XCV300-5FG456C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 312 65536 6912 456-BBGA |
|---|---|
| Quantity | 302 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 312 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-5FG456C – Virtex FPGA, 312 I/O, ~65 kbit RAM, 6,912 logic elements, 456‑BBGA
The XCV300-5FG456C is an SRAM-based Virtex field programmable gate array supplied in a 456-ball BGA package. It combines a high-density logic fabric with on-chip memory and rich I/O to address high-performance, reconfigurable system designs where integration and flexible interfacing are required.
Designed for applications that need programmable logic, multi-standard I/O and on-chip memory, the device balances density and performance while supporting in-system re-programmability and established development toolchains.
Key Features
- Logic Capacity — 6,912 logic elements providing substantial programmable logic resources for complex designs; approximately 322,970 system gates.
- On-chip Memory — Approximately 65,536 bits of embedded RAM with hierarchical memory options and LUTs that can be configured as various RAM types including dual-ported and shift-register modes.
- I/O and Interface Support — 312 user I/O pins and multi-standard SelectIO support with 16 high-performance interface standards for flexible external device connectivity.
- Clock Management — Built-in clock circuitry including four delay-locked loops (DLLs) plus multiple global and local clock distribution nets for advanced timing control.
- Arithmetic & DSP Support — Dedicated carry logic and multiplier support to accelerate high-speed arithmetic functions and DSP-oriented tasks.
- Configuration & Re-programmability — SRAM-based architecture with in-system configuration and four programming modes enabling unlimited re-programmability.
- Package & Mounting — 456‑FBGA (23 × 23 mm) package, surface-mount mounting for compact board integration.
- Electrical & Environmental — Recommended supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
- Process & Quality — Implemented in a 0.22 μm, 5‑layer metal CMOS process and fully factory tested.
- System Interfaces — Family-level features include 66‑MHz PCI compliance and support for Compact PCI hot-swap configurations (as documented for the Virtex family).
Typical Applications
- High‑performance system prototyping — Use the device to implement and iterate complex digital designs where re-programmability and high logic density accelerate development.
- Interface bridging and protocol conversion — Multi-standard SelectIO and a large number of I/Os make the device suitable for bridging disparate high‑speed interfaces.
- PCI and Compact PCI systems — With documented 66‑MHz PCI compatibility and Compact PCI hot-swap support at the family level, the device fits legacy and embedded bus applications.
- Arithmetic acceleration and DSP — Dedicated carry chains and multiplier support enable implementation of high-speed arithmetic blocks and signal-processing functions.
Unique Advantages
- Highly reconfigurable architecture: SRAM-based design supports in-system re-programmability through multiple configuration modes, enabling iterative design updates without hardware changes.
- Rich clock and timing resources: Multiple DLLs and global/local clock nets simplify implementation of complex timing domains and low-skew clock distribution.
- Flexible memory options: Hierarchical on-chip memory and configurable LUT RAM modes reduce the need for external memory in many control and buffering tasks.
- Extensive I/O flexibility: 312 I/Os with multi-standard SelectIO support facilitate direct interfacing to a wide range of peripherals and memory devices.
- Compact, board-friendly package: 456‑FBGA (23 × 23 mm) surface-mount package provides high pin density in a compact footprint for space-constrained designs.
- Proven development ecosystem: Supported by established FPGA development systems and libraries for design, synthesis and place-and-route workflows.
Why Choose XCV300-5FG456C?
The XCV300-5FG456C delivers a balanced combination of logic capacity, embedded memory and flexible I/O in a compact BGA package, making it well suited for designers who need reconfigurable hardware with significant on-chip resources. Its built-in clock management, dedicated arithmetic support and multi-standard I/O support simplify implementation of performance-sensitive subsystems.
This device is aimed at engineering teams building high-performance, reprogrammable systems that benefit from an established development ecosystem and the ability to iterate designs in-system. The combination of factory-tested silicon, RoHS compliance and documented family-level interfaces supports reliable integration into commercial products.
Request a quote or submit an inquiry to receive pricing and availability for the XCV300-5FG456C and to discuss how it can fit into your next programmable logic design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








