XCV300E-6FG256C0773

The XCV300E-6FG256C0773 is a Virtex®-E field programmable gate array (FPGA) provided in a 256-ball BGA package. It combines a substantial logic resource count with on-chip RAM and a broad set of I/O, supplied as a commercial‑grade, surface‑mount device.

Designed for commercial electronic designs that require programmable logic integration, the device delivers 6,912 logic elements, approximately 0.13 Mbits of embedded memory and 176 user I/O pins, while operating within a 1.71 V to 1.89 V core supply range and a 0 °C to 85 °C ambient temperature window.

Key Features

• Logic Capacity 6,912 logic elements provide sizable programmable fabric for implementing complex digital logic and custom control functions.
• On‑Chip Memory Approximately 0.13 Mbits of embedded RAM (131,072 total bits) supports buffering, state storage and small lookup tables within the FPGA fabric.
• I/O and Gate Count 176 user I/O pins and 411,955 equivalent gates enable extensive external device interfacing and moderate gate‑level integration.
• Package and Mounting 256‑BGA package (supplier device package: 256‑FBGA 17×17) in a surface‑mount form factor for compact board integration.
• Power Core supply range of 1.71 V to 1.89 V, allowing designers to plan power delivery for the FPGA core accordingly.
• Operating Range Commercial grade device rated for 0 °C to 85 °C ambient operation, suitable for standard commercial environments.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements in commercial production.

Typical Applications

• Commercial embedded systems — Use the device’s 6,912 logic elements and 176 I/O to implement custom control logic, protocol handling, and peripheral interfaces in commercial products.
• Prototyping and development platforms — Programmable logic and on‑chip RAM make the device suitable for intermediate‑density prototyping where flexibility and reconfigurability are required.
• I/O‑rich designs — With 176 user I/O pins, the FPGA can serve applications that require multiple external interfaces or parallel I/O connectivity.

Unique Advantages

• Substantial programmable fabric: 6,912 logic elements enable implementation of sizeable custom logic without external ASICs.
• Embedded memory on‑chip: 131,072 bits of RAM reduce dependency on external memory for small buffers and LUTs, simplifying board-level BOM.
• High I/O count: 176 I/O pins support extensive peripheral connections and multiple interface channels from a single device.
• Compact BGA package: 256‑BGA (256‑FBGA 17×17) balances density and board space for surface‑mount commercial designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match standard commercial deployment requirements.
• RoHS compliant: Facilitates regulatory and environmental compliance for commercial product assemblies.

Why Choose XCV300E-6FG256C0773?

The XCV300E-6FG256C0773 positions itself as a commercially graded Virtex®-E FPGA offering a balanced combination of logic density, embedded RAM and I/O capacity in a compact 256‑BGA package. Its specifications make it suitable for designers who need reprogrammable logic, moderate on‑chip memory, and substantial interfacing capability within standard commercial ambient conditions.

For design teams and procurement groups focused on commercial electronic products that require programmable flexibility and integration, this FPGA provides a clear feature set—measurable logic elements, defined RAM capacity, a high I/O count and RoHS compliance—that supports scalable and maintainable designs.

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