XCV300-4BG352I

The XCV300-4BG352I is a Virtex® SRAM-based Field Programmable Gate Array (FPGA) optimized for high-density, reprogrammable digital logic. It provides a balanced combination of logic capacity, embedded memory, I/O count and clock-management features suitable for complex system designs and programmable logic implementations.

Built on the Virtex architecture, this device targets applications requiring fast, flexible interconnect and in-system configurability, backed by vendor development tools and support for multiple configuration modes.

Key Features

• Programmable Logic Capacity — 6,912 logic elements (as specified), supporting moderate-density designs and complex logic implementations.
• Embedded Memory — 65,536 bits of on-chip RAM, providing local storage for buffering, FIFOs or small data structures.
• I/O Resources — 260 user I/O pins to interface with system peripherals and external memory or devices.
• Gate Equivalence — 322,970 system gates for estimating integration level and design partitioning.
• Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs), multiple global and local clock distribution nets for advanced clock control and low-skew routing.
• Multi-standard I/O — SelectIO™ multi-standard interfaces with a broad set of supported interface standards for flexible connectivity.
• Arithmetic and Logic Support — Dedicated carry logic and multiplier support for high-speed arithmetic and DSP-style functions.
• SRAM-based In-System Configuration — Unlimited re-programmability with four programming modes for flexible deployment and iterative development.
• Package and Mounting — 352-LBGA exposed pad, metal package (supplier package: 352-MBGA, 35×35) designed for surface-mount assembly.
• Power and Temperature — Supply voltage range 2.375 V to 2.625 V and industrial operating temperature range from −40°C to 100°C.
• Quality and Testing — 100% factory tested as part of the Virtex family product specification.

Typical Applications

• PCI-based Systems — Supports designs requiring PCI compatibility (datasheet notes 66-MHz PCI compliance) and integration with PCI-capable subsystems.
• CompactPCI and Hot-Swappable Designs — Suitable for CompactPCI environments where hot-swap capability is required, as indicated in product documentation.
• High-Speed Digital Processing — Use where dedicated carry logic, multiplier support and on-chip RAM accelerate arithmetic and data-path functions.
• Reconfigurable System Prototyping — SRAM-based, in-system reprogrammability enables iterative development and field updates for complex digital designs.

Unique Advantages

• Balanced Integration: Combines 6,912 logic elements, 65,536 bits of embedded memory and 260 I/O pins to support complex, multi-interface designs without excessive external glue logic.
• Flexible Clocking: Four DLLs and multiple clock distribution nets enable advanced clock control and low-skew designs for synchronous systems.
• Re-programmable Architecture: SRAM-based configuration with unlimited re-programmability and four programming modes simplifies development cycles and field updates.
• Multi-standard I/O Support: SelectIO interfaces provide broad connectivity options to match diverse external device standards.
• Industrial Temperature Range: Rated for −40°C to 100°C and classified as industrial grade, making it suitable for a wide range of temperature-demanding applications.
• Proven Ecosystem: Supported by vendor development systems and design tools referenced in the product documentation to streamline design implementation and verification.

Why Choose XCV300-4BG352I?

The XCV300-4BG352I positions itself as a flexible, reprogrammable solution for designers who need a moderate-density Virtex FPGA with comprehensive I/O, embedded memory and robust clocking resources. Its combination of logic capacity, on-chip RAM and dedicated arithmetic resources supports a variety of system-level functions while the SRAM-based configuration offers iterative development and field update capabilities.

With industrial temperature capability, a compact 352-LBGA exposed-pad package and full factory testing, this device is suited for production and development environments that require dependable, reconfigurable logic backed by the Virtex product family documentation and tool support.

Please request a quote or submit an inquiry to receive pricing, availability and additional technical support information for the XCV300-4BG352I. Representatives are available to assist with quoting and order placement.