XCV300-4BG432I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 663 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-4BG432I – Virtex FPGA IC, 316 I/O, 65,536-bit RAM, 6,912 Logic Elements
The XCV300-4BG432I is an industrial-grade Virtex Field Programmable Gate Array (FPGA) delivered in a 432-LBGA exposed-pad metal package. It provides a high-density, SRAM-based programmable logic platform with 6,912 logic elements, 65,536 bits of embedded RAM, and 316 user I/O pins for complex digital system designs.
Designed for applications that require high I/O bandwidth, flexible on-chip memory, and robust clocking, this device supports in-system configuration and advanced clock management features suitable for demanding industrial and system-level designs.
Key Features
- Core Logic 6,912 logic elements and approximately 322,970 system gates deliver high-density programmable logic for complex digital functions.
- Embedded Memory 65,536 bits of on-chip RAM provide fast local storage for buffers, FIFOs, and scratchpad memory.
- I/O Capability 316 user I/O pins support extensive external connectivity for high-pin-count interfaces and system integration.
- Clock Management Built-in clock-management circuitry includes multiple dedicated delay-locked loops (DLLs) and multi-tier global/local clock distribution for advanced timing control.
- Arithmetic & Routing Support Dedicated carry logic, multiplier support, cascade chains, and abundant registers/latches enable efficient implementation of arithmetic, wide-input functions, and pipelined datapaths.
- Configuration & Re-programmability SRAM-based in-system configuration supports unlimited re-programmability and multiple programming modes for flexible deployment and iterative development.
- Package & Mounting 432-LBGA exposed pad, metal package (432-MBGA, 40×40) with surface-mount mounting type for high-density PCB assembly.
- Power & Environmental Operating supply range 2.375 V to 2.625 V and industrial operating temperature range of −40 °C to 100 °C for reliable performance in industrial environments.
- Design & Manufacturing Implemented in a 0.22 µm 5-layer-metal CMOS process and 100% factory tested to support production reliability and repeatability.
Typical Applications
- High-performance system interfaces — Implement PCI/CompactPCI-style and other multi-standard interfaces using the device’s high I/O count and flexible clocking resources.
- Custom logic and prototyping — Ideal for in-system configurable prototypes and custom digital processing where iterative re-programmability is required.
- Memory and peripheral bridging — Use on-chip RAM and fast I/O for buffering and interfacing to external high-performance RAM and peripherals.
- Industrial control and data acquisition — Industrial temperature rating and robust packaging support deployment in control and acquisition systems requiring sustained operation across temperature extremes.
Unique Advantages
- High-density programmable fabric: 6,912 logic elements and ~323k system gates enable complex logic implementations without external ASICs.
- Substantial on-chip RAM: 65,536 bits of embedded memory reduce external memory dependence and accelerate local data processing.
- Extensive I/O: 316 I/O pins simplify integration with multiple peripherals and high-pin-count interfaces.
- Advanced timing control: Dedicated DLLs and multi-level clock distribution support precise clocking and low-skew designs.
- Industrial-rated operation: −40 °C to 100 °C operating range and surface-mount LBGA packaging support industrial system requirements.
- Re-programmable and production-ready: SRAM-based configuration with multiple programming modes and 100% factory testing streamlines development and manufacturing cycles.
Why Choose XCV300-4BG432I?
The XCV300-4BG432I positions itself as a robust, industrial-grade FPGA option for designers who need a balanced combination of logic density, embedded memory, and high I/O capability. Its feature set—logical resources, on-chip RAM, advanced clocking, and in-system re-programmability—supports a wide range of system-level functions while enabling iterative design refinement.
This device is well suited to engineering teams building complex interfaces, custom digital processing blocks, and industrial control systems that benefit from a mature FPGA architecture and vendor development support.
Request a quote or submit an RFQ to receive pricing and availability details for the XCV300-4BG432I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








