XCV300E-7BG432C

The XCV300E-7BG432C is an SRAM-based Virtex®-E FPGA offered in a 432-pin LBGA with an exposed metal pad. It delivers a balance of programmable logic, on-chip RAM, and high-performance I/O for system-level integration in commercial embedded designs.

Built on the Virtex‑E family architecture, this device targets designs that require flexible I/O standards, embedded memory, and programmable logic capacity — enabling implementations such as high-performance interfaces, memory controllers, and custom datapath logic while operating from a 1.71 V to 1.89 V core supply.

Key Features

• Programmable Logic — Provides 6,912 logic elements for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.13 Mbits of on-chip RAM (131,072 total bits) to support buffers, FIFOs, and small on-chip data storage.
• I/O Capacity — 316 I/O pins to interface with peripherals, memory devices, and system buses; supports the Virtex‑E SelectI/O+ family features for multiple I/O standards.
• Logic Scale — Equivalent to 411,955 system gates, enabling medium-density integration of custom logic and glue functions.
• Clock and Timing — Virtex‑E series clock management features such as multiple DLLs and digital clock control are part of the family architecture.
• Power — Core supply operates between 1.71 V and 1.89 V, designed for the Virtex‑E 1.8 V family.
• Package & Mounting — 432-LBGA exposed pad, metal package (supplier package: 432‑MBGA 40×40) with surface-mount mounting for compact board-level integration.
• Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• High-performance bus bridging and logic — Implement PCI or custom bus interfaces and bridging logic using the device’s programmable I/O and logic resources.
• Memory interface and controller — Use on-chip RAM and Virtex‑E family memory features to build ZBT/DDR interface logic and buffering between system memory and processors.
• High-speed differential I/O systems — Leverage the series’ differential signalling support for LVDS/LVPECL-style interfaces where differential inputs and outputs are required.
• Custom datapath and prototyping — Implement application-specific processing, glue logic, and system prototyping where reprogrammability and moderate logic density are needed.

Unique Advantages

• Balanced integration: Combines thousands of logic elements with embedded RAM to reduce external component count for mid-density systems.
• Flexible I/O capability: Supports the Virtex‑E family SelectI/O+ technology and differential signalling features to accommodate a wide range of interface standards.
• Compact packaging: 432-LBGA exposed pad metal package enables dense board layouts and thermal conduction via the exposed pad.
• SRAM-based reprogrammability: Field re-programmability enables iterative design and in-system updates without hardware changes.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and supplied in a RoHS-compliant package for mainstream electronic designs.

Why Choose XCV300E-7BG432C?

The XCV300E-7BG432C positions itself as a versatile Virtex‑E FPGA option for designs that need a mix of programmable logic, on-chip RAM, and a substantial I/O count in a compact BGA package. Its 1.8 V family architecture and selectable I/O standards make it suitable for mid-range embedded systems requiring reprogrammability and interface flexibility.

This device is well suited to engineering teams implementing system logic, memory interfaces, and custom datapath functions who value the balance of logic capacity, embedded memory, and proven series-level capabilities such as advanced clock management and differential I/O support.

Request a quote or contact sales to check availability, pricing, and lead times for the XCV300E-7BG432C. Provide your order requirements or BOM details to receive a prompt response.