XCV300-5FG456C

IC FPGA 312 I/O 456FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 312 65536 6912 456-BBGA

Quantity 302 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O312Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-5FG456C – Virtex FPGA, 312 I/O, ~65 kbit RAM, 6,912 logic elements, 456‑BBGA

The XCV300-5FG456C is an SRAM-based Virtex field programmable gate array supplied in a 456-ball BGA package. It combines a high-density logic fabric with on-chip memory and rich I/O to address high-performance, reconfigurable system designs where integration and flexible interfacing are required.

Designed for applications that need programmable logic, multi-standard I/O and on-chip memory, the device balances density and performance while supporting in-system re-programmability and established development toolchains.

Key Features

  • Logic Capacity — 6,912 logic elements providing substantial programmable logic resources for complex designs; approximately 322,970 system gates.
  • On-chip Memory — Approximately 65,536 bits of embedded RAM with hierarchical memory options and LUTs that can be configured as various RAM types including dual-ported and shift-register modes.
  • I/O and Interface Support — 312 user I/O pins and multi-standard SelectIO support with 16 high-performance interface standards for flexible external device connectivity.
  • Clock Management — Built-in clock circuitry including four delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced timing control.
  • Arithmetic & DSP Support — Dedicated carry logic and multiplier support to accelerate high-speed arithmetic functions and DSP-oriented tasks.
  • Configuration & Re-programmability — SRAM-based architecture with in-system configuration and four programming modes enabling unlimited re-programmability.
  • Package & Mounting — 456‑FBGA (23 × 23 mm) package, surface-mount mounting for compact board integration.
  • Electrical & Environmental — Recommended supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
  • Process & Quality — Implemented in a 0.22 μm, 5‑layer metal CMOS process and fully factory tested.
  • System Interfaces — Family-level features include 66‑MHz PCI compliance and support for Compact PCI hot-swap configurations (as documented for the Virtex family).

Typical Applications

  • High‑performance system prototyping — Use the device to implement and iterate complex digital designs where re-programmability and high logic density accelerate development.
  • Interface bridging and protocol conversion — Multi-standard SelectIO and a large number of I/Os make the device suitable for bridging disparate high‑speed interfaces.
  • PCI and Compact PCI systems — With documented 66‑MHz PCI compatibility and Compact PCI hot-swap support at the family level, the device fits legacy and embedded bus applications.
  • Arithmetic acceleration and DSP — Dedicated carry chains and multiplier support enable implementation of high-speed arithmetic blocks and signal-processing functions.

Unique Advantages

  • Highly reconfigurable architecture: SRAM-based design supports in-system re-programmability through multiple configuration modes, enabling iterative design updates without hardware changes.
  • Rich clock and timing resources: Multiple DLLs and global/local clock nets simplify implementation of complex timing domains and low-skew clock distribution.
  • Flexible memory options: Hierarchical on-chip memory and configurable LUT RAM modes reduce the need for external memory in many control and buffering tasks.
  • Extensive I/O flexibility: 312 I/Os with multi-standard SelectIO support facilitate direct interfacing to a wide range of peripherals and memory devices.
  • Compact, board-friendly package: 456‑FBGA (23 × 23 mm) surface-mount package provides high pin density in a compact footprint for space-constrained designs.
  • Proven development ecosystem: Supported by established FPGA development systems and libraries for design, synthesis and place-and-route workflows.

Why Choose XCV300-5FG456C?

The XCV300-5FG456C delivers a balanced combination of logic capacity, embedded memory and flexible I/O in a compact BGA package, making it well suited for designers who need reconfigurable hardware with significant on-chip resources. Its built-in clock management, dedicated arithmetic support and multi-standard I/O support simplify implementation of performance-sensitive subsystems.

This device is aimed at engineering teams building high-performance, reprogrammable systems that benefit from an established development ecosystem and the ability to iterate designs in-system. The combination of factory-tested silicon, RoHS compliance and documented family-level interfaces supports reliable integration into commercial products.

Request a quote or submit an inquiry to receive pricing and availability for the XCV300-5FG456C and to discuss how it can fit into your next programmable logic design.

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