XCV300-6BG432C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 65536 6912 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 1,294 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 322970 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of XCV300-6BG432C – Virtex® FPGA, 6,912 Logic Elements, 316 I/Os
The XCV300-6BG432C is a Virtex® Field Programmable Gate Array (FPGA) offering a balance of performance and integration for commercial embedded designs. Built on a high-density architecture, the device provides 6,912 logic elements, approximately 65,536 bits of on-chip RAM, and up to 316 general-purpose I/Os for complex system interfacing.
This surface-mount, SRAM-based FPGA supports in-system reprogramming and is suited for applications that require flexible logic, multi-standard I/O interfacing, and on-chip memory resources within a commercial temperature range.
Key Features
- Fabric Capacity — 6,912 logic elements enabling mid-range programmable logic integration for control, glue-logic, and moderate-density custom logic functions.
- Configurable Logic Blocks — Architecture organized to support a rich routing hierarchy and dedicated arithmetic resources such as carry chains and multiplier support.
- Embedded Memory — Approximately 65,536 bits of block RAM and LUT-configurable RAM options to support buffering, small lookup tables, and local data storage.
- I/O Density & Flexibility — 316 I/O pins to accommodate wide external interfaces and multi-device connections on a single package.
- Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for controlled timing domains.
- Configuration & Reprogrammability — SRAM-based device with multiple programming modes (including JTAG and SelectMAP) for in-system reconfiguration and design iteration.
- Package & Mounting — 432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) optimized for surface-mount assembly.
- Electrical & Environmental — Supply voltage range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
Typical Applications
- PCI and Compact PCI-based systems — Implement custom bus logic, protocol bridging, or interface glue on 66-MHz PCI-compliant designs and hot-swappable Compact PCI cards.
- System Prototyping and In-System Reconfiguration — Rapid iteration of digital designs using SRAM-based configuration modes (SelectMAP, serial, JTAG) for development and validation.
- High-density I/O Control — Manage and aggregate signals from multiple peripherals or memory interfaces using the device’s 316 I/Os and flexible routing resources.
- On-board Memory and Data Handling — Use embedded RAM and configurable LUT memory for buffering, small FIFOs, and local data processing tasks.
Unique Advantages
- Balanced Logic and Memory Mix: Combines 6,912 logic elements with block RAM to integrate control logic and local data storage on a single device, reducing external components.
- Deterministic Clocking: Four DLLs and multiple clock distribution networks enable well-controlled timing for multi-domain designs and synchronous subsystems.
- High I/O Count: 316 I/Os permit broad external connectivity, simplifying board-level routing and reducing the need for extra interface ICs.
- Flexible Configuration: SRAM-based reprogrammability and multiple configuration modes support iterative development and field updates.
- Commercial-grade Reliability: Designed for commercial temperature operation (0 °C to 85 °C) with a robust 432-LBGA exposed-pad package for reliable surface-mount use.
- Standards-oriented Integration: Features such as PCI compliance and multi-standard I/O support (as documented for the Virtex family) help integrate the FPGA into established system architectures.
Why Choose XCV300-6BG432C?
The XCV300-6BG432C is positioned for designers seeking a mid-range Virtex FPGA with a practical mix of logic, I/O, and on-chip memory for commercial embedded systems. Its combination of configurable logic elements, dedicated clock-management resources, and abundant I/O makes it suitable for PCI-oriented boards, prototyping platforms, and systems that require in-field reconfiguration.
Backed by the Virtex family architecture and SRAM-based configuration, this device offers design flexibility and long-term scalability for teams that need iterative development and integration with standard bus and memory interfaces.
Request a quote or submit a quote to receive pricing and availability for the XCV300-6BG432C. Our team will respond with lead-time and order details to support your design schedule.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








