XCV300-6BG352C

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 65536 6912 352-LBGA Exposed Pad, Metal

Quantity 938 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-6BG352C – Virtex® FPGA, 6,912 Logic Elements, 65,536-bit RAM, 260 I/O, 352-LBGA

The XCV300-6BG352C is a Virtex® Field Programmable Gate Array (FPGA) in a 352-LBGA exposed-pad metal package designed for commercial applications. It provides a balance of high-density programmable logic, embedded memory, and a large I/O count for complex digital designs.

Built on the Virtex architecture, this SRAM-based FPGA supports in-system reconfiguration and is suited for performance-driven applications such as PCI-compliant systems, high-performance digital processing, and compact, reprogrammable logic implementations.

Key Features

  • Logic Capacity — 6,912 logic elements and approximately 322,970 system gates provide substantial programmable logic for complex designs.
  • Embedded Memory — 65,536 bits of on-chip RAM (approximately 64 Kbits) with LUTs that can be configured as various RAM types, dual-ported RAMs, or shift registers for flexible memory architectures.
  • I/O and Interface Support — 260 general-purpose I/O pins and multi-standard SelectIO interfaces for broad connectivity and protocol flexibility. The device supports direct connections to a range of high-performance memories and interfaces.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clocks and 24 secondary local clock nets enable advanced clock control and low-skew distribution.
  • Programmable Routing & Arithmetic Support — Dedicated carry logic, multiplier support, cascade chains for wide-input functions, and abundant registers/latches for high-speed arithmetic and control paths.
  • Configuration & Test — SRAM-based in-system configuration with multiple programming modes, IEEE 1149.1 boundary-scan logic for testability, and 100% factory-tested devices.
  • Process & Reliability — Manufactured in a 0.22 μm, 5-layer metal CMOS process; includes a die-temperature sensor diode for on-die thermal monitoring.
  • Package & Supply — Surface-mount 352-LBGA exposed pad metal package (supplier package: 352-MBGA 35×35). Recommended supply voltage: 2.375 V to 2.625 V. Operating temperature: 0 °C to 85 °C (commercial grade). RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems — PCI-compliant operation (66 MHz) and hot‑swappable support for Compact PCI make this device suitable for slot-based system modules and backplane designs.
  • High-Performance Digital Processing — With up to 200 MHz system performance indicated for the Virtex family and dedicated arithmetic resources, the device is appropriate for demanding digital signal and control tasks.
  • In-System Reprogrammable Logic — SRAM-based configuration enables field updates, prototyping, and iterative development workflows where reprogramming and design evolution are required.
  • Interface Bridging and Protocol Conversion — High I/O count and multi-standard SelectIO capability support protocol bridging, bus interfacing, and custom peripheral integration.

Unique Advantages

  • High-density programmable fabric: 6,912 logic elements and ~322,970 gates provide the capacity to integrate complex functions that reduce external components.
  • Flexible embedded memory: 65,536 bits of on-chip RAM with configurable LUT-based RAM and dual-ported options lets designers tailor memory structures to algorithm needs.
  • Extensive I/O connectivity: 260 I/O pins and multi-standard interface support enable direct interfacing to a wide range of peripherals and external memories.
  • Advanced clocking resources: Four DLLs and a hierarchical clock distribution enable precise timing control across large designs.
  • In-system configurability and test: SRAM-based configuration modes and IEEE 1149.1 boundary-scan support simplify development, updates, and manufacturing test.
  • Commercial-grade thermal and power specs: Surface-mount 352-LBGA package with supply 2.375–2.625 V and operating range 0 °C to 85 °C aligns with standard commercial electronics environments.

Why Choose XCV300-6BG352C?

The XCV300-6BG352C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 352-LBGA package, making it suitable for designers who require reprogrammable, high-performance logic in commercial applications. As part of the Virtex family, it benefits from architecture features such as dedicated arithmetic resources, robust clock management, and a hierarchical routing fabric.

Supported by established FPGA development systems, this device is a practical choice for teams focused on reducing board-level complexity, accelerating prototyping cycles, and maintaining the flexibility to iterate designs in-system.

Request a quote or submit an inquiry for the XCV300-6BG352C to get pricing and availability details tailored to your project needs.

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