XCV300-4BG432C4307

The XCV300-4BG432C4307 from AMD is a commercial-grade Field Programmable Gate Array (FPGA) supplied in a 432-LBGA exposed pad metal package. It integrates 1,536 CLBs delivering 6,912 logic elements, approximately 0.065 Mbits of embedded memory (65,536 bits) and 316 user I/O pins, providing a compact, mid-density programmable fabric for custom logic implementations.

Designed for surface-mount assembly and operating from a 2.375 V to 2.625 V supply with an ambient temperature range of 0 °C to 85 °C, this device targets commercial electronic designs that require a balance of logic capacity, I/O count and a compact ball-grid array package.

Key Features

• Logic Capacity 1,536 CLBs providing a total of 6,912 logic elements and approximately 322,970 gates for implementing moderate-complexity digital functions.
• Embedded Memory Approximately 0.065 Mbits of on-chip RAM (65,536 bits) for local data buffering and state retention within user logic.
• I/O Resources 316 available I/O pins to support multiple parallel interfaces and external device connections.
• Power Supply Single supply voltage specification from 2.375 V to 2.625 V to match compatible system power domains.
• Package and Mounting 432-LBGA exposed pad, metal package (supplier device package: 432-MBGA, 40×40) optimized for surface-mount PCB assembly and thermal conduction.
• Thermal and Product Grade Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Gate Count Approximately 322,970 gates to quantify overall logic resource scale for design planning.
• RoHS Compliant Device is RoHS compliant, supporting regulatory material requirements for many commercial applications.

Unique Advantages

• Balanced logic and I/O resources: The combination of 6,912 logic elements and 316 I/Os supports designs that need moderate internal logic and substantial external connectivity without a larger package.
• Compact BGA footprint: The 432-LBGA (40×40) package provides a high-pin-count solution in a space-efficient form factor suited to dense PCB layouts.
• Embedded memory for local buffering: 65,536 bits of on-chip RAM enable localized data storage for state machines, FIFOs or small buffers, reducing external memory dependency.
• Defined commercial operating range: Rated for 0 °C to 85 °C, this part fits standard commercial environments and product lifecycles.
• Predictable power requirements: A narrow supply range (2.375 V–2.625 V) simplifies supply design and voltage budgeting in system power architectures.
• Regulatory material compliance: RoHS compliance supports use in assemblies that require lead-free and restricted-substance adherence.

Why Choose XCV300-4BG432C4307?

The XCV300-4BG432C4307 provides a mid-range FPGA resource set—6,912 logic elements, significant gate count and 316 I/Os—packaged in a compact 432-LBGA exposed pad metal package. Its combination of on-chip RAM, defined power requirements and commercial temperature rating makes it a suitable option for commercial electronic designs that need a programmable logic device with a balanced mix of logic density and I/O capacity.

For engineers and procurement teams targeting solutions that require predictable power envelopes, moderate embedded memory and a high I/O count in a space-efficient package, this AMD FPGA offers a clear, specification-driven choice with RoHS compliance for commercial assemblies.

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