XCV300E-7PQ240C

IC FPGA 158 I/O 240QFP
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 158 131072 6912 240-BFQFP

Quantity 105 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O158Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1536Number of Logic Elements/Cells6912
Number of Gates411955ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV300E-7PQ240C – Virtex®-E FPGA, 240-BFQFP, 158 I/O

The XCV300E-7PQ240C is an AMD Virtex®-E family field programmable gate array provided in a 240-BFQFP (240-PQFP, 32×32) surface-mount package. It delivers a mid-density SRAM-based FPGA architecture with 6,912 logic elements, 158 user I/Os and on-chip memory resources suited for designs requiring flexible high-speed I/O and embedded memory.

Built on the Virtex‑E family architecture, the device targets applications that benefit from high-performance interfaces, configurable on-chip RAM and integrated clock management while operating from a 1.71 V to 1.89 V core supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 6,912 logic elements supporting complex combinational and sequential logic implementation.
  • Embedded Memory — 131,072 bits of total on-chip RAM (approximately 0.13 Mbits) for distributed and block RAM usage.
  • I/O — 158 user I/Os provided in the 240‑BFQFP package for broad interface connectivity.
  • Gate Equivalent — Device density reported at 411,955 gates for system-level resource planning.
  • Power and Supply — Core voltage supply range of 1.71 V to 1.89 V for the internal logic and memory.
  • Package & Mounting — Supplied in a 240‑BFQFP (240‑PQFP, 32×32) surface-mount package; supplier device package listed as 240‑PQFP (32×32).
  • Commercial Grade — Operating temperature range 0 °C to 85 °C; RoHS compliant.
  • Virtex‑E Family Capabilities (series-level) — Family features include 1.8 V operation, SelectI/O+ interface flexibility, differential signalling support (LVDS, BLVDS, LVPECL), an advanced SelectRAM+ memory hierarchy, built-in digital clock management with multiple DLLs, and SRAM-based in-system configuration.

Typical Applications

  • High-Speed Interface Design — Implements source-synchronous and differential interfaces using the Virtex‑E series’ SelectI/O+ and differential signalling support for demanding link requirements.
  • Memory Interface Controllers — Suited for designs requiring tight integration with external memories, benefiting from the family’s SelectRAM+ memory hierarchy and on-chip RAM resources.
  • FPGA-Based System Prototyping — Provides re-programmability and a substantial logic/memory mix for iterative development and in-system configuration workflows.
  • Clock-Intensive Designs — Integrates multiple digital DLLs for clock multiplication, division and duty-cycle control in timing-sensitive applications.

Unique Advantages

  • Balanced Logic and Memory: 6,912 logic elements combined with approximately 0.13 Mbits of on-chip RAM allow compact implementations of control, datapath and buffering functions without excessive external memory.
  • Flexible I/O Options: 158 user I/Os in the 240‑BFQFP package support a wide range of interface needs, including differential signaling standards at the family level.
  • Integrated Clock Management: Family-level digital DLLs enable precise clocking and DDR-friendly duty-cycle control, simplifying high-speed timing design.
  • SRAM-Based Re-programmability: In-system configurability enables design updates and iterative development without hardware replacement.
  • Compact, Surface-Mount Package: The 240‑BFQFP (240‑PQFP, 32×32) surface-mount form factor supports board-level density and manufacturability.
  • Regulatory & Manufacturing Readiness: Commercial-grade temperature rating and RoHS compliance support mainstream production and procurement.

Why Choose XCV300E-7PQ240C?

The XCV300E-7PQ240C positions itself as a versatile mid-density Virtex‑E FPGA option where a combination of logic capacity, embedded RAM and flexible high-speed I/O is required. Its family-level capabilities—SelectI/O+, SelectRAM+ memory architecture and integrated clock management—align with designs that need reliable in-system configurability and robust timing control.

This device is well suited to engineering teams building communications, memory-interface, or prototype FPGA designs that require a commercial-grade, RoHS-compliant solution in a compact 240‑BFQFP package. The combination of on-chip memory, substantial logic elements and programmable I/O simplifies system integration and supports iterative development cycles.

Request a quote or submit a pricing and availability inquiry for XCV300E-7PQ240C to receive current lead-time and ordering information.

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