XCV300E-6FG456I

The XCV300E-6FG456I is a Virtex®-E family Field Programmable Gate Array (FPGA) IC provided in a 456-ball BGA package for surface-mount assembly. It combines a high count of logic elements with substantial on-chip RAM and a large I/O complement, targeting industrial applications that require reprogrammable, high-density digital logic and flexible high-speed I/O.

Built around the Virtex-E 1.8 V architecture, this device supports a wide set of I/O standards and on-die clock management features, delivering a balance of performance, integration, and rugged operating range for industrial designs operating from −40 °C to 100 °C.

Key Features

• Logic Capacity  Contains 6,912 logic elements, enabling medium-density digital designs and flexible logic partitioning.
• Embedded Memory  Approximately 0.13 Mbits (131,072 bits) of on-chip RAM for distributed and block memory needs.
• I/O Density  Provides 312 I/O pins to support wide parallel interfaces and multiple high-speed signaling channels.
• Voltage and Power  Core supply range from 1.71 V to 1.89 V as specified for the Virtex-E 1.8 V family.
• Operating Range and Grade  Industrial-grade device rated for −40 °C to 100 °C operation and RoHS compliant.
• Package and Mounting  456-ball BBGA (supplier package: 456-FBGA, 23×23) in a surface-mount format for compact board integration.
• High-Performance I/O and Signaling  Family-level support for differential signaling standards including LVDS, BLVDS and LVPECL and a broad set of interface standards.
• Clock and Timing Resources  Includes advanced clock management with multiple built-in DLLs for clock multiply/divide and zero-delay clocking.
• Manufacturing and Quality  Devices are processed on a 0.18 μm, 6-layer metal process and are 100% factory tested.

Typical Applications

• Industrial Control and Automation  Programmable logic for control systems and sensor interfacing that benefit from reprogrammability and wide operating temperatures.
• High-Speed Interface Bridging  Implement PCI-compliant or other high-throughput interface logic using the device’s extensive I/O and differential signaling support.
• Memory Interface and Buffering  Logic and timing resources for designs that interface to external SRAMs or SDRAMs and require configurable on-chip memory resources.
• Signal Processing and Protocol Conversion  Custom protocol handling, data aggregation, and format conversion leveraging the device’s logic density and clock-management features.

Unique Advantages

• Balanced Integration:  Combination of 6,912 logic elements and ~0.13 Mbits of on-chip RAM reduces need for external components and simplifies board-level architecture.
• Extensive I/O Resources:  312 I/Os and family support for multiple differential standards provide flexibility for mixed-signal interfaces and high-bandwidth connections.
• Industrial-Ready Operation:  Rated for −40 °C to 100 °C and supplied in a robust BGA package suitable for industrial deployment.
• Advanced Clocking:  On-chip DLLs and clock management capabilities enable precise timing control for DDR and other high-speed applications.
• Proven Manufacturing Base:  Built on a 0.18 μm, 6-layer-metal process and 100% factory tested for predictable production quality.

Why Choose XCV300E-6FG456I?

The XCV300E-6FG456I positions itself as a practical choice when you need a reprogrammable, medium-density FPGA with substantial I/O and on-chip memory, packaged for surface-mount assembly and rated for industrial environments. Its Virtex-E family features—multi-standard I/O support, clock management, and factory-tested silicon—help engineers implement complex interfaces and timing-critical logic while keeping board-level integration compact.

This device is appropriate for procurement into industrial control, interface-bridging, memory-interfacing, and signal-processing designs where predictable temperature performance, flexible I/O, and in-system reprogrammability are required.

Request a quote or submit a procurement inquiry to add the XCV300E-6FG456I Virtex®-E FPGA to your BOM and evaluate it for your next industrial or high-performance interface project.