multi-standard SelectIO interface support for high-performance connectivity.
  • Clock Management  Built-in clock-management circuitry includes four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced timing control.
  • Arithmetic and Logic Resources  Dedicated carry logic, multiplier support, and cascade chaining facilitate high-speed arithmetic and wide-input functions.
  • Configuration and Re-programmability  SRAM-based in-system configuration with unlimited re-programmability and four programming modes allows iterative development and field updates.
  • Package and Electrical  432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40), surface-mount mounting, and a core supply range of 2.375 V to 2.625 V.
  • Operating Range and Compliance  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance; device is 100% factory tested per product specification.
  • System and Test Features  Includes IEEE 1149.1 boundary-scan logic and a die-temperature sensor diode to aid board-level test and monitoring.

Typical Applications

  • High-performance digital processing  Leverages on-chip multipliers, dedicated carry logic, and abundant logic elements for DSP and compute-intensive functions.
  • PCI and CompactPCI systems  Series-level support for 66-MHz PCI and hot-swappable CompactPCI operation makes the device a fit for modular system cards and backplane designs.
  • Custom I/O and protocol bridging  Large I/O count and multi-standard SelectIO interfaces enable protocol conversion, interface aggregation, and custom peripheral integration.
  • In-system prototyping and iterative designs  SRAM-based configuration and unlimited re-programmability support rapid prototyping, feature iteration, and field updates.

Unique Advantages

  • Highly integrated logic and memory: Combines thousands of logic elements with substantial on-chip RAM to reduce external component count and simplify system architecture.
  • Flexible clocking and timing control: Four DLLs and multiple clock distribution nets provide designers with advanced options for low-skew, multi-clock designs.
  • Robust interfacing: Large I/O count and SelectIO capability support diverse external memory and peripheral connections without extensive glue logic.
  • Field reprogrammability: SRAM-based configuration enables unlimited re-programmability and multiple programming modes for lifecycle flexibility.
  • Compact surface-mount package: 432-LBGA exposed-pad metal package offers a compact footprint suitable for space-constrained board layouts while supporting thermal performance.
  • Validated manufacturing and tool support: 100% factory tested device backed by Virtex development system support to streamline design and verification.

Why Choose XCV300-4BG432C?

The XCV300-4BG432C positions itself as a commercially graded Virtex FPGA that balances programmable logic density, embedded memory, and flexible I/O in a compact 432-LBGA package. Its combination of dedicated arithmetic resources, comprehensive clock management, and in-system reprogrammability makes it well suited for designers implementing mid-range, performance-oriented digital systems.

With series-level development support and factory-tested delivery, the device offers an approachable platform for prototyping, interface bridging, and modular system designs where reconfigurability and reliable production testing are priorities.

Request a quote or submit an RFQ for XCV300-4BG432C to initiate procurement and get pricing and availability information.

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