XCV300E-6BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 131072 6912 432-LBGA Exposed Pad, Metal

Quantity 25 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates411955ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV300E-6BG432I – Virtex®-E FPGA, 432-LBGA (Industrial)

The XCV300E-6BG432I is a Virtex®-E family field-programmable gate array supplied in a 432-ball LBGA exposed-pad metal package. It combines a mid-range logic capacity with substantial I/O and embedded memory, offering a reprogrammable platform for industrial and high-performance embedded designs.

Key architectural attributes include 6,912 logic elements, approximately 0.13 Mbits of on-chip RAM (131,072 bits), and 316 I/O pins. The device is supplied for 1.71 V to 1.89 V core operation and rated for industrial temperature operation from −40 °C to 100 °C.

Key Features

  • Logic Capacity — 6,912 logic elements and 411,955 equivalent gates provide mid-range programmable logic resources for control, glue-logic, and datapath functions.
  • Embedded Memory — 131,072 bits of on-chip RAM (approximately 0.13 Mbits) for FIFOs, buffering, and small on-chip storage requirements.
  • I/O and Interfaces — 316 I/O pins support flexible system interfacing and high aggregate bandwidth for external peripherals and memory interfaces.
  • Power and Supply — Core supply range of 1.71 V to 1.89 V (VCCINT around 1.8 V) for compatibility with the Virtex‑E 1.8 V architecture.
  • Packaging & Mounting — 432-LBGA exposed pad, metal package (432-MBGA, 40×40 mm footprint) in a surface-mount form factor suitable for compact board designs.
  • Industrial Temperature Range — Specified for −40 °C to 100 °C operation to meet industrial environmental requirements.
  • SRAM-Based, In-System Reprogrammability — Series-level SRAM configuration supports unlimited reprogramming and in-system updates.
  • Series-Level Performance & Interfaces — Virtex‑E family features documented in the series include 1.8 V operation, high-performance SelectI/O+ technology and support for high-speed differential standards (LVDS, BLVDS, LVPECL), and PCI-compliant interfaces where applicable.

Typical Applications

  • Industrial Control and Automation — Industrial-grade temperature range and robust I/O count make the device suitable for control logic, protocol bridging, and factory automation systems.
  • Embedded Systems — Reprogrammable logic and on-chip memory support embedded controllers, data aggregation, and system orchestration tasks.
  • High-Speed Interface and Memory Front-Ends — Series-level support for PCI, DDR SDRAM and high-speed synchronous SRAM interfaces enables use as an interface controller or bridge.
  • Signal Processing and Communications — Dense logic resources and differential I/O support in the Virtex‑E family are applicable to front-end processing, data alignment, and protocol handling.

Unique Advantages

  • Balanced Integration: Combines thousands of logic elements, embedded RAM, and hundreds of I/O pins in a single 432-LBGA package to reduce board-level complexity.
  • Industrial Robustness: Specified for −40 °C to 100 °C operation and provided in a metal-exposed-pad package suitable for demanding environments.
  • Reprogrammable Platform: SRAM-based, in-system configuration enables design updates and field revisions without hardware changes.
  • Flexible I/O Standards (Series Capability): Virtex‑E series-level SelectI/O+ technology supports a wide set of interface standards and high-speed differential signaling for diverse connectivity needs.
  • Compact Surface-Mount Package: 432-MBGA (40×40) surface-mount package allows high-density board implementations while providing thermal conduction via the exposed pad.

Why Choose XCV300E-6BG432I?

The XCV300E-6BG432I positions itself as a reprogrammable, industrial-grade logic device that balances compute density, on-chip memory, and I/O capacity for embedded and interface-centric designs. Its Virtex‑E architecture and series-level features provide designers with a flexible platform for prototyping, field-updatable systems, and industrial applications that require extended temperature operation.

For teams needing a mid-range FPGA with a robust package, significant I/O availability, and the ability to evolve firmware in-system, this part delivers a practical combination of integration and long-term adaptability supported by the Virtex‑E product family tools and documentation.

Request a quote or submit a procurement inquiry to receive lead-time and pricing information for XCV300E-6BG432I. Our team can provide availability details and help evaluate the part for your design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up