XCV300E-6PQ240C

The XCV300E-6PQ240C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 240-pin BFQFP surface-mount package. It integrates programmable logic, on-chip memory, and a flexible I/O fabric to address mid-density, performance-sensitive digital designs.

With 6,912 logic elements, approximately 0.13 Mbits of embedded RAM, and 158 user I/Os, this commercial-grade 1.71–1.89 V device is suited for applications requiring reprogrammable logic, memory interfacing, and high-speed differential signaling support.

Key Features

• Programmable Logic Capacity — 6,912 logic elements enabling complex combinational and sequential logic implementations.
• Embedded Memory — 131,072 total RAM bits (approximately 0.13 Mbits) for on-chip buffering, FIFOs, and small lookup tables.
• I/O Count & Flexibility — 158 I/Os supporting a variety of interface topologies and signal routing options.
• Differential Signaling & Interface Support — Family-level support for LVDS, BLVDS and LVPECL differential signalling and multiple high-performance interface standards as documented for Virtex‑E devices.
• Performance & Clocking — Virtex‑E family characteristics include internal performance around 130 MHz (four LUT levels) and built-in clock management features such as multiple DLLs.
• Configuration — SRAM-based in-system reprogrammability for field updates and design iteration.
• Package & Mounting — 240-BFQFP (240-PQFP 32×32) surface-mount package suitable for compact board layouts.
• Power & Temperature — VCCINT range 1.71 V to 1.89 V; commercial operating temperature 0 °C to 85 °C.
• Compliance — RoHS-compliant supply for regulatory and manufacturing compatibility.

Typical Applications

• PCI-based Expansion and Host Interfaces — Use in PCI-compliant designs requiring programmable glue logic and protocol handling.
• High-Performance Memory Interfaces — Implement controllers or interfaces for external SRAM/DDR memory where on-chip logic and embedded RAM are used for buffering and timing.
• High-Speed Differential Links — Support for LVDS/LVPECL signaling makes the device suitable for source-synchronous and differential data channels.
• Custom DSP and Control Logic — Deploy for custom data path engines, protocol conversion, and board-level system control where reprogrammability is advantageous.

Unique Advantages

• Balanced Logic and Memory Mix: The combination of 6,912 logic elements and ~0.13 Mbits of embedded RAM enables compact implementations of control, buffering, and moderate DSP tasks without external FPGA fabric.
• Flexible Interface Support: 158 I/Os and Virtex‑E family differential I/O capabilities allow diverse signaling standards to be implemented from a single device.
• In-System Reconfiguration: SRAM-based configuration supports iterative development and field updates, reducing time-to-market for evolving designs.
• Compact, Surface-Mount Packaging: The 240-BFQFP package provides a space-efficient footprint for board-level integration while maintaining a high pin count.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant, compatible with standard commercial electronic product requirements.

Why Choose XCV300E-6PQ240C?

The XCV300E-6PQ240C positions itself as a mid-density Virtex‑E FPGA option that combines a practical logic element count with useful on-chip memory and a substantial I/O complement. Its support for differential signaling and family-level clocking/configuration features make it a solid choice for designers who need reprogrammable logic for interface bridging, memory controllers, and high-speed I/O tasks within commercial-temperature applications.

For teams focused on reducing board-level complexity and enabling field updates, this device offers a balanced mix of integration, configurability, and proven Virtex‑E family capabilities to support reliable, scalable system designs.

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