XCV300E-6FG456C

The XCV300E-6FG456C is a Virtex®-E family FPGA provided in a 456-BBGA (456-FBGA, 23×23) surface-mount package. This commercial-grade, SRAM-based FPGA integrates 6,912 logic elements, approximately 131,072 bits of embedded memory, and 312 I/O pins to support medium-density programmable logic and high-speed I/O applications.

Designed for 1.8 V core operation (VCCINT 1.71–1.89 V) and commercial operating temperatures (0 °C to 85 °C), the device targets designs that require reprogrammable logic, flexible I/O standards and on-chip memory for interface, control and processing tasks.

Key Features

• Core Logic 6,912 logic elements and approximately 411,955 equivalent gates provide the programmable fabric for custom logic, control and data-path implementations.
• Embedded Memory Approximately 131,072 bits of on-chip RAM for distributed and block memory needs within the FPGA design.
• I/O Capacity & Performance 312 I/O pins support a range of external interfacing requirements; the Virtex‑E family includes high-performance SelectI/O+ technology in the series specification.
• Package & Mounting 456-BBGA (supplier package: 456-FBGA, 23×23) in a surface-mount form factor for dense board integration.
• Power Core supply voltage range: 1.71 V to 1.89 V (VCCINT). Designed for the Virtex‑E family emphasis on lower-voltage, lower-power operation.
• Operating Range & Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
• Configuration & Reprogrammability SRAM-based in-system configuration enables unlimited re-programmability as specified for the Virtex‑E series.
• Series-Level Capabilities As part of the Virtex‑E family, the series supports features such as digital clock management (DLLs), SelectRAM+ memory hierarchy and a range of differential signaling options (series specification).

Typical Applications

• High-speed interface bridging — Implement protocol bridging and custom I/O buffering where a mix of single-ended and differential signaling is required by the system.
• Embedded control and glue logic — Replace multiple fixed-function ICs with programmable logic for board-level control, timing and arbitration functions.
• Memory interface and buffering — Use on-chip RAM and programmable logic for interfacing to external memories and implementing custom memory controllers or buffering stages.
• PCI and system I/O — Suitable for designs that leverage the Virtex‑E series’ PCI-capable I/O standards and on-board reprogrammability.

Unique Advantages

• Reprogrammable Hardware — SRAM-based configuration enables in-system reprogramming and iterative design updates without hardware changes.
• Balanced Logic and Memory — 6,912 logic elements combined with ~131 kbits of embedded memory allow mixed logic and data-storage tasks on a single device, reducing external component count.
• Flexible I/O Density — 312 I/O pins support a variety of external interfaces and signal routing options, simplifying system integration.
• Compact, Surface-Mount Package — 456-BBGA (23×23) packaging provides a high-density solution for space-constrained PCBs.
• Commercial Temperature and RoHS Compliance — Ready for mainstream electronics deployments with standard commercial operating range and RoHS conformity.

Why Choose XCV300E-6FG456C?

The XCV300E-6FG456C brings Virtex‑E family capabilities into a mid-density FPGA device that pairs reprogrammable SRAM logic with on-chip memory and substantial I/O resources. Its 1.8 V core operation, commercial temperature rating, and 456-ball BGA packaging make it appropriate for system designs that require flexible in-field updates, moderate logic capacity and compact board-level integration.

This device suits engineering teams building communications interfaces, embedded controllers, memory interface logic and other applications where a proven family-level feature set (clock management, flexible I/O standards and block/distributed RAM support) combined with commercial-grade supply and packaging is required.

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