XCV300-4FG456I

IC FPGA 312 I/O 456FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 312 65536 6912 456-BBGA

Quantity 330 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O312Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-4FG456I – Virtex® FPGA, 312 I/O, ~65,536-bit RAM, 6,912 logic elements, 456-BBGA

The XCV300-4FG456I is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-density, reprogrammable logic integration. It delivers 6,912 logic elements and approximately 65,536 bits of embedded RAM in a 456-ball BGA package, providing a compact, surface-mount solution for industrial-grade programmable logic applications.

Designed for system-level deployments that require flexible I/O, on-chip memory and robust clock management, this device supports applications such as PCI-compliant interfaces, Compact PCI hot-swap designs and other high-performance digital systems that benefit from in-system configurability.

Key Features

  • Core Logic  6,912 logic elements (cells) and approximately 322,970 system gates provide substantial programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 65,536 bits of on-chip RAM for LUT-based RAM and block RAM use, plus support for SelectRAM+ configurations as described for the Virtex family.
  • I/O Capacity & Standards  312 user I/O pins to support a wide range of system interfaces; family-level SelectIO™ support and multi-standard interface capability are part of the Virtex architecture.
  • Clock Management  Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and additional local clock nets for advanced timing control.
  • Arithmetic & DSP Support  Dedicated carry logic and multiplier support enable efficient implementation of high-speed arithmetic and DSP functions on-chip.
  • Configuration & Re-programmability  SRAM-based in-system configuration with multiple programming modes allows unlimited re-programmability and flexible configuration flows.
  • Package & Mounting  Surface-mount 456-BBGA package (supplier package: 456-FBGA, 23×23) for high-density board-level integration.
  • Power & Voltage  Core supply range specified at 2.375 V to 2.625 V.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Manufacturing & Compliance  100% factory tested and RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems  The Virtex family supports 66‑MHz PCI compliance and Compact PCI hot-swap capability, making this device suitable for PCI-based expansion cards and chassis-based systems.
  • High-Performance Digital Processing  Built-in multiplier support, dedicated carry logic and abundant on-chip RAM make the device well-suited for DSP and compute-intensive tasks.
  • Custom I/O and Interface Bridging  With 312 I/O pins and multi-standard interface support, the FPGA can implement protocol bridging, custom peripherals and interface translation functions.
  • In-System Reconfigurable Logic  SRAM-based, reprogrammable architecture enables iterative development, field updates and adaptive hardware functions in deployed systems.

Unique Advantages

  • High integration density: 6,912 logic elements and ~65,536 bits of embedded RAM reduce external component count and simplify board-level design.
  • Robust clocking resources: Multiple DLLs and hierarchical clock nets provide precise clock control for timing-critical designs.
  • Flexible I/O and interfacing: Large I/O count and Virtex family SelectIO capabilities support a broad set of interface standards and device topologies.
  • Industrial-temperature operation: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
  • Re-programmable architecture: SRAM-based configuration enables in-system updates and design iteration without hardware changes.
  • Proven manufacturing pedigree: Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested for consistent device quality.

Why Choose XCV300-4FG456I?

The XCV300-4FG456I combines substantial programmable logic capacity, on-chip embedded memory and a broad I/O complement in a compact 456‑ball BGA package, positioning it for industrial applications that demand reprogrammability, interface flexibility and reliable operation across a wide temperature range. Its built-in clock-management and arithmetic support help designers implement timing-sensitive and compute-heavy functions without excessive external circuitry.

Supported by Virtex family-level development resources and in-system configuration modes, this device offers a pragmatic balance of performance, integration and configurability for teams developing PCI-capable systems, DSP subsystems, interface bridges and other complex digital designs.

Request a quote or submit an RFQ for the XCV300-4FG456I to begin procurement and evaluate how this Virtex FPGA can be integrated into your next design.

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