XCV300E-7PQ240I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 131072 6912 240-BFQFP |
|---|---|
| Quantity | 915 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 6912 | ||
| Number of Gates | 411955 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV300E-7PQ240I – Virtex®-E Field Programmable Gate Array, 240-BFQFP
The XCV300E-7PQ240I is a Virtex®-E family Field Programmable Gate Array (FPGA) supplied in a 240-pin BFQFP package and specified for industrial temperature operation. It provides a mid-range programmable logic resource set with 6,912 logic elements and approximately 0.13 Mbits of embedded memory for implementing custom digital functions, interfaces, and control logic.
Designed on the Virtex-E 1.8 V architecture, the family offers capabilities aimed at high-performance interfaces and memory-centric applications, while the device-level specifications (158 I/Os, 411,955 equivalent gates, and a 1.71 V–1.89 V core supply range) support a wide range of embedded and industrial designs.
Key Features
- Logic Capacity 6,912 logic elements suitable for mid-density programmable logic implementations and system glue logic.
- Embedded Memory Approximately 0.13 Mbits (131,072 bits) of on-chip RAM to support buffering, FIFOs, and small embedded data stores.
- I/O Count & Flexibility 158 user I/Os for diverse peripheral and interface requirements; I/O performance characteristics are defined by the Virtex-E family architecture.
- System Gates Equivalent to 411,955 gates, enabling substantial logic integration for control, interfacing, and pre-processing tasks.
- Power & Voltage Core supply range of 1.71 V to 1.89 V, matching the Virtex-E 1.8 V family process.
- Package & Mounting 240-BFQFP package (supplier device package: 240-PQFP 32×32), surface-mount mounting for standard PCB assembly.
- Industrial Temperature Grade Specified for operation from −40 °C to 100 °C to meet industrial-environment requirements.
- Compliance & Test RoHS compliant and factory tested as part of the Virtex-E family production specification.
- Virtex-E Family Capabilities Series-level features include 1.8 V operation, up to 130 MHz internal performance (four LUT levels), advanced clock management with multiple DLLs, support for high-performance differential signaling standards, and SRAM-based in-system configuration.
Typical Applications
- High-speed interface bridging Implement protocol adapters and interface logic that leverage the Virtex-E family’s support for multiple I/O standards and robust I/O counts.
- Memory controller and buffering Use embedded RAM and the family’s SelectRAM/BlockRAM architecture for external memory interfacing and data buffering.
- Industrial control and automation Industrial temperature rating and flexible I/O make the device suitable for embedded controllers, sensor aggregation, and machine control logic.
- Prototyping and system glue logic Mid-range logic capacity is well suited for combining custom datapaths, state machines, and peripheral interfaces in prototype and production systems.
Unique Advantages
- Balanced mid-range capacity: 6,912 logic elements and ~0.13 Mbits of embedded memory provide a practical balance of logic and RAM for many embedded applications without excessive cost or board-space impact.
- Industrial temperature support: Rated from −40 °C to 100 °C to meet the thermal demands of factory-floor and outdoor installations.
- Versatile packaging: 240-BFQFP (240-PQFP 32×32) surface-mount package simplifies integration into existing PCB designs while providing sufficient I/O for complex boards.
- System-level features from Virtex-E family: Architecture-level capabilities—such as multiple DLLs, support for high-speed differential signaling, and SRAM-based in-system configuration—enable advanced clocking and in-field reprogrammability.
- Regulatory and quality readiness: RoHS compliance and factory testing help streamline regulatory acceptance and production deployment.
Why Choose XCV300E-7PQ240I?
The XCV300E-7PQ240I positions itself as a robust mid-range FPGA option within the Virtex®-E family for industrial and embedded applications that require a combination of logic density, embedded memory, and flexible I/O. With an industrial operating temperature range and a 240-pin BFQFP surface-mount package, it fits professional PCB designs where reliability and environmental tolerance are required.
Designers targeting high-performance interfaces, memory-centric functions, or custom control logic will find the device’s family-level features—such as advanced clock management, differential signaling support, and SRAM-based in-system configuration—helpful for scalable implementations and iterative development.
Request a quote or submit a request to check availability and lead times for the XCV300E-7PQ240I. Our team can provide pricing and delivery options tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








