XCV300E-6BG432C

The XCV300E-6BG432C is a Virtex®-E FPGA offering substantial logic capacity and on-chip RAM in a 432‑ball LBGA exposed‑pad package. Built for designs that require high gate counts, flexible I/O and embedded memory, this commercial‑grade device targets applications with significant logic density and varied interface requirements.

Key Features

• Core and Process 1.8 V internal core supply (operating VCCINT range 1.71 V to 1.89 V) implemented in a 0.18 μm process; optimized for lower core voltage operation.
• Logic Capacity 6,912 logic elements providing a total gate equivalence of 411,955 system gates for mid‑density designs.
• On‑Chip Memory 131,072 total RAM bits (approximately 128 Kb) of embedded memory for data buffering and local storage.
• I/O and Interface Flexibility 316 user I/Os on the device package; the Virtex‑E family supports advanced SelectI/O+ standards including differential signaling (LVDS, BLVDS, LVPECL) and a wide range of interface options.
• Performance and Timing Family‑level internal performance capability up to 130 MHz (four LUT levels) and support for source‑synchronous and high‑speed differential clocking.
• Clock Management Family architecture includes eight fully digital delay‑locked loops (DLLs) for clock multiplication, division and duty‑cycle control.
• Package and Mounting 432‑LBGA exposed pad, metal package (Supplier device package: 432‑MBGA, 40×40) designed for surface‑mount assembly.
• Operating Range and Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High‑performance interface bridging — Implement memory controllers and protocol bridges that require flexible I/O standards and substantial on‑chip memory buffering.
• Data path and packet processing — Use the device’s logic density and embedded RAM to implement packet handling, parsing, and mid‑range dataflow processing.
• System prototyping and in‑system reconfiguration — Leverage FPGA reprogrammability to iterate designs and deploy field updates without hardware changes.
• Custom peripheral and accelerator logic — Add application‑specific acceleration blocks or peripheral interfaces where off‑the‑shelf ASICs are not suitable.

Unique Advantages

• Balanced logic and memory capacity: 6,912 logic elements and 131,072 bits of embedded RAM enable mid‑density designs with local storage without immediate reliance on external memory.
• Flexible I/O options: 316 device I/Os and family support for differential and single‑ended standards simplify integration with diverse signaling levels and high‑speed links.
• On‑chip clock control: Eight digital DLLs provide versatile clocking options for synchronous designs and DDR timing requirements.
• Compact surface‑mount packaging: 432‑LBGA exposed pad package offers a small footprint for space‑constrained PCBs while supporting thermal dissipation through the exposed pad.
• Commercial temperature and RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for easy integration into standard commercial product lines.

Why Choose XCV300E-6BG432C?

The XCV300E-6BG432C positions itself as a versatile mid‑density Virtex®-E FPGA that combines a meaningful logic element count, on‑chip RAM and flexible I/O in a compact 432‑LBGA package. It is suited for developers and system designers who need a reprogrammable logic device with support for a variety of interface standards and on‑chip clock management.

For teams designing commercial products that require moderate gate counts, embedded memory and robust I/O flexibility, this device provides a predictable, factory‑tested FPGA solution with RoHS compliance and a defined commercial operating range.

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