XCV300E-7BG352I

The XCV300E-7BG352I is a Virtex®-E family field programmable gate array (FPGA) IC from AMD, supplied in a 352-LBGA exposed pad metal package. This industrial-grade, surface-mount device provides a balance of logic density, on-chip memory, and I/O capacity for mid-range FPGA designs.

With 6,912 logic elements, approximately 0.13 Mbits of embedded RAM, 260 I/O pins and roughly 411,955 gates, the device targets applications that require flexible, reprogrammable logic, high-speed I/O and robust operating range (1.71–1.89 V supply, –40 °C to 100 °C).

Key Features

• Core and Density  6,912 logic elements and approximately 411,955 system gates provide mid-range programmable logic capacity for control, processing and glue-logic functions.
• On-Chip Memory  Total on-chip RAM of 131,072 bits (approximately 0.13 Mbits) for embedded buffers and local storage; Virtex‑E family features include configurable distributed RAM and block RAM options.
• I/O and Signaling  260 I/O pins support a wide range of interfaces; Virtex‑E family documentation describes high-performance SelectI/O+ technology and differential signalling support (LVDS, BLVDS, LVPECL).
• Clocking and Timing  Family-level clock management includes multiple digital DLLs and support for synthesized duty cycles and clock multiplication/division to manage high-speed clock domains.
• Configuration and Reprogramming  SRAM-based in-system configuration allows unlimited re-programmability for iterative development and field updates.
• Power and Supply  Core supply range 1.71 V to 1.89 V; device designed within the Virtex‑E 1.8 V family architecture.
• Package and Mounting  352-LBGA exposed pad, metal package (supplier package: 352-MBGA 35×35) for surface-mount PCB assembly and thermal conduction.
• Industrial Operating Range  Qualified for industrial temperatures from –40 °C to 100 °C.

Typical Applications

• High-speed system interfaces  Use in designs that require flexible bus bridging and protocol adaptation, leveraging Virtex‑E family PCI compliance and high-performance I/O signaling.
• Memory interface and controllers  Embedded RAM and family-level SelectRAM+ features support designs that interface to external SRAMs and SDRAMs or require internal buffering.
• Differential signalling and data acquisition  Suitable for designs using LVDS/BLVDS/LVPECL for high-rate data capture and distribution across board-level systems.
• Industrial control and processing  Industrial operating temperature range and reprogrammability make the device suitable for industrial automation, motor control logic and factory equipment controllers.

Unique Advantages

• Reprogrammable FPGA architecture: SRAM-based configuration enables rapid iteration and field updates without hardware changes.
• Balanced logic and memory: 6,912 logic elements paired with on-chip RAM provide local processing and buffering to reduce external memory dependence.
• Substantial I/O capacity: 260 I/Os support complex interfacing needs and multiple parallel or differential channels on a single device.
• Industrial-rated operation: Specified for –40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compatible packaging for thermal management: 352-LBGA exposed pad metal package aids board-level thermal conduction for reliable operation.
• Vendor-backed family features: Leverages Virtex‑E family capabilities—high-speed I/O standards, clock DLLs and memory hierarchy—to address system-level performance demands.

Why Choose XCV300E-7BG352I?

The XCV300E-7BG352I combines a mid-range logic fabric, embedded RAM and extensive I/O in a robust industrial-grade package, making it a practical choice for designers who need reprogrammable logic with substantial interfacing capability. Its family-level features for high-speed differential signaling, clock management and memory support help reduce system complexity where high-throughput interfaces and flexible timing are required.

This part is suitable for engineering teams building industrial controls, interface bridges, data-acquisition front ends and other systems that require field reconfigurability, a wide operating temperature range and a compact BGA package for moderate-density designs.

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