XCV300E-6PQ240I

The XCV300E-6PQ240I is a Virtex®-E field programmable gate array (FPGA) in a 240-pin BFQFP package designed for industrial applications. This 1.8 V, surface-mount FPGA combines a sizable logic fabric with on-chip memory and a high-count I/O complement to address high-performance interface, control and embedded processing tasks.

Its architecture delivers a balance of programmable logic, embedded RAM and flexible I/O capabilities suitable for systems requiring reprogrammability, high I/O bandwidth and operation across an extended temperature range.

Key Features

• Core Logic  Approximately 6,912 logic elements (411,955 equivalent gates) for implementing glue logic, protocol engines and data-path functions.
• On‑Chip Memory  Approximately 0.13 Mbits (131,072 bits) of embedded RAM for FIFOs, buffering and small on-chip data storage.
• I/O Capacity  158 I/O pins in a flexible SelectI/O+™ family architecture (family feature), enabling a wide range of single-ended and differential signaling options.
• High‑Speed Interface Support  Virtex‑E family features include support for differential standards such as LVDS, BLVDS and LVPECL and PCI-compliant 3.3 V 32/64-bit operation (family-level capability).
• Clocking and Timing  Family-level clock management includes multiple digital DLLs to support clock multiplication/division and DDR-friendly timing.
• Power and Supply  Internal supply range of 1.71 V to 1.89 V (VCCINT), optimized for 1.8 V operation; device is designed for low-power operation at 0.18 µm process nodes (family-level description).
• Package & Mounting  240-BFQFP (32 × 32 mm) surface-mount package (supplier device package: 240-PQFP) for board-level assembly and inspection.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards & Reliability  RoHS-compliant and 100% factory tested (family-level assurance from the product family specification).

Typical Applications

• High‑speed interface bridging  Implement protocol translation and bus bridging where PCI-compliant or differential I/O interfaces are required (family-level features).
• Embedded control and processing  Custom control logic, state machines and peripheral aggregation for industrial controllers and instrumentation, leveraging the on-chip logic and RAM.
• Data buffering and timing-critical paths  Use the on-chip RAM and DLL-based clock management to build FIFO buffering, DDR-friendly timing paths and synchronized data capture.
• Prototyping and reprogrammable logic  SRAM-based in-system reprogrammability makes the device suitable for evolving designs and iterative development cycles.

Unique Advantages

• Balanced logic-to-memory ratio  6,912 logic elements combined with ~131 kbits of embedded RAM provide a compact platform for mixed control and buffering tasks.
• Flexible I/O for heterogeneous interfaces  158 I/Os and family-level SelectI/O+™ support enable interfacing to a broad set of single-ended and differential standards without changing the silicon.
• Industrial-grade temperature rating  Operation from −40 °C to 100 °C allows deployment in industrial environments where extended temperature ranges are required.
• Robust packaging for board-level assembly  240-pin PQFP/BFQFP surface-mount package provides a proven footprint for assembly and inspection in volume production.
• Regulatory and manufacturing readiness  RoHS compliance and family-level 100% factory test coverage help simplify regulatory and quality planning.

Why Choose XCV300E-6PQ240I?

The XCV300E-6PQ240I is well suited to designs that require a reprogrammable, industrial-grade FPGA with a substantial I/O count and a compact on-chip memory complement. Its 1.8 V core, family-level support for high-speed differential signaling and built-in clock management make it a practical choice for systems integrating multiple high-bandwidth interfaces and timing-sensitive functions.

Choose this device when you need a reliable, RoHS-compliant FPGA in a 240-pin surface-mount package that supports iterative development and in-system reconfiguration while meeting industrial temperature requirements.

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