XCV300E-6BG352C

The XCV300E-6BG352C is a Virtex®-E field programmable gate array (FPGA) supplied in a 352-LBGA exposed pad package. It provides a mid-range FPGA fabric with 6,912 logic elements, approximately 0.13 Mbits of embedded memory, and up to 260 I/O pins for dense system interfacing.

Designed for commercial-temperature embedded and system applications, this Virtex‑E device delivers reprogrammable logic, flexible I/O support, and advanced clock management features available across the Virtex‑E family to address high-performance interfaces and memory-centric designs.

Key Features

• Logic Capacity — 6,912 logic elements and approximately 411,955 gates provide programmable logic density for medium-complexity designs.
• Embedded Memory — Total on-chip RAM of 131,072 bits (approximately 0.13 Mbits) for distributed and block memory requirements.
• I/O Density and Flexibility — Up to 260 I/Os support wide external interfacing; family-level SelectI/O+ technology supports multiple high-performance interface standards and differential signalling.
• Clocking and Timing (family features) — Virtex‑E family includes advanced clock management such as up to eight digital DLLs for flexible clock multiplication/division and DDR timing support.
• Voltage and Power — Internal supply VCCINT operating range of 1.71 V to 1.89 V, enabling low‑voltage core operation.
• Package and Mounting — 352-LBGA exposed pad, metal package in a 35×35 ball array for surface-mount assembly and enhanced thermal path via exposed pad.
• Operating Temperature — Commercial grade operation over 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance system interfaces: Use the device's abundant I/O and family-level differential signalling support for bridging and protocol handling in systems requiring wide data buses or serial interfaces.
• External memory controllers: Implement memory interface logic and custom controllers leveraging on-chip RAM and the Virtex‑E family’s architecture for interfacing to SRAM or SDRAM devices.
• Reconfigurable prototyping and mid-sized logic integration: Ideal for prototypes and production designs that need in-system reprogrammability and flexible logic resources without moving to larger FPGA families.

Unique Advantages

• Right‑sized logic density: 6,912 logic elements and ~412k gates provide a balanced capacity for medium-complexity designs, reducing the need for larger, more costly devices.
• Compact thermal-capable packaging: The 352-LBGA exposed pad metal package supports surface-mount assembly while providing a low-impedance thermal path for reliable operation.
• High I/O count: Up to 260 I/Os enable broad external connectivity, simplifying system interfaces and reducing additional I/O expander requirements.
• Low‑voltage core operation: The 1.71–1.89 V supply range supports low-voltage core designs, contributing to reduced core power consumption.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial embedded and system applications.
• RoHS compliance: Conforms to RoHS requirements for environmental and manufacturing considerations.

Why Choose XCV300E-6BG352C?

The XCV300E-6BG352C provides a practical balance of logic capacity, embedded memory, and high I/O density in a compact 352-LBGA exposed‑pad package. It is suited to designs that require reprogrammable logic, flexible interfacing, and the family-level clocking and I/O features characteristic of the Virtex‑E series.

This device is aimed at engineers and teams building medium-complexity systems where in-system configurability, substantial I/O, and controlled thermal performance are important. Support from the Virtex‑E family development ecosystem helps accelerate bring-up and integration into larger system designs.

Request a quote or submit an inquiry for XCV300E-6BG352C to receive pricing and availability information tailored to your design and production needs.