XCV300E-6BG352I

The XCV300E-6BG352I is a Virtex®-E field programmable gate array (FPGA) IC from AMD, delivered in a 352-ball LBGA exposed-pad metal package for surface-mount assembly. As a member of the Virtex‑E 1.8 V family, it targets designs that require flexible high-density logic, extensive I/O, and in-system reprogrammability for industrial applications.

This device combines 6,912 logic elements with a gate-equivalent count of 411,955, approximately 0.131 Mbits of on-chip RAM, and 260 user I/Os — providing a balanced platform for high-performance interfaces, configurable logic functions, and rugged deployment across –40°C to 100°C operating environments.

Key Features

• Logic Density  Provides 6,912 logic elements and 411,955 equivalent gates for mid-range FPGA designs.
• Embedded Memory  Approximately 131,072 bits (≈0.131 Mbits) of on-chip RAM to support buffering, small lookup tables, and local storage.
• I/O Capacity and Flexibility  260 user I/Os suit multi-channel interfaces and board-level integration; Virtex‑E family SelectI/O+ and differential signalling features are part of the series architecture.
• Voltage and Power  Core supply range specified at 1.71 V to 1.89 V, matching the Virtex‑E 1.8 V family architecture.
• Clock Management (Family)  Virtex‑E family devices include high-performance clock management such as multiple DLLs and support for DDR clocking modes (series-level feature).
• Package & Mounting  352-LBGA exposed pad, metal package (supplier package 352-MBGA, 35×35 mm) designed for surface-mount assembly and enhanced thermal conduction.
• Industrial Grade  Device grade specified as Industrial with an operating temperature range of –40°C to 100°C.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Automation  Aggregate sensors and control logic using the device’s 260 I/Os and industrial temperature rating for reliable operation on factory floors and control cabinets.
• High-Speed Interface Bridging  Implement protocol bridging and system glue logic for external memory interfaces and bus standards using the Virtex‑E family’s high-performance I/O capabilities.
• Embedded Processing and Custom Logic  Offload application-specific functions and digital signal processing tasks to the FPGA fabric using 6,912 logic elements and on-chip memory for local buffering.

Unique Advantages

• Reprogrammable Platform:  SRAM-based in-system configuration allows iterative development and field updates without hardware replacement.
• Balanced Integration:  A combination of 6,912 logic elements, 260 I/Os, and embedded RAM reduces external component count and simplifies PCB design.
• Industrial Reliability:  Specified for –40°C to 100°C operation and designated as Industrial grade for deployment in demanding environments.
• Thermally-Conscious Package:  352-LBGA exposed-pad metal package supports surface-mount assembly while aiding heat dissipation for sustained operation.
• Series-Level Performance Features:  As part of the Virtex‑E family, the device benefits from high-performance clock management, diverse I/O standards support, and architectures geared toward low-power 1.8 V operation.

Why Choose XCV300E-6BG352I?

The XCV300E-6BG352I positions itself as a mid-range Virtex‑E FPGA that balances logic capacity, I/O flexibility, and industrial robustness. Its combination of 6,912 logic elements, significant I/O count, and surface-mount 352-LBGA packaging makes it suitable for engineers who need configurable hardware for industrial control, interface bridging, and embedded logic applications.

Customers benefit from a reprogrammable FPGA fabric that supports iterative development and long-term product updates, combined with series-level Virtex‑E features for clocking and high-speed I/O. The device’s industrial temperature rating and RoHS compliance further support deployment in regulated and harsh environments.

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