XCV300E-6BG432I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 316 131072 6912 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 25 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 411955 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV300E-6BG432I – Virtex®-E FPGA, 432-LBGA (Industrial)
The XCV300E-6BG432I is a Virtex®-E family field-programmable gate array supplied in a 432-ball LBGA exposed-pad metal package. It combines a mid-range logic capacity with substantial I/O and embedded memory, offering a reprogrammable platform for industrial and high-performance embedded designs.
Key architectural attributes include 6,912 logic elements, approximately 0.13 Mbits of on-chip RAM (131,072 bits), and 316 I/O pins. The device is supplied for 1.71 V to 1.89 V core operation and rated for industrial temperature operation from −40 °C to 100 °C.
Key Features
- Logic Capacity — 6,912 logic elements and 411,955 equivalent gates provide mid-range programmable logic resources for control, glue-logic, and datapath functions.
- Embedded Memory — 131,072 bits of on-chip RAM (approximately 0.13 Mbits) for FIFOs, buffering, and small on-chip storage requirements.
- I/O and Interfaces — 316 I/O pins support flexible system interfacing and high aggregate bandwidth for external peripherals and memory interfaces.
- Power and Supply — Core supply range of 1.71 V to 1.89 V (VCCINT around 1.8 V) for compatibility with the Virtex‑E 1.8 V architecture.
- Packaging & Mounting — 432-LBGA exposed pad, metal package (432-MBGA, 40×40 mm footprint) in a surface-mount form factor suitable for compact board designs.
- Industrial Temperature Range — Specified for −40 °C to 100 °C operation to meet industrial environmental requirements.
- SRAM-Based, In-System Reprogrammability — Series-level SRAM configuration supports unlimited reprogramming and in-system updates.
- Series-Level Performance & Interfaces — Virtex‑E family features documented in the series include 1.8 V operation, high-performance SelectI/O+ technology and support for high-speed differential standards (LVDS, BLVDS, LVPECL), and PCI-compliant interfaces where applicable.
Typical Applications
- Industrial Control and Automation — Industrial-grade temperature range and robust I/O count make the device suitable for control logic, protocol bridging, and factory automation systems.
- Embedded Systems — Reprogrammable logic and on-chip memory support embedded controllers, data aggregation, and system orchestration tasks.
- High-Speed Interface and Memory Front-Ends — Series-level support for PCI, DDR SDRAM and high-speed synchronous SRAM interfaces enables use as an interface controller or bridge.
- Signal Processing and Communications — Dense logic resources and differential I/O support in the Virtex‑E family are applicable to front-end processing, data alignment, and protocol handling.
Unique Advantages
- Balanced Integration: Combines thousands of logic elements, embedded RAM, and hundreds of I/O pins in a single 432-LBGA package to reduce board-level complexity.
- Industrial Robustness: Specified for −40 °C to 100 °C operation and provided in a metal-exposed-pad package suitable for demanding environments.
- Reprogrammable Platform: SRAM-based, in-system configuration enables design updates and field revisions without hardware changes.
- Flexible I/O Standards (Series Capability): Virtex‑E series-level SelectI/O+ technology supports a wide set of interface standards and high-speed differential signaling for diverse connectivity needs.
- Compact Surface-Mount Package: 432-MBGA (40×40) surface-mount package allows high-density board implementations while providing thermal conduction via the exposed pad.
Why Choose XCV300E-6BG432I?
The XCV300E-6BG432I positions itself as a reprogrammable, industrial-grade logic device that balances compute density, on-chip memory, and I/O capacity for embedded and interface-centric designs. Its Virtex‑E architecture and series-level features provide designers with a flexible platform for prototyping, field-updatable systems, and industrial applications that require extended temperature operation.
For teams needing a mid-range FPGA with a robust package, significant I/O availability, and the ability to evolve firmware in-system, this part delivers a practical combination of integration and long-term adaptability supported by the Virtex‑E product family tools and documentation.
Request a quote or submit a procurement inquiry to receive lead-time and pricing information for XCV300E-6BG432I. Our team can provide availability details and help evaluate the part for your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








