XCV300E-6FG256I

The XCV300E-6FG256I is a Virtex®-E field programmable gate array supplied in a 256-ball BGA package and specified for industrial operation. It implements an SRAM-based FPGA architecture with 6,912 logic elements, approximately 0.13 Mbits of embedded RAM, and 176 user I/O pins, making it suitable for high-performance interface, memory-bridge, and industrial control applications.

Key Features

• Core Logic 6,912 logic elements and approximately 411,955 equivalent gates provide programmable logic capacity for complex digital designs.
• On-Chip Memory Approximately 131,072 bits (≈0.13 Mbits) of embedded RAM for local data buffering and fast on-chip storage.
• I/O and Interface Capability 176 user I/Os delivered from the package; the Virtex‑E family supports a broad range of high-performance I/O standards and differential signalling as documented in the series datasheet.
• Performance and Architecture Built on the Virtex‑E 1.8 V family architecture which includes features such as digital clock management and high-speed routing; the family datasheet cites internal performance up to 130 MHz (four LUT levels).
• Power and Supply Core supply voltage range of 1.71 V to 1.89 V suitable for 1.8 V logic domains.
• Package and Mounting 256-ball FBGA (17 × 17) surface-mount package (256-BGA) for compact board-level integration.
• Industrial Temperature Grade Specified operating temperature range from −40 °C to 100 °C for industrial deployments.
• Factory-Tested 100% factory-tested parts as indicated in the Virtex‑E series specification.

Typical Applications

• High-Speed Interface Bridging Implement protocol translation and custom interface logic for PCI and high-bandwidth serial or parallel links using the Virtex‑E family’s I/O capabilities.
• Memory Controller and Interface Use the device as an interface and logic engine for external memory subsystems and synchronous memories, leveraging on-chip RAM for buffering.
• Industrial Control and Automation Deploy in factory automation, motor control, and sensor aggregation systems where industrial temperature range and configurable logic are required.
• Data Acquisition and Processing Realize front-end data capture, preprocessing, and aggregation tasks with dedicated logic and embedded RAM for temporary storage.

Unique Advantages

• Configurable Logic Capacity: 6,912 logic elements give designers flexible resources to implement custom digital functions and control logic without external ASIC development.
• Integrated On-Chip Memory: Approximately 0.13 Mbits of embedded RAM enable localized buffering and deterministic data handling close to logic paths.
• Industrial‑Grade Operation: Rated from −40 °C to 100 °C and delivered in a compact 256-BGA package for rugged board-level integration.
• Deterministic Power Domain: Narrow core supply range (1.71–1.89 V) supports stable 1.8 V system designs and predictable power budgeting.
• High I/O Count: 176 I/Os provide the signal density needed for multi-channel interfaces, parallel buses, and mixed-signal routing on complex PCBs.

Why Choose XCV300E-6FG256I?

The XCV300E-6FG256I combines a proven Virtex‑E FPGA architecture with industrial temperature rating and a compact 256-BGA footprint, offering a balanced mix of logic capacity, on-chip memory, and high I/O density. It is well suited to engineers designing interface-heavy or memory-centric systems that require in-field reprogrammability and reliable operation across industrial environments.

Designed for projects where integration, deterministic supply ranges, and board-level density matter, this device provides a dependable programmable platform for mid-range FPGA applications backed by the Virtex‑E series’ documented feature set.

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