XCV300-6FG456C

The XCV300-6FG456C is an SRAM-based Virtex® Field Programmable Gate Array designed for high-performance, reprogrammable logic implementations. It combines a regular CLB-based architecture with extensive on-chip memory and I/O resources for flexible system-level integration.

With 6,912 logic elements, approximately 65,536 bits of embedded RAM, 312 user I/O pins and an estimated 322,970 system gates, this device targets applications that require dense programmable logic, robust memory resources and versatile interface options within a commercial 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 6,912 logic elements and approximately 322,970 system gates to implement complex digital functions and custom datapaths.
• On-chip Memory — 65,536 total RAM bits of embedded memory for lookup tables, FIFOs and small buffering/packet storage needs.
• I/O Resources — 312 programmable I/O pins to connect multiple peripherals, buses and memory interfaces.
• Clock and Timing — Built-in clock-management circuitry in the Virtex family including multiple DLLs and dedicated clock distribution resources for low-skew clocking and advanced timing control.
• Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for iterative development and field updates.
• Package and Mounting — 456-ball FBGA package (456-BBGA / supplier device package: 456-FBGA 23×23) in a surface-mount form factor suitable for dense board-level integration.
• Power and Supply — Core supply voltage range from 2.375 V to 2.625 V to match system power architectures.
• Temperature and Grade — Commercial grade operation from 0 °C to 85 °C.
• Standards and Test — 100% factory tested; RoHS compliant.

Typical Applications

• PCI and Compact PCI interfaces — Use the device’s high-performance I/O and timing features for PCI-compliant bridging and hot-swappable Compact PCI implementations as supported by the Virtex family.
• Custom protocol and interface bridging — Implement protocol translation, glue logic and custom bus interfaces using abundant logic elements and flexible I/O.
• Prototyping and system validation — SRAM-based reprogrammability enables rapid design iteration, in-system updates and hardware prototyping.
• Memory buffering and controllers — On-chip RAM and fast external RAM interfacing capabilities support buffering, packet handling and memory controller prototypes.

Unique Advantages

• Reprogrammable development flow: SRAM-based configuration allows unlimited reprogramming and multiple programming modes to accelerate design cycles and firmware updates.
• Balanced density and performance: 6,912 logic elements and roughly 322,970 system gates provide a balance of capacity and speed for mid-range FPGA designs.
• Rich I/O and memory resources: 312 I/Os and approximately 65,536 bits of embedded RAM reduce external component count for many interface and buffering tasks.
• Integrated clock management: Dedicated clock distribution and DLL resources from the Virtex architecture help simplify multi-clock designs and maintain timing integrity.
• Commercial-grade reliability: Factory-tested device with RoHS compliance and a specified operating range of 0 °C to 85 °C for mainstream electronics applications.
• Compact board footprint: 456-ball FBGA surface-mount package (23×23) enables dense PCB layouts while supporting high-performance routing.

Why Choose XCV300-6FG456C?

The XCV300-6FG456C positions itself as a flexible, mid-density Virtex FPGA option for engineers who need substantial logic resources, ample on-chip RAM and a large I/O count within a commercial temperature range. Its SRAM-based configuration model and family-level clock and interface features make it suitable for iterative development, protocol bridging and memory-interfacing tasks.

Supported by the Virtex family tool ecosystem and factory-tested manufacturing, this device delivers scalable programmability and integration benefits for teams focused on reducing board-level complexity and accelerating time-to-market.

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