XCV300-4FG456I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 312 65536 6912 456-BBGA |
|---|---|
| Quantity | 330 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 312 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-4FG456I – Virtex® FPGA, 312 I/O, ~65,536-bit RAM, 6,912 logic elements, 456-BBGA
The XCV300-4FG456I is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-density, reprogrammable logic integration. It delivers 6,912 logic elements and approximately 65,536 bits of embedded RAM in a 456-ball BGA package, providing a compact, surface-mount solution for industrial-grade programmable logic applications.
Designed for system-level deployments that require flexible I/O, on-chip memory and robust clock management, this device supports applications such as PCI-compliant interfaces, Compact PCI hot-swap designs and other high-performance digital systems that benefit from in-system configurability.
Key Features
- Core Logic 6,912 logic elements (cells) and approximately 322,970 system gates provide substantial programmable logic capacity for complex designs.
- Embedded Memory Approximately 65,536 bits of on-chip RAM for LUT-based RAM and block RAM use, plus support for SelectRAM+ configurations as described for the Virtex family.
- I/O Capacity & Standards 312 user I/O pins to support a wide range of system interfaces; family-level SelectIO™ support and multi-standard interface capability are part of the Virtex architecture.
- Clock Management Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and additional local clock nets for advanced timing control.
- Arithmetic & DSP Support Dedicated carry logic and multiplier support enable efficient implementation of high-speed arithmetic and DSP functions on-chip.
- Configuration & Re-programmability SRAM-based in-system configuration with multiple programming modes allows unlimited re-programmability and flexible configuration flows.
- Package & Mounting Surface-mount 456-BBGA package (supplier package: 456-FBGA, 23×23) for high-density board-level integration.
- Power & Voltage Core supply range specified at 2.375 V to 2.625 V.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
- Manufacturing & Compliance 100% factory tested and RoHS compliant.
Typical Applications
- PCI and Compact PCI Systems The Virtex family supports 66‑MHz PCI compliance and Compact PCI hot-swap capability, making this device suitable for PCI-based expansion cards and chassis-based systems.
- High-Performance Digital Processing Built-in multiplier support, dedicated carry logic and abundant on-chip RAM make the device well-suited for DSP and compute-intensive tasks.
- Custom I/O and Interface Bridging With 312 I/O pins and multi-standard interface support, the FPGA can implement protocol bridging, custom peripherals and interface translation functions.
- In-System Reconfigurable Logic SRAM-based, reprogrammable architecture enables iterative development, field updates and adaptive hardware functions in deployed systems.
Unique Advantages
- High integration density: 6,912 logic elements and ~65,536 bits of embedded RAM reduce external component count and simplify board-level design.
- Robust clocking resources: Multiple DLLs and hierarchical clock nets provide precise clock control for timing-critical designs.
- Flexible I/O and interfacing: Large I/O count and Virtex family SelectIO capabilities support a broad set of interface standards and device topologies.
- Industrial-temperature operation: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
- Re-programmable architecture: SRAM-based configuration enables in-system updates and design iteration without hardware changes.
- Proven manufacturing pedigree: Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested for consistent device quality.
Why Choose XCV300-4FG456I?
The XCV300-4FG456I combines substantial programmable logic capacity, on-chip embedded memory and a broad I/O complement in a compact 456‑ball BGA package, positioning it for industrial applications that demand reprogrammability, interface flexibility and reliable operation across a wide temperature range. Its built-in clock-management and arithmetic support help designers implement timing-sensitive and compute-heavy functions without excessive external circuitry.
Supported by Virtex family-level development resources and in-system configuration modes, this device offers a pragmatic balance of performance, integration and configurability for teams developing PCI-capable systems, DSP subsystems, interface bridges and other complex digital designs.
Request a quote or submit an RFQ for the XCV300-4FG456I to begin procurement and evaluate how this Virtex FPGA can be integrated into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








