XCV300E-7FG456I

The XCV300E-7FG456I is a Virtex‑E series 1.8 V SRAM-based FPGA provided in a 456-pin BGA package. It delivers medium-density programmable logic with 6,912 logic elements, approximately 131,072 bits of embedded RAM, and 312 user I/O pins—targeted for industrial-temperature applications.

Designed for reconfigurable system designs, the device combines on-chip memory, a high I/O count and family-level features such as support for high-performance differential signaling and integrated clock management to address a range of embedded, communications and interface tasks.

Key Features

• Programmable Logic  6,912 logic elements and approximately 411,955 gates of logic capacity for implementing glue logic, protocol engines, and custom datapaths.
• On-Chip Memory  Approximately 131,072 bits of embedded RAM for local buffering, FIFOs and small on-chip storage requirements.
• I/O and Interface Capability  312 user I/O pins in a 456-pin BGA footprint; family-level SelectI/O+ technology supports a wide range of single‑ended and differential I/O standards for high-speed interface flexibility.
• Clock Management  Family features include multiple digitally implemented DLLs for clock multiply/divide and duty-cycle control to support synchronous designs and DDR-style interfaces.
• Power and Supply  Core supply operation specified from 1.71 V to 1.89 V (1.8 V nominal), enabling compatibility with Virtex‑E family power domains.
• Packaging and Mounting  Delivered in a 456-ball BGA package (supplier device package 456-FBGA, 23×23) for surface-mount PCB assembly and high-density board layouts.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Configuration Model  SRAM-based in‑system configuration enables unlimited reprogramming for iterative development and field updates.
• Compliance and Testing  RoHS compliant and produced under family test regimes that include 100% factory testing.

Typical Applications

• High‑speed interface bridging  Implement protocol conversion, parallel-to-serial bridging and custom interface logic using the device’s high I/O count and family-level differential signaling support.
• Embedded control and glue logic  Consolidate discrete logic, timers and control functions into reconfigurable logic blocks to simplify BOM and speed development.
• Industrial data acquisition and preprocessing  Use on-chip RAM and programmable logic to buffer, align and preprocess sensor or fieldbus data within an industrial temperature range.

Unique Advantages

• Balanced medium-density resource set  6,912 logic elements and ~131 Kbits of embedded RAM provide a practical mix of logic and memory for mid-range FPGA tasks without overprovisioning.
• High I/O count in a compact BGA  312 I/Os in a 456-pin BGA enable complex I/O routing while maintaining a compact PCB footprint.
• Industrial operating range  Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Reprogrammable SRAM configuration  In-system reprogramming supports iterative development, field upgrades and multi‑function product designs.
• Precise core supply specification  Core voltage range of 1.71–1.89 V helps ensure consistent device behavior across boards and power architectures.
• Production-level quality controls  RoHS compliance and 100% factory testing provide traceable manufacturing quality for system integration.

Why Choose XCV300E-7FG456I?

The XCV300E-7FG456I positions itself as a practical Virtex‑E option for designers who need a medium-density, industrial-temperature FPGA with a robust set of I/O and on-chip memory. Its combination of 6,912 logic elements, approximately 131 Kbits of embedded RAM and 312 I/Os in a 456-ball BGA makes it suitable for embedded control, interface bridging and industrial data handling.

With SRAM-based in-system configuration, established family-level capabilities for differential signaling and clock management, and defined supply and temperature specifications, this part supports iterative development cycles and deployed systems that require reconfigurability and industrial-grade operation.

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