XCV300-5BG352C

The XCV300-5BG352C is an SRAM-based Virtex Field Programmable Gate Array designed for high-performance, high-capacity programmable logic applications. It integrates a balanced architecture of configurable logic, on-chip RAM, and extensive I/O to support complex digital systems.

This device targets commercial embedded and system applications that require reprogrammability, substantial logic density, and advanced clock and memory management. Its combination of roughly 6,912 logic elements, approximately 65 Kbits of embedded memory, and 260 I/O positions it for use in PCI-class systems, high-performance embedded designs, and custom logic implementations.

Key Features

• Core Logic — Approximately 6,912 logic elements (CLB-based architecture) and about 322,970 system gates for consolidating complex logic functions.
• Embedded Memory — Total on-chip RAM of 65,536 bits (approximately 64 Kbits) with hierarchical memory options including LUT-configurable RAM and synchronous dual-ported RAMs.
• I/O Capacity — 260 available I/O pins suitable for high-pin-count interfacing and multi-standard I/O use.
• Clock Management — Built-in clock-management circuitry with four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced clock control.
• Configuration and Reprogrammability — SRAM-based in-system configuration enables unlimited re-programmability and multiple programming modes.
• Performance & Standards — Family-level capabilities include system performance up to 200 MHz and 66-MHz PCI compliance where applicable.
• Package & Mounting — 352-LBGA exposed pad, metal package; supplier device package listed as 352-MBGA (35x35). Surface-mount mounting type.
• Power & Operating Range — Voltage supply range of 2.375 V to 2.625 V; commercial operating temperature range from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• PCI and Compact PCI systems — Suited for designs requiring 66-MHz PCI compliance and hot-swap capability in Compact PCI environments.
• High-performance embedded systems — Use where up to 200 MHz system performance and extensive logic capacity are required for signal processing or control tasks.
• Memory-centric custom logic — Ideal for designs that leverage configurable LUT RAM, block RAMs, and synchronous dual-ported RAMs for buffering and data manipulation.
• General-purpose programmable logic — Applicable to prototyping, custom protocol implementation, and systems requiring in-field reprogramming.

Unique Advantages

• Reprogrammable SRAM architecture: Enables unlimited reconfiguration for iterative development and field updates.
• Comprehensive clock control: Four DLLs and a multi-tier clock distribution network simplify timing and synchronization across large designs.
• Significant I/O and integration: 260 I/Os combined with a 352-LBGA package reduce external glue logic and support dense system interconnects.
• Balanced capacity and performance: ~6,912 logic elements and ~322,970 gates provide a compromise of logic density and speed for medium-to-large designs.
• Rich memory options: Hierarchical and configurable on-chip RAM supports diverse data storage and buffering strategies within the FPGA fabric.
• Commercial-ready compliance: RoHS compliant and rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.

Why Choose XCV300-5BG352C?

The XCV300-5BG352C offers a practical balance of logic capacity, embedded memory, and I/O resources for commercial embedded and system-level FPGA applications. Its SRAM-based reprogrammability and built-in clock and memory features make it suited for designs that require iterative development, in-field updates, and refined timing control.

This device is appropriate for engineering teams and system designers who need a medium-to-high density Virtex FPGA with clear electrical and environmental specifications (2.375–2.625 V supply, 0 °C to 85 °C operating range) and a high-pin-count package for dense system integration.

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