XCV300E-6FG256C

The XCV300E-6FG256C is an SRAM-based Virtex®-E field programmable gate array (FPGA) offered in a 256-ball BGA (17 × 17) package for surface-mount applications. It provides reprogrammable logic resources and flexible I/O suited to designs that require high integration of custom digital logic, on-chip memory, and high-performance interfaces.

Designed as part of the Virtex-E 1.8 V family, this commercial-grade device targets applications that benefit from selectable I/O standards, embedded memory, and on-chip clock management while operating within a 1.71 V to 1.89 V core supply and a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity  Provides 6,912 logic elements (equivalent to 411,955 system gates) for implementing custom digital functions and control logic.
• Embedded Memory  Includes 131,072 bits of on-chip RAM (approximately 0.13 Mbits) for buffering, FIFOs, and small data stores.
• I/O Count & Flexibility  176 general-purpose I/Os with the Virtex-E family’s SelectI/O+ technology to support multiple high-performance interface standards and differential signaling.
• High-Speed Interface Support  Family-level support for differential standards including LVDS and LVPECL, and PCI-compliant operation for 3.3 V, 32/64-bit, 33/66-MHz systems as documented for Virtex-E devices.
• Clock Management  On-device digital delay-locked loop (DLL) resources and clock synthesis capabilities are available in the Virtex-E architecture for generating and conditioning clocks.
• Configuration & Re-programmability  SRAM-based in-system configuration enables unlimited reprogramming for iterative development and field updates.
• Package & Mounting  256-FBGA (17 × 17) surface-mount package, RoHS compliant, suited for compact board designs.
• Supply & Operating Range  Core voltage supply: 1.71 V to 1.89 V. Commercial operating temperature: 0 °C to 85 °C.

Typical Applications

• High‑speed interface bridging  Implement protocol converters and custom interface logic leveraging SelectI/O+ and differential signaling support.
• Memory interface and buffering  Use the device’s embedded RAM and logic resources for buffering, arbitration, and memory-controller glue logic in high-performance memory subsystems.
• PCI-based systems  Integrate the FPGA in 3.3 V PCI 32/64-bit systems for custom peripheral logic or bus bridging as described for Virtex-E devices.
• Prototyping and in-system updates  Benefit from SRAM-based in-system configuration to iterate designs and deploy field updates without board-level changes.

Unique Advantages

• Flexible, high-count I/O: Supports a wide range of single-ended and differential I/O standards to simplify system-level interface design.
• On-chip memory for real-time buffering: 131,072 bits of embedded RAM reduce external memory dependency for many control and buffering tasks.
• Reprogrammable architecture: SRAM-based configuration provides design flexibility for iterative development and field reconfiguration.
• Compact package footprint: 256-FBGA (17 × 17) package allows high-density board integration while maintaining substantial logic and I/O resources.
• Commercial-temperature rating: Specified for 0 °C to 85 °C operation, matching typical commercial embedded and computing environments.

Why Choose XCV300E-6FG256C?

The XCV300E-6FG256C combines a mid-range logic capacity with flexible, high-performance I/O and embedded memory in a compact 256-BGA package. It is well suited to designs that require in-system reprogramming, a range of interface standards, and integrated clock management features from the Virtex‑E family.

This device is a practical choice for engineering teams developing custom interface logic, memory buffering solutions, PCI-based subsystems, and prototypes that require iterative updates and a balance of logic, I/O, and on-chip RAM within commercial-temperature constraints.

Request a quote or submit an RFQ today to receive pricing and availability for XCV300E-6FG256C. Our team can provide technical details and lead-time information to support your design planning.