XCV300E-7FG256I

The XCV300E-7FG256I is a Virtex®-E family FPGA from AMD, delivered in a 256-BGA (256-FBGA 17×17) surface-mount package and rated for industrial operation. As a 1.8 V high-density FPGA, it combines a large logic resource set with substantial I/O capability and on-chip embedded memory to support demanding embedded, communications, and industrial designs.

This device provides 6,912 logic elements, approximately 0.13 Mbits of embedded memory, 176 user I/Os and an internal gate count of 411,955, making it suitable for designs that require significant logic integration, flexible I/O standards, and reliable operation across –40°C to 100°C.

Key Features

• Core Architecture 1.8 V Virtex‑E FPGA family architecture with a core supply range of 1.71 V to 1.89 V; designed for low-power operation per family specification.
• Logic Capacity 6,912 logic elements and a total of 411,955 system gates to implement medium-to-high complexity digital designs.
• Embedded Memory Approximately 0.13 Mbits of on-chip RAM for data buffering and on-chip storage.
• I/O and Interface Support 176 user I/Os delivered through SelectI/O+ family technologies described for Virtex‑E devices, enabling support for numerous high-performance interface standards and differential signalling options.
• Clock Management Family-level clock management features include multiple digital Delay-Locked Loops (DLLs) for clock multiplication, division and duty-cycle control.
• Configuration SRAM-based in-system reprogramming capability (SRAM configuration methodology as described for the Virtex‑E family).
• Package & Mounting 256-BGA (256-FBGA, 17×17) surface-mount package suitable for assembly in standard SMT workflows.
• Environmental & Reliability Industrial temperature rating from –40°C to 100°C and RoHS compliance.

Typical Applications

• High-speed interface bridging Use the device’s SelectI/O+ family features and high I/O count to implement protocol adapters and host-side interface logic.
• Embedded control and signal processing Employ the combination of logic elements and on-chip memory for real-time processing, control loops and custom accelerators.
• Industrial automation Industrial temperature rating and robust packaging make this FPGA suitable for factory automation and control systems requiring reconfigurable logic.
• Memory interface and buffering On-chip RAM and the family’s memory hierarchy support designs that need local buffering and memory arbitration logic.

Unique Advantages

• Substantial logic density: 6,912 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level BOM and interconnect complexity.
• Flexible I/O capability: 176 I/Os accommodate complex board-level routing and multiple parallel interfaces without external multiplexing.
• Industrial readiness: Rated from –40°C to 100°C and RoHS compliant, supporting deployment in industrial environments.
• In-system programmability: SRAM-based reconfiguration allows field updates and iterative design refinement without board changes.
• Compact SMT packaging: 256-FBGA (17×17) enables high-density PCB designs while maintaining robust thermal and mechanical characteristics for surface-mount assembly.

Why Choose XCV300E-7FG256I?

The XCV300E-7FG256I positions itself as a versatile, industrial-grade Virtex‑E FPGA offering a strong balance of logic capacity, embedded memory, and extensive I/O in a compact 256‑BGA package. Its 1.8 V family architecture and documented family-level features such as advanced I/O support and clock management make it well suited for projects that require reprogrammability, interface flexibility, and reliable operation across a wide temperature range.

Choose this device when you need a reconfigurable platform that consolidates multiple digital functions, supports diverse interface standards, and can be deployed in industrial environments with long-term programmability and maintenance in mind.

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