XCV300E-7FG256C

The XCV300E-7FG256C is a Virtex‑E field programmable gate array provided in a 256‑ball BGA (256‑FBGA, 17×17) package. It delivers 6912 logic elements and approximately 0.131 Mbits of embedded memory in a commercial‑grade, surface‑mount FPGA targeted at high‑performance, reconfigurable digital designs. Typical use cases include high‑speed interface bridging, memory interface logic, custom datapath and control implementations, and in‑system reprogrammable development platforms.

Key Features

• Logic Capacity – 6912 logic elements and 411,955 system gates provide substantial programmable logic for mid‑range designs.
• On‑Chip Memory – 131,072 total RAM bits (approximately 0.131 Mbits) for distributed and block memory usage in embedded designs.
• I/O and Bandwidth – 176 user I/O pins available for flexible interfacing and external connectivity.
• Power and Voltage – Internal core voltage supply specified at 1.71 V to 1.89 V (1.8 V class device).
• Package and Mounting – 256‑BGA package (supplier package 256‑FBGA, 17×17), surface‑mount for compact board integration.
• Operating Range – Commercial grade operation from 0 °C to 85 °C suitable for standard industrial and commercial environments.
• Environmental Compliance – RoHS compliant for regulatory and manufacturing alignment.
• Virtex‑E Family Capabilities – Built on the Virtex‑E architecture, which includes advanced features such as SelectI/O+ technology, differential signalling support (LVDS, BLVDS, LVPECL), high‑performance clock management with multiple DLLs, and support for a wide range of high‑speed interface standards (family level).

Typical Applications

• High‑Speed Interface Bridging – Implement protocol bridging and high‑throughput I/O functions leveraging the Virtex‑E family’s support for differential signalling and multiple interface standards.
• Memory Interface Logic – Implement controllers and custom logic for external memory interfaces, using available on‑chip RAM and the family’s memory hierarchy features.
• Communications and Signal Processing – Build custom datapaths and control logic for mid‑range communications equipment where reconfigurability and programmable logic density are required.
• In‑System Programmable Prototyping – Use as a reprogrammable platform for system validation, algorithm development, and iterative hardware/software co‑design.

Unique Advantages

• Balanced Logic and Memory – 6912 logic elements combined with on‑chip RAM allow designers to partition functions between logic and embedded memory efficiently.
• Compact BGA Footprint – 256‑FBGA (17×17) package enables integration into space‑constrained PCBs while retaining substantial I/O and logic resources.
• Commercial Temperature Range – Rated 0 °C to 85 °C for reliable operation in typical commercial and business‑class applications.
• Family‑Level I/O Flexibility – Leveraging Virtex‑E family I/O technologies supports a broad set of high‑performance signalling standards for versatile system interfaces.
• RoHS Compliant – Meets common environmental requirements for contemporary manufacturing and deployment.

Why Choose XCV300E-7FG256C?

The XCV300E-7FG256C combines a mid‑range logic capacity with embedded memory and a high‑pin‑count BGA package to address a wide range of reconfigurable digital designs. Its 1.8 V core, 176 I/O pins, and Virtex‑E family architecture provide a practical balance of performance, integration, and board‑level density for engineers developing interface logic, memory controllers, communications modules, and programmable prototypes.

Backed by the Virtex‑E family’s documented features and a RoHS‑compliant, surface‑mount 256‑BGA package, this device is positioned for customers who need scalable, reprogrammable logic with the ecosystem advantages of a well‑established FPGA series.

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