XCV300-6BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal

Quantity 1,294 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates322970ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of XCV300-6BG432C – Virtex® FPGA, 6,912 Logic Elements, 316 I/Os

The XCV300-6BG432C is a Virtex® Field Programmable Gate Array (FPGA) offering a balance of performance and integration for commercial embedded designs. Built on a high-density architecture, the device provides 6,912 logic elements, approximately 65,536 bits of on-chip RAM, and up to 316 general-purpose I/Os for complex system interfacing.

This surface-mount, SRAM-based FPGA supports in-system reprogramming and is suited for applications that require flexible logic, multi-standard I/O interfacing, and on-chip memory resources within a commercial temperature range.

Key Features

  • Fabric Capacity — 6,912 logic elements enabling mid-range programmable logic integration for control, glue-logic, and moderate-density custom logic functions.
  • Configurable Logic Blocks — Architecture organized to support a rich routing hierarchy and dedicated arithmetic resources such as carry chains and multiplier support.
  • Embedded Memory — Approximately 65,536 bits of block RAM and LUT-configurable RAM options to support buffering, small lookup tables, and local data storage.
  • I/O Density & Flexibility — 316 I/O pins to accommodate wide external interfaces and multi-device connections on a single package.
  • Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for controlled timing domains.
  • Configuration & Reprogrammability — SRAM-based device with multiple programming modes (including JTAG and SelectMAP) for in-system reconfiguration and design iteration.
  • Package & Mounting — 432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) optimized for surface-mount assembly.
  • Electrical & Environmental — Supply voltage range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • PCI and Compact PCI-based systems — Implement custom bus logic, protocol bridging, or interface glue on 66-MHz PCI-compliant designs and hot-swappable Compact PCI cards.
  • System Prototyping and In-System Reconfiguration — Rapid iteration of digital designs using SRAM-based configuration modes (SelectMAP, serial, JTAG) for development and validation.
  • High-density I/O Control — Manage and aggregate signals from multiple peripherals or memory interfaces using the device’s 316 I/Os and flexible routing resources.
  • On-board Memory and Data Handling — Use embedded RAM and configurable LUT memory for buffering, small FIFOs, and local data processing tasks.

Unique Advantages

  • Balanced Logic and Memory Mix: Combines 6,912 logic elements with block RAM to integrate control logic and local data storage on a single device, reducing external components.
  • Deterministic Clocking: Four DLLs and multiple clock distribution networks enable well-controlled timing for multi-domain designs and synchronous subsystems.
  • High I/O Count: 316 I/Os permit broad external connectivity, simplifying board-level routing and reducing the need for extra interface ICs.
  • Flexible Configuration: SRAM-based reprogrammability and multiple configuration modes support iterative development and field updates.
  • Commercial-grade Reliability: Designed for commercial temperature operation (0 °C to 85 °C) with a robust 432-LBGA exposed-pad package for reliable surface-mount use.
  • Standards-oriented Integration: Features such as PCI compliance and multi-standard I/O support (as documented for the Virtex family) help integrate the FPGA into established system architectures.

Why Choose XCV300-6BG432C?

The XCV300-6BG432C is positioned for designers seeking a mid-range Virtex FPGA with a practical mix of logic, I/O, and on-chip memory for commercial embedded systems. Its combination of configurable logic elements, dedicated clock-management resources, and abundant I/O makes it suitable for PCI-oriented boards, prototyping platforms, and systems that require in-field reconfiguration.

Backed by the Virtex family architecture and SRAM-based configuration, this device offers design flexibility and long-term scalability for teams that need iterative development and integration with standard bus and memory interfaces.

Request a quote or submit a quote to receive pricing and availability for the XCV300-6BG432C. Our team will respond with lead-time and order details to support your design schedule.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up