XCV300-4BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal

Quantity 663 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-4BG432I – Virtex FPGA IC, 316 I/O, 65,536-bit RAM, 6,912 Logic Elements

The XCV300-4BG432I is an industrial-grade Virtex Field Programmable Gate Array (FPGA) delivered in a 432-LBGA exposed-pad metal package. It provides a high-density, SRAM-based programmable logic platform with 6,912 logic elements, 65,536 bits of embedded RAM, and 316 user I/O pins for complex digital system designs.

Designed for applications that require high I/O bandwidth, flexible on-chip memory, and robust clocking, this device supports in-system configuration and advanced clock management features suitable for demanding industrial and system-level designs.

Key Features

  • Core Logic 6,912 logic elements and approximately 322,970 system gates deliver high-density programmable logic for complex digital functions.
  • Embedded Memory 65,536 bits of on-chip RAM provide fast local storage for buffers, FIFOs, and scratchpad memory.
  • I/O Capability 316 user I/O pins support extensive external connectivity for high-pin-count interfaces and system integration.
  • Clock Management Built-in clock-management circuitry includes multiple dedicated delay-locked loops (DLLs) and multi-tier global/local clock distribution for advanced timing control.
  • Arithmetic & Routing Support Dedicated carry logic, multiplier support, cascade chains, and abundant registers/latches enable efficient implementation of arithmetic, wide-input functions, and pipelined datapaths.
  • Configuration & Re-programmability SRAM-based in-system configuration supports unlimited re-programmability and multiple programming modes for flexible deployment and iterative development.
  • Package & Mounting 432-LBGA exposed pad, metal package (432-MBGA, 40×40) with surface-mount mounting type for high-density PCB assembly.
  • Power & Environmental Operating supply range 2.375 V to 2.625 V and industrial operating temperature range of −40 °C to 100 °C for reliable performance in industrial environments.
  • Design & Manufacturing Implemented in a 0.22 µm 5-layer-metal CMOS process and 100% factory tested to support production reliability and repeatability.

Typical Applications

  • High-performance system interfaces — Implement PCI/CompactPCI-style and other multi-standard interfaces using the device’s high I/O count and flexible clocking resources.
  • Custom logic and prototyping — Ideal for in-system configurable prototypes and custom digital processing where iterative re-programmability is required.
  • Memory and peripheral bridging — Use on-chip RAM and fast I/O for buffering and interfacing to external high-performance RAM and peripherals.
  • Industrial control and data acquisition — Industrial temperature rating and robust packaging support deployment in control and acquisition systems requiring sustained operation across temperature extremes.

Unique Advantages

  • High-density programmable fabric: 6,912 logic elements and ~323k system gates enable complex logic implementations without external ASICs.
  • Substantial on-chip RAM: 65,536 bits of embedded memory reduce external memory dependence and accelerate local data processing.
  • Extensive I/O: 316 I/O pins simplify integration with multiple peripherals and high-pin-count interfaces.
  • Advanced timing control: Dedicated DLLs and multi-level clock distribution support precise clocking and low-skew designs.
  • Industrial-rated operation: −40 °C to 100 °C operating range and surface-mount LBGA packaging support industrial system requirements.
  • Re-programmable and production-ready: SRAM-based configuration with multiple programming modes and 100% factory testing streamlines development and manufacturing cycles.

Why Choose XCV300-4BG432I?

The XCV300-4BG432I positions itself as a robust, industrial-grade FPGA option for designers who need a balanced combination of logic density, embedded memory, and high I/O capability. Its feature set—logical resources, on-chip RAM, advanced clocking, and in-system re-programmability—supports a wide range of system-level functions while enabling iterative design refinement.

This device is well suited to engineering teams building complex interfaces, custom digital processing blocks, and industrial control systems that benefit from a mature FPGA architecture and vendor development support.

Request a quote or submit an RFQ to receive pricing and availability details for the XCV300-4BG432I.

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